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27 条记录 (耗时 0.017 秒)

    Poly-load resistor for SRAM cell
    2.
    发明授权
    Poly-load resistor for SRAM cell 失效
    SRAM单元的多负载电阻

    公开(公告)号：US5885862A

    公开(公告)日：1999-03-23

    申请号：US81399

    申请日：1998-05-19

    申请人： Kuo-Hao Jao ,  Yung-Shun Chen

    发明人： Kuo-Hao Jao ,  Yung-Shun Chen

    IPC分类号： H01L21/8244 ,  H01L27/11 ,  H01L21/70

    CPC分类号： H01L27/11 ,  H01L27/1112

    摘要： The inventive SRAM cell has a poly-load resistor which comprises a thick supply voltage (Vcc) interconnect, a thick driver interconnect on a thin load resistance region which is electrically connected to both interconnects. The novel poly-load resistor overcomes the problem of lateral diffusion from the interconnect regions into the load region. The resulting SRAM cell has a low Vcc interconnect resistance.

    摘要翻译： 本发明的SRAM单元具有多负载电阻，其包括厚电源电压（Vcc）互连，薄电阻连接到两个互连的薄负载电阻区上的厚驱动器互连。 新型多负载电阻器克服了从互连区域向负载区域的横向扩散的问题。 所得到的SRAM单元具有低Vcc互连电阻。

    Ratchet wrench
    4.
    发明授权
    Ratchet wrench 有权

    公开(公告)号：US11345012B2

    公开(公告)日：2022-05-31

    申请号：US16695908

    申请日：2019-11-26

    申请人： Yung-Shun Chen ,  Cheng-Chou Wu

    发明人： Yung-Shun Chen ,  Cheng-Chou Wu

    IPC分类号： B25G1/08 ,  B25B13/46

    摘要： A ratchet wrench is provided, including: a main body and a handling assembly. The main body includes a head portion being assembled with a ratchet head and a handling portion remote from the head portion. The handling assembly includes a casing coveringly disposed on the handling portion, and the casing defines a receiving space which is configured to receive at least one object and has at least one opening disposed therethrough. Part of an outer surface of the handling portion is flush with or protrusive beyond the at least one opening, and a material of the handling portion is different from a material of the casing.

    Method for forming radio frequency identification tag on packing bag and device therefor
    5.
    发明授权
    Method for forming radio frequency identification tag on packing bag and device therefor 有权
    在包装袋上形成射频识别标签的方法及其装置

    公开(公告)号：US07854245B2

    公开(公告)日：2010-12-21

    申请号：US12232408

    申请日：2008-09-17

    申请人： Yung-Shun Chen

    发明人： Yung-Shun Chen

    IPC分类号： B65B9/02 ,  B65B9/06 ,  B29C65/02

    CPC分类号： G06K19/07749 ,  G06K19/07718 ,  G06K19/07745 ,  H01L2924/0002 ,  Y10T156/1002 ,  Y10T156/171 ,  Y10T156/1715 ,  Y10T156/1734 ,  H01L2924/00

    摘要： A method for forming a radio frequency identification (RFID) tag on a packing bag is disclosed and includes the steps of: equidistantly attaching RFID tags to a release film, one by one, to form a roll of tag web; installing the roll of tag web in a packing bag forming device to move the release film along a feeding direction of a packing material; changing a moving direction of the release film for peeling the RFID tags from the release film; intermittently pressing on the RFID tags for attaching the RFID tags to the packing material; bonding the RFID tags to the packing material with a melting technology; and processing the packing material by folding, sealing, and cutting to form packing bags securely installed with the RFID tags. A packing bag forming device for carrying out the method is also disclosed.

    摘要翻译： 公开了一种在包装袋上形成射频识别（RFID）标签的方法，包括以下步骤：将RFID标签一个一个地等离子地安装到剥离膜上，形成一卷标签网; 将卷筒纸卷装在包装袋形成装置中，沿着包装材料的进给方向移动隔离膜; 改变用于剥离RFID标签的脱模膜的移动方向; 间歇地按压RFID标签以将RFID标签附着到包装材料上; 用熔化技术将RFID标签粘合到包装材料上; 并通过折叠，密封和切割来处理包装材料，以形成安装有RFID标签的包装袋。 还公开了一种用于实施该方法的包装袋形成装置。

    Method for forming radio frequency identification tag on packing bag and device therefor
    6.
    发明申请
    Method for forming radio frequency identification tag on packing bag and device therefor 有权
    在包装袋上形成射频识别标签的方法及其装置

    公开(公告)号：US20090126861A1

    公开(公告)日：2009-05-21

    申请号：US12232408

    申请日：2008-09-17

    申请人： Yung-Shun Chen

    发明人： Yung-Shun Chen

    IPC分类号： B65H75/34

    CPC分类号： G06K19/07749 ,  G06K19/07718 ,  G06K19/07745 ,  H01L2924/0002 ,  Y10T156/1002 ,  Y10T156/171 ,  Y10T156/1715 ,  Y10T156/1734 ,  H01L2924/00

    摘要： A method for forming a radio frequency identification (RFID) tag on a packing bag is disclosed and includes the steps of: equidistantly attaching RFID tags to a release film, one by one, to form a roll of tag web; installing the roll of tag web in a packing bag forming device to move the release film along a feeding direction of a packing material; changing a moving direction of the release film for peeling the RFID tags from the release film; intermittently pressing on the RFID tags for attaching the RFID tags to the packing material; bonding the RFID tags to the packing material with a melting technology; and processing the packing material by folding, sealing, and cutting to form packing bags securely installed with the RFID tags. A packing bag forming device for carrying out the method is also disclosed.

