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    PROBE CARD
    1.
    发明申请
    PROBE CARD 审中-公开
    探针卡

    公开(公告)号：US20110043239A1

    公开(公告)日：2011-02-24

    申请号：US12922378

    申请日：2009-03-09

    申请人： Tadabumi Tomita ,  Yoshinori Hotta ,  Akio Uesugi ,  Yusuke Hatanaka

    发明人： Tadabumi Tomita ,  Yoshinori Hotta ,  Akio Uesugi ,  Yusuke Hatanaka

    IPC分类号： G01R31/00

    CPC分类号： G01R1/0735 ,  G01R3/00 ,  G01R31/2863 ,  H01R12/7076 ,  H01R12/7082 ,  H01R13/2414

    摘要： An object of the present invention is to provide a probe card which has good stability of the connection between testing electrodes and test electrodes even after exposure to high temperatures in the burn-in test, and is less susceptible to displacements in the positions of contact between the testing electrodes and conductive portions or between the conductive portions and probe needles or the test electrodes even after repeated use of the probe card. The probe card of the present invention is a probe card which includes a testing circuit board having the testing electrodes formed so as to correspond to the test electrodes and an anisotropic conductive member electrically connecting the test electrodes with the testing electrodes. The testing electrodes are formed so that at least ends of the testing electrodes protrude from a surface of the testing circuit board, and the anisotropic conductive member is a member which has an insulating base made of an anodized aluminum film having micropores therein and a plurality of conductive