公开(公告)号：US20100055393A1

公开(公告)日：2010-03-04

申请号：US12467542

申请日：2009-05-18

申请人： Yun Hwi PARK ,  Bong Gyun Kim ,  Yoon Hyuck Choi

发明人： Yun Hwi PARK ,  Bong Gyun Kim ,  Yoon Hyuck Choi

IPC分类号： B32B3/10

CPC分类号： H05K3/4061 ,  H05K1/0242 ,  H05K3/4629 ,  H05K2201/0269 ,  H05K2201/096 ,  H05K2203/082 ,  Y10T428/24322 ,  Y10T428/24926

摘要： There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material.

摘要翻译： 提供了一种包括能够防止导电性和信号损失的双层结构的导电通孔的多层陶瓷基板。 多层陶瓷基板包括：多个电介质层; 以及形成在所述电介质层的至少一部分上的电路图形部分，所述电路图形部分包括至少一个导电通路和导电图案，其中所述至少一个导电通孔包括外周部分和内周部分， 沿着贯穿电介质层的通路孔的内壁形成的周边部分，并且由包含金属的第一导电材料形成，并且内周部分填充在外周部分中，并由具有收缩起始温度的第二导电材料形成 高于第一导电材料的收缩起始温度。

公开(公告)号：US08053682B2

公开(公告)日：2011-11-08

申请号：US12467542

申请日：2009-05-18

申请人： Yun Hwi Park ,  Bong Gyun Kim ,  Yoon Hyuck Choi

发明人： Yun Hwi Park ,  Bong Gyun Kim ,  Yoon Hyuck Choi

IPC分类号： H05K1/11

CPC分类号： H05K3/4061 ,  H05K1/0242 ,  H05K3/4629 ,  H05K2201/0269 ,  H05K2201/096 ,  H05K2203/082 ,  Y10T428/24322 ,  Y10T428/24926

摘要： There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material.

摘要翻译： 提供了一种包括能够防止导电性和信号损失的双层结构的导电通孔的多层陶瓷基板。 多层陶瓷基板包括：多个电介质层; 以及形成在所述电介质层的至少一部分上的电路图形部分，所述电路图形部分包括至少一个导电通路和导电图案，其中所述至少一个导电通孔包括外周部分和内周部分， 沿着贯穿电介质层的通路孔的内壁形成的周边部分，并且由包含金属的第一导电材料形成，并且内周部分填充在外周部分中，并由具有收缩起始温度的第二导电材料形成 高于第一导电材料的收缩起始温度。

公开(公告)号：US20120013360A1

公开(公告)日：2012-01-19

申请号：US12926802

申请日：2010-12-09

申请人： Kwang Jae Oh ,  Joo Yong Kim ,  Yoon Hyuck Choi ,  Bong Gyun Kim

发明人： Kwang Jae Oh ,  Joo Yong Kim ,  Yoon Hyuck Choi ,  Bong Gyun Kim

IPC分类号： G01R31/28 ,  H05K3/00

CPC分类号： G01R3/00 ,  G01R1/07378 ,  H05K1/0292 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/107 ,  H05K3/225 ,  H05K3/4629 ,  H05K2201/0979 ,  H05K2201/10378 ,  H05K2203/173

摘要： There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.

摘要翻译： 提供了一种修复探针卡和修理的探针板的方法。 修补探针卡的方法包括：在由具有设置在彼此相对的位置的第一和第二柱面的烧结陶瓷构成的板主体中，准备板主体，其包括多个主通道，用于电连接形成的第一焊盘 在第一柱面上，形成在第二柱面上的第二焊盘，以及设置成邻近主通道的保留通道，以修复损坏的主通道; 当主渠道受损时; 去除在主通道和预留通道中形成的第一和第二焊盘; 通过在损坏的主通道和与主通道相邻的预留通道之间部分地去除板来形成空腔; 以及在空腔中形成修复连接部分，以便将损坏的主通道电连接到与其相邻的预留通道。

公开(公告)号：US08692136B2

公开(公告)日：2014-04-08

申请号：US12926802

申请日：2010-12-09

申请人： Kwang Jae Oh ,  Joo Yong Kim ,  Yoon Hyuck Choi ,  Bong Gyun Kim

发明人： Kwang Jae Oh ,  Joo Yong Kim ,  Yoon Hyuck Choi ,  Bong Gyun Kim

IPC分类号： H05K1/11

CPC分类号： G01R3/00 ,  G01R1/07378 ,  H05K1/0292 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/107 ,  H05K3/225 ,  H05K3/4629 ,  H05K2201/0979 ,  H05K2201/10378 ,  H05K2203/173

摘要： There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.

摘要翻译： 提供了一种修复探针卡和修理的探针板的方法。 修补探针卡的方法包括：在由具有设置在彼此相对的位置的第一和第二柱面的烧结陶瓷构成的板主体中，准备板主体，其包括多个主通道，用于电连接形成的第一焊盘 在第一柱面上，形成在第二柱面上的第二焊盘，以及设置成邻近主通道的保留通道，以修复损坏的主通道; 当主渠道受损时; 去除在主通道和预留通道中形成的第一和第二焊盘; 通过在损坏的主通道和与主通道相邻的预留通道之间部分地去除板来形成空腔; 以及在空腔中形成修复连接部分，以便将损坏的主通道电连接到与其相邻的预留通道。

公开(公告)号：US08183473B2

公开(公告)日：2012-05-22

申请号：US12591408

申请日：2009-11-18

申请人： Gyu Man Hwang ,  Dae Hyeong Lee ,  Bong Gyun Kim

发明人： Gyu Man Hwang ,  Dae Hyeong Lee ,  Bong Gyun Kim

IPC分类号： H05K7/02

CPC分类号： H05K5/0026 ,  H01L2224/48091 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/0061 ,  H05K2201/105 ,  H05K2203/049 ,  H01L2924/00014

摘要： Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.

