公开(公告)号：US20110082581A1

公开(公告)日：2011-04-07

申请号：US12897111

申请日：2010-10-04

申请人： Yukio OZAKI ,  Satoru TAKAHATA ,  Ichiro NUNOMURA

发明人： Yukio OZAKI ,  Satoru TAKAHATA ,  Ichiro NUNOMURA

IPC分类号： G06F19/00

CPC分类号： H01L21/67276

摘要： To perform a maintenance work safely by a maintenance engineer, even if the maintenance work is performed with power of a substrate processing apparatus turned-on. A substrate processing apparatus, comprising: a controller that inhibits a shift from an idling state to a standby state, when a generation of a prescribed event is detected; the controller further comprising: a shift indicating part that controls an apparatus state so as to be shifted from the idling state possible to receive an indication of execution of the recipe, being an apparatus state possible to step into the substrate processing apparatus, to the standby state possible to execute a recipe, being an apparatus state impossible to step into the substrate processing apparatus; and an event detection part that detects a generation of the prescribed event for inhibiting a shift from the idling state to the standby state and notifies the shift indicating part of the prescribed event.

摘要翻译： 为了维护工程人员进行维护工作，即使维护工作是在打开基板处理装置的电源的情况下执行的。 一种基板处理装置，包括：当检测到规定事件的产生时，禁止从怠速状态向待机状态的转移的控制器; 所述控制器还包括：移动指示部，其控制装置状态以从所述怠速状态转移，以接收所述配方的执行指示，作为可能进入所述基板处理装置的装置状态到所述待机 状态可以执行配方，作为不可能进入基板处理装置的装置状态; 以及事件检测部，其检测用于禁止从空转状态向待机状态的转换的规定事件的生成，并通知规定事件的换档指示部。

公开(公告)号：US20100144145A1

公开(公告)日：2010-06-10

申请号：US12631152

申请日：2009-12-04

申请人： Satoru TAKAHATA ,  Yukio OZAKI ,  Reizo NUNOZAWA

发明人： Satoru TAKAHATA ,  Yukio OZAKI ,  Reizo NUNOZAWA

IPC分类号： H01L21/203 ,  B05C11/00

CPC分类号： H01L21/67276 ,  C23C16/52 ,  C23C16/54 ,  G05B19/4063 ,  G05B19/41875 ,  G05B2219/31437 ,  G05B2219/45031 ,  Y02P90/14 ,  Y02P90/18 ,  Y02P90/20 ,  Y02P90/22

摘要： When a step is delayed, an operator can be rapidly informed of the delay. A substrate processing apparatus comprises a process system configured to process a substrate, a control unit configured to control the process system for performing a plurality of steps, and a manipulation unit configured to monitor progresses of the steps. While the control unit waits for completion of a predetermined one of the steps after the control unit controls the process system to start the predetermined step, if a time elapsing from the start of the predetermined step exceeds an allowable time previously allocated to each of the steps, the control unit transmits an alarm message to the manipulation unit so as to report that the allowable time is exceeded.

摘要翻译： 当一个步骤被延迟时，可以迅速地通知操作者延迟。 基板处理装置包括被配置为处理基板的处理系统，被配置为控制用于执行多个步骤的处理系统的控制单元和被配置为监视步骤的进行的操作单元。 当控制单元在控制单元控制处理系统开始预定步骤之后等待完成预定的一个步骤时，如果从预定步骤的开始经过的时间超过先前分配给每个步骤的允许时间 控制单元向操作单元发送报警信息，以报告超过允许时间。

公开(公告)号：US20080087708A1

公开(公告)日：2008-04-17

申请号：US11948442

申请日：2007-11-30

申请人： Yukio OZAKI ,  Toshinori Kasuga

发明人： Yukio OZAKI ,  Toshinori Kasuga

IPC分类号： B23K20/10

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L2224/75 ,  H01L2224/75355 ,  H01L2224/81121 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082

摘要： A resonator is disclosed that may includes a vibrating member holding an electronic component and applying a vibration to the electronic component, and a depressing member applying a depressing force for a side of a substrate to the electronic component through the vibrating member. The depressing member includes leg portions which are disposed so as to leave spaces between the leg portions and both side faces of the vibrating member parallel with a vibration direction, and supporting portions through which the leg portions and the side faces of the vibrating member are to be coupled to each other. With respect to a size of a cross section of each of the supporting portions parallel with the side face of the vibrating member, a length L2 along the vibration direction A of the vibrating member is shorter than a length L1 along a depressing direction B of the depressing member.

摘要翻译： 公开了一种谐振器，其可以包括保持电子部件并且向电子部件施加振动的振动部件，以及通过振动部件向基板的一侧施加用于电子部件的按压力的按压部件。 所述按压部件包括腿部，所述腿部设置成在振动部件的腿部与振动部件的两个侧面之间留有空间，与振动方向平行，以及支撑部，腿部和振动部件的侧面通过该支撑部 互相耦合。 对于与振动部件的侧面平行的各支撑部的截面尺寸，沿着振动部件的振动方向A的长度L 2比沿着按压方向B的长度L 1短 的按压构件。

公开(公告)号：US20100006621A1

公开(公告)日：2010-01-14

申请号：US12564431

申请日：2009-09-22

申请人： Yasuyuki MASUDA ,  Yukio OZAKI ,  Jun MATSUEDA ,  Kazuyuki IKURA ,  Taizan KOBAYASHI ,  Toshinori KASUGA

发明人： Yasuyuki MASUDA ,  Yukio OZAKI ,  Jun MATSUEDA ,  Kazuyuki IKURA ,  Taizan KOBAYASHI ,  Toshinori KASUGA

IPC分类号： B23K3/00 ,  B23K20/10

CPC分类号： B23K20/10 ,  B23K2101/36 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/757 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/0401

摘要： An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.