    摘要翻译： 公开了一种在包装袋上形成射频识别（RFID）标签的方法，包括以下步骤：将RFID标签一个一个地等离子地安装到剥离膜上，形成一卷标签网; 将卷筒纸卷装在包装袋形成装置中，沿着包装材料的进给方向移动隔离膜; 改变用于剥离RFID标签的脱模膜的移动方向; 间歇地按压RFID标签以将RFID标签附着到包装材料上; 用熔化技术将RFID标签粘合到包装材料上; 并通过折叠，密封和切割来处理包装材料，以形成安装有RFID标签的包装袋。 还公开了一种用于实施该方法的包装袋形成装置。

    METHOD OF FABRICATING SEMICONDUCTOR DEVICE
    7.
    发明申请
    METHOD OF FABRICATING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号：US20080268602A1

    公开(公告)日：2008-10-30

    申请号：US12013528

    申请日：2008-01-14

    申请人： Chien-Li Cheng ,  Sun-Jay Chang ,  Tung-Heng Hsieh ,  Yung-Shun Chen

    发明人： Chien-Li Cheng ,  Sun-Jay Chang ,  Tung-Heng Hsieh ,  Yung-Shun Chen

    IPC分类号： H01L21/336 ,  H01L21/28

    CPC分类号： H01L29/6656 ,  H01L29/665 ,  H01L29/6653

    摘要： A method of fabricating a semiconductor device is disclosed. The method of fabricating a semiconductor device provides a semiconductor substrate; forming a gate stack overlying the semiconductor substrate; forming spacers each having a first inner spacer and a second outer spacer on sidewalls of the gate stack; forming a protective layer on sidewalls of the spacers, covering a part of the semiconductor substrate, wherein an etching selectivity of the protective layer is higher than that of the first inner spacer.

    摘要翻译： 公开了制造半导体器件的方法。 制造半导体器件的方法提供半导体衬底; 形成覆盖在半导体衬底上的栅叠层; 每个在所述栅极叠层的侧壁上具有第一内隔离物和第二外隔离物的隔离物; 在所述间隔物的侧壁上形成保护层，覆盖所述半导体衬底的一部分，其中所述保护层的蚀刻选择性高于所述第一内衬垫的蚀刻选择性。

    Utility knife
    9.
    发明授权
    Utility knife 有权

    公开(公告)号：US11413773B1

    公开(公告)日：2022-08-16

    申请号：US17156070

    申请日：2021-01-22

    申请人： MING SHIN TOOLS CO., LTD. ,  Yung-Shun Chen ,  Cheng-Chou Wu

    发明人： Yung-Shun Chen ,  Cheng-Chou Wu

    IPC分类号： B26B5/00 ,  B26B1/08

    摘要： A utility knife is provided, including: a housing, including first and second compartments; a blade holder, movably received within the first compartment; a blade storing carrier, detachably inserted in the second compartment, including a receiving portion for receiving at least one spare blade; an elastic unit, disposed between the housing and the blade storing carrier; and a locking mechanism, including a base body disposed to the housing, a movable member attached to the base body and movable between locking and release positions, a first engaging member disposed on the movable member and a second engaging member disposed on the receiving portion and releasably engagable with the first engaging member, when the is second engaging member is disengaged from the second engaging member, the elastic unit biases the receiving portion to eject the blade storing carrier.

    Conductive antenna structure and method for making the same
    10.
    发明申请
    Conductive antenna structure and method for making the same 审中-公开
    导电天线结构及其制造方法

    公开(公告)号：US20070241966A1

    公开(公告)日：2007-10-18

    申请号：US11403887

    申请日：2006-04-14

    申请人： Yung-Shun Chen

    发明人： Yung-Shun Chen

    IPC分类号： H01Q1/38

    CPC分类号： H05K3/048 ,  H05K1/0393 ,  H05K2203/097

    摘要： A conductive antenna structure and method for making the same, wherein the method includes the following steps: (a) providing a plastic film substrate: (b) performing a rinsing coating material printing process to let the rinsing coating material position on the plastic film substrate and appear a predetermined antenna pattern; (c) performing an evaporating process for the plastic film substrate to provide a conductive layer thereon; (d) performing a rinsing process for the plastic film substrate to separate the rinsing coating material from the plastic film substrate and let the conductive layer position on the antenna pattern. Therefore, the conductive antenna structure made by the use of the above-mentioned method includes a plastic film substrate made of Polyethylene Terephthalate (PET) as well as a conductive antenna that is made of conductive material and is connected to the surface of the plastic film substrate, and has a predetermined first thickness.

    摘要翻译： 导电天线结构及其制造方法，其特征在于，包括以下步骤：（a）提供塑料薄膜基板;（b）进行冲洗涂料印刷工序，使冲洗涂料在塑料薄膜基材上的位置 并出现预定的天线图案; （c）对塑料薄膜基材进行蒸发处理以在其上提供导电层; （d）对塑料薄膜基材进行冲洗处理，以将漂洗涂料从塑料薄膜基材上分离出来，并使天线图案上的导电层位置。 因此，通过使用上述方法制造的导电天线结构包括由聚对苯二甲酸乙二醇酯（PET）制成的塑料膜基片以及由导电材料制成并连接到塑料膜表面的导电天线 基板，并且具有预定的第一厚度。