摘要翻译： 公开了一种用于电动转向（EPS）系统中的电子控制单元（ECU）的电气设备的电力包，该电力包装包括：壳体，其形成有上部和下部，并形成为 在两个阶段的结构中，其中衬底层设置在每个上部和下部上; 印刷电路板（PCB）层，其设置在壳体的下部并且具有形成在其上的路线以流动电流; 并且设置在壳体的上部的LTCC层通过引线接合连接到PCB层，并且由低温共烧陶瓷形成。 用于电气设备的功率封装可以扩展PCB和LTCC层的面积，从而提高PCB和LTCC层的自由度设计，并减小整个外壳的尺寸。

公开(公告)号：US07605808B2

公开(公告)日：2009-10-20

申请号：US10942052

申请日：2004-09-16

申请人： Nam Kyu Lee ,  Bong Gyun Kim ,  Bong Hwan Kwon ,  Jang Hwan Cho

发明人： Nam Kyu Lee ,  Bong Gyun Kim ,  Bong Hwan Kwon ,  Jang Hwan Cho

IPC分类号： G09G5/00

CPC分类号： G09G3/2965

摘要： Disclosed are an energy recovery apparatus and method for a plasma display panel. The energy recovery apparatus includes a sustain voltage source for supplying a sustain voltage, a panel capacitor formed equivalently at a discharge cell, a first charging circuit for forming a first charging path when one side of the panel capacitor is charged, a second charging circuit for forming a second charging path when the other side of the panel capacitor is charged, a first power circuit for supplying the sustain voltage to the panel capacitor and forming the first charging path, and a second power circuit for supplying a ground voltage generated from a ground voltage source to the panel capacitor and forming the second charging path. The energy recovery apparatus and method according to the present invention can decrease components in number and reduce power consumption and manufacturing cost by charging the other side of the panel capacitor using a charging voltage of one side of the panel capacitor.

摘要翻译： 公开了一种用于等离子体显示面板的能量回收装置和方法。 能量回收装置包括用于提供维持电压的维持电压源，在放电单元等效地形成的面板电容器，用于在面板电容器的一侧被充电时形成第一充电路径的第一充电电路;第二充电电路， 当面板电容器的另一侧被充电时，形成第二充电路径，用于向面板电容器提供维持电压并形成第一充电路径的第一电源电路和用于提供从地面产生的接地电压的第二电源电路 电压源到面板电容器并形成第二充电路径。 根据本发明的能量回收装置和方法可以通过面板电容器的一侧的充电电压对面板电容器的另一侧进行充电来减少数量的部件并降低功耗和制造成本。

公开(公告)号：US07151360B2

公开(公告)日：2006-12-19

申请号：US10893267

申请日：2004-07-19

申请人： Bong Gyun Kim ,  Nam Kyu Lee ,  Hee Duk Oh

发明人： Bong Gyun Kim ,  Nam Kyu Lee ,  Hee Duk Oh

IPC分类号： G05F1/10

CPC分类号： H02M1/4225 ,  H02M1/4258 ,  Y02B70/126

摘要： A power supply for power factor correction and a driving method thereof wherein a ripple current of a power factor correction circuit (PFC) can be reduced to enhance a power factor and an efficiency. In the power supply, a power factor correction circuit corrects a power factor of a AC voltage supplied from an AC voltage source using a switching device to convert it to a DC voltage. A DC to DC converter converts said DC voltage from the power factor correction circuit into a desired DC voltage. A controller controls the switching device in accordance with an input voltage inputted to the power factor correction circuit to vary an output voltage of the power factor correction circuit.

摘要翻译： 一种用于功率因数校正的电源及其驱动方法，其中可以降低功率因数校正电路（PFC）的纹波电流以增强功率因数和效率。 在电源中，功率因数校正电路使用开关器件校正从AC电压源提供的AC电压的功率因数，将其转换为DC电压。 DC-DC转换器将来自功率因数校正电路的所述直流电压转换成期望的直流电压。 控制器根据输入到功率因数校正电路的输入电压来控制开关装置，以改变功率因数校正电路的输出电压。

公开(公告)号：US20110061929A1

公开(公告)日：2011-03-17

申请号：US12591408

申请日：2009-11-18

申请人： Gyu Man Hwang ,  Dae Hyeong Lee ,  Bong Gyun Kim

发明人： Gyu Man Hwang ,  Dae Hyeong Lee ,  Bong Gyun Kim

IPC分类号： H05K5/00

CPC分类号： H05K5/0026 ,  H01L2224/48091 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/0061 ,  H05K2201/105 ,  H05K2203/049 ,  H01L2924/00014

摘要： Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.

摘要翻译： 公开了一种用于电动转向（EPS）系统中的电子控制单元（ECU）的电气设备的电力包，该电力包装包括：壳体，其形成有上部和下部，并形成为 在两个阶段的结构中，其中衬底层设置在每个上部和下部上; 印刷电路板（PCB）层，其设置在壳体的下部并且具有形成在其上的路线以流动电流; 并且设置在壳体的上部的LTCC层通过引线接合连接到PCB层，并且由低温共烧陶瓷形成。 用于电气设备的功率封装可以扩展PCB和LTCC层的面积，从而提高PCB和LTCC层的自由度设计，并减小整个外壳的尺寸。