摘要翻译： 一种用于制造电子装置的超声波接合装置，其包括填充在电子部件和基板之间的基板，电子部件和底部填充物，包括：头部，其包括构造成安装电子部件的工具表面;擦拭单元，其被配置为擦拭 通过在擦拭台上使用擦拭部件，将附着在头部的工具表面上的预固化底部填充物，超声波接合单元构造成将电子部件与基板超声波接合并将头部抵靠擦拭部件按压在 所述擦拭台被配置为当所述擦拭单元提供擦拭时检测施加在所述擦拭台上的擦拭构件和所述工具表面之间的第一压力;以及控制器，被配置为基于所述擦拭台控制由所述超声波接合单元施加的第二压力， 检测器的检测结果。

公开(公告)号：US20110240059A1

公开(公告)日：2011-10-06

申请号：US13073328

申请日：2011-03-28

申请人： Yukio OZAKI ,  Michinao Nomura ,  Mitsuo Takeuchi ,  Toshinori Kasuga

发明人： Yukio OZAKI ,  Michinao Nomura ,  Mitsuo Takeuchi ,  Toshinori Kasuga

IPC分类号： B08B3/00

CPC分类号： B08B3/12 ,  B08B2203/0229

摘要： A cleaning apparatus includes a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned, an agitator to induce agitation in the cleaning solution supplied to the object, an oscillating unit to oscillate the agitator, a drive unit to move any one of the object and the agitator so as to change a clearance between the object and the agitator, a detection unit to detect impedance of the oscillator, and a control unit to control the clearance by controlling the drive unit based on the impedance.

摘要翻译： 清洁装置包括供给单元，该供给单元至少将初始量的清洗液供给到待清洗物体的特定部位，搅拌器，在供给到被检体的清洗液中引起搅动，振荡单元使振动器振荡， 用于移动物体和搅拌器中的任何一个以驱动物体和搅拌器之间的间隙的驱动单元，用于检测振荡器的阻抗的检测单元以及通过控制驱动单元来控制间隙的控制单元 阻抗。

公开(公告)号：US20100038406A1

公开(公告)日：2010-02-18

申请号：US12564423

申请日：2009-09-22

申请人： Yasuyuki MASUDA ,  Yukio OZAKI ,  Jun MATSUEDA ,  Kazuyuki IKURA ,  Taizan KOBAYASHI ,  Toshinori KASUGA

发明人： Yasuyuki MASUDA ,  Yukio OZAKI ,  Jun MATSUEDA ,  Kazuyuki IKURA ,  Taizan KOBAYASHI ,  Toshinori KASUGA

IPC分类号： B23K1/06

CPC分类号： H01L24/75 ,  H01L24/12 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/0665 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.

摘要翻译： 超声波接合装置包括超声波接合单元和擦拭单元，其被构造成通过使用擦拭构件来擦拭已经粘附到头部的工具表面的预固化底部填充物。 超声波接合单元包括：第一驱动器，被配置为驱动头部将基板上的电子部件按压，以及超声波发生器。 擦拭单元包括用于擦除工具表面的擦拭台，用于将擦拭构件供给到擦拭台并卷起擦拭构件的进给机构，构造成容纳擦拭台和进给机构的盒，以及 第二驱动器，其被配置为在所述平面内驱动所述盒。 第一个驱动器被配置为将头部压在擦拭台上的擦拭构件上。

公开(公告)号：US20100006231A1

公开(公告)日：2010-01-14

申请号：US12564444

申请日：2009-09-22

申请人： Yasuyuki MASUDA ,  Yukio OZAKI ,  Jun MATSUEDA ,  Kazuyuki IKURA ,  Taizan KOBAYASHI ,  Toshinori KASUGA

发明人： Yasuyuki MASUDA ,  Yukio OZAKI ,  Jun MATSUEDA ,  Kazuyuki IKURA ,  Taizan KOBAYASHI ,  Toshinori KASUGA

IPC分类号： B32B37/00

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/757 ,  H01L2224/7592 ,  H01L2224/81121 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/0401

摘要： An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.

摘要翻译： 一种超声波接合装置，包括：头部，其包括被配置为安装电子部件的工具表面;超声波接合单元，其被配置为使所述电子部件与基板超声波结合;以及擦拭单元，其构造成擦除已经粘附到所述电子部件上的预固化底部填充物 通过在擦拭台上使用擦拭构件来使头部的工具表面。 擦拭单元包括：溶剂供给单元，被配置为将构成为将底部填充剂粉末化的溶剂供给到擦拭台上的擦拭部件;被配置为容纳擦拭台的密封盒;以及供给机构，其构造成将擦拭部件供给到擦拭部 并且从擦拭台卷起擦拭构件，以及盒支撑构件，其包括构造成驱动进给机构的马达，并且可拆卸地附接到卡盘。