Method and apparatus for qualitatively analyzing high-molecular additives in metal plating solution
    1.
    发明授权
    Method and apparatus for qualitatively analyzing high-molecular additives in metal plating solution 有权
    在金属电镀液中定性分析高分子添加剂的方法和装置

    公开(公告)号:US07781731B2

    公开(公告)日:2010-08-24

    申请号:US12216250

    申请日:2008-07-01

    IPC分类号: H01J49/00

    CPC分类号: C25D21/12 Y10T436/13

    摘要: Disclosed herein is a method of qualitatively analyzing high-molecular additives in a metal plating solution, including: removing sulfate ions and metal ions from a metal plating solution; and qualitatively analyzing the metal plating solution, from which sulfate ions and metal ions are removed, using Matrix-Assisted Laser Desorption/Ionization Time-Of-Flight Mass Spectroscopy (MALDI-TOF MS). The method is advantageous in that the structure and molecular weight of high-molecular additives present in very small amounts in a plating solution can be accurately measured while maintaining the specific structure and molecular weight thereof without degrading the high-molecular additives.

    摘要翻译: 本发明公开了一种在金属电镀液中定性分析高分子添加剂的方法,包括:从金属电镀液中除去硫酸根离子和金属离子; 并使用矩阵辅助激光解吸/电离飞行时间质谱(MALDI-TOF MS)定性分析去除了硫酸根离子和金属离子的金属电镀液。 该方法的优点在于,可以在保持其特定结构和分子量的同时不会降低高分子添加剂而精确地测量电镀溶液中以非常少的量存在的高分子添加剂的结构和分子量。

    Method and apparatus for qualitatively analyzing high-molecular additives in metal plating solution
    2.
    发明申请
    Method and apparatus for qualitatively analyzing high-molecular additives in metal plating solution 有权
    在金属电镀液中定性分析高分子添加剂的方法和装置

    公开(公告)号:US20090278041A1

    公开(公告)日:2009-11-12

    申请号:US12216250

    申请日:2008-07-01

    IPC分类号: B01D59/44

    CPC分类号: C25D21/12 Y10T436/13

    摘要: Disclosed herein is a method of qualitatively analyzing high-molecular additives in a metal plating solution, including: removing sulfate ions and metal ions from a metal plating solution; and qualitatively analyzing the metal plating solution, from which sulfate ions and metal ions are removed, using Matrix-Assisted Laser Desorption/Ionization Time-Of-Flight Mass Spectroscopy (MALDI-TOF MS). The method is advantageous in that the structure and molecular weight of high-molecular additives present in very small amounts in a plating solution can be accurately measured while maintaining the specific structure and molecular weight thereof without degrading the high-molecular additives.

    摘要翻译: 本发明公开了一种在金属电镀液中定性分析高分子添加剂的方法,包括:从金属电镀液中除去硫酸根离子和金属离子; 并使用矩阵辅助激光解吸/电离飞行时间质谱(MALDI-TOF MS)定性分析去除了硫酸根离子和金属离子的金属电镀液。 该方法的优点在于,可以在保持其特定结构和分子量的同时不会降低高分子添加剂而精确地测量电镀溶液中以非常少的量存在的高分子添加剂的结构和分子量。