Ratchet wrench
    1.
    发明授权

    公开(公告)号:US11345012B2

    公开(公告)日:2022-05-31

    申请号:US16695908

    申请日:2019-11-26

    IPC分类号: B25G1/08 B25B13/46

    摘要: A ratchet wrench is provided, including: a main body and a handling assembly. The main body includes a head portion being assembled with a ratchet head and a handling portion remote from the head portion. The handling assembly includes a casing coveringly disposed on the handling portion, and the casing defines a receiving space which is configured to receive at least one object and has at least one opening disposed therethrough. Part of an outer surface of the handling portion is flush with or protrusive beyond the at least one opening, and a material of the handling portion is different from a material of the casing.

    Utility knife
    2.
    发明授权

    公开(公告)号:US11413773B1

    公开(公告)日:2022-08-16

    申请号:US17156070

    申请日:2021-01-22

    IPC分类号: B26B5/00 B26B1/08

    摘要: A utility knife is provided, including: a housing, including first and second compartments; a blade holder, movably received within the first compartment; a blade storing carrier, detachably inserted in the second compartment, including a receiving portion for receiving at least one spare blade; an elastic unit, disposed between the housing and the blade storing carrier; and a locking mechanism, including a base body disposed to the housing, a movable member attached to the base body and movable between locking and release positions, a first engaging member disposed on the movable member and a second engaging member disposed on the receiving portion and releasably engagable with the first engaging member, when the is second engaging member is disengaged from the second engaging member, the elastic unit biases the receiving portion to eject the blade storing carrier.

    Utility knife
    4.
    发明授权

    公开(公告)号:US11571825B2

    公开(公告)日:2023-02-07

    申请号:US17117725

    申请日:2020-12-10

    IPC分类号: B26B5/00 B25G1/08

    摘要: A utility knife is provided, including: a housing, defining an operation compartment and a storage compartment; a blade holder, movably received within the operation compartment; a blade storing carrier, movably received within the storage compartment, including a receiving portion for receiving at least one spare blade and a grip portion; and a locking mechanism, including a base body, a movable member, a first engaging member and a second engaging member, the base body being disposed to the housing, the movable member being attached to the base body and movable between a locking position and a release position, the first engaging member being disposed on and movable with the movable member, the first engaging member and the second engaging member are releasably engaged with each other so that the blade storing carrier is detachable from the housing.

    Method for forming radio frequency identification tag on packing bag and device therefor
    6.
    发明授权
    Method for forming radio frequency identification tag on packing bag and device therefor 有权
    在包装袋上形成射频识别标签的方法及其装置

    公开(公告)号:US07854245B2

    公开(公告)日:2010-12-21

    申请号:US12232408

    申请日:2008-09-17

    申请人: Yung-Shun Chen

    发明人: Yung-Shun Chen

    IPC分类号: B65B9/02 B65B9/06 B29C65/02

    摘要: A method for forming a radio frequency identification (RFID) tag on a packing bag is disclosed and includes the steps of: equidistantly attaching RFID tags to a release film, one by one, to form a roll of tag web; installing the roll of tag web in a packing bag forming device to move the release film along a feeding direction of a packing material; changing a moving direction of the release film for peeling the RFID tags from the release film; intermittently pressing on the RFID tags for attaching the RFID tags to the packing material; bonding the RFID tags to the packing material with a melting technology; and processing the packing material by folding, sealing, and cutting to form packing bags securely installed with the RFID tags. A packing bag forming device for carrying out the method is also disclosed.

    摘要翻译: 公开了一种在包装袋上形成射频识别(RFID)标签的方法,包括以下步骤:将RFID标签一个一个地等离子地安装到剥离膜上,形成一卷标签网; 将卷筒纸卷装在包装袋形成装置中,沿着包装材料的进给方向移动隔离膜; 改变用于剥离RFID标签的脱模膜的移动方向; 间歇地按压RFID标签以将RFID标签附着到包装材料上; 用熔化技术将RFID标签粘合到包装材料上; 并通过折叠,密封和切割来处理包装材料,以形成安装有RFID标签的包装袋。 还公开了一种用于实施该方法的包装袋形成装置。

    Method for forming radio frequency identification tag on packing bag and device therefor
    7.
    发明申请
    Method for forming radio frequency identification tag on packing bag and device therefor 有权
    在包装袋上形成射频识别标签的方法及其装置

    公开(公告)号:US20090126861A1

    公开(公告)日:2009-05-21

    申请号:US12232408

    申请日:2008-09-17

    申请人: Yung-Shun Chen

    发明人: Yung-Shun Chen

    IPC分类号: B65H75/34

    摘要: A method for forming a radio frequency identification (RFID) tag on a packing bag is disclosed and includes the steps of: equidistantly attaching RFID tags to a release film, one by one, to form a roll of tag web; installing the roll of tag web in a packing bag forming device to move the release film along a feeding direction of a packing material; changing a moving direction of the release film for peeling the RFID tags from the release film; intermittently pressing on the RFID tags for attaching the RFID tags to the packing material; bonding the RFID tags to the packing material with a melting technology; and processing the packing material by folding, sealing, and cutting to form packing bags securely installed with the RFID tags. A packing bag forming device for carrying out the method is also disclosed.

    摘要翻译: 公开了一种在包装袋上形成射频识别(RFID)标签的方法,包括以下步骤:将RFID标签一个一个地等离子地安装到剥离膜上,形成一卷标签网; 将卷筒纸卷装在包装袋形成装置中,沿着包装材料的进给方向移动隔离膜; 改变用于剥离RFID标签的脱模膜的移动方向; 间歇地按压RFID标签以将RFID标签附着到包装材料上; 用熔化技术将RFID标签粘合到包装材料上; 并通过折叠,密封和切割来处理包装材料,以形成安装有RFID标签的包装袋。 还公开了一种用于实施该方法的包装袋形成装置。

    METHOD OF FABRICATING SEMICONDUCTOR DEVICE
    8.
    发明申请
    METHOD OF FABRICATING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20080268602A1

    公开(公告)日:2008-10-30

    申请号:US12013528

    申请日:2008-01-14

    IPC分类号: H01L21/336 H01L21/28

    摘要: A method of fabricating a semiconductor device is disclosed. The method of fabricating a semiconductor device provides a semiconductor substrate; forming a gate stack overlying the semiconductor substrate; forming spacers each having a first inner spacer and a second outer spacer on sidewalls of the gate stack; forming a protective layer on sidewalls of the spacers, covering a part of the semiconductor substrate, wherein an etching selectivity of the protective layer is higher than that of the first inner spacer.

    摘要翻译: 公开了制造半导体器件的方法。 制造半导体器件的方法提供半导体衬底; 形成覆盖在半导体衬底上的栅叠层; 每个在所述栅极叠层的侧壁上具有第一内隔离物和第二外隔离物的隔离物; 在所述间隔物的侧壁上形成保护层,覆盖所述半导体衬底的一部分,其中所述保护层的蚀刻选择性高于所述第一内衬垫的蚀刻选择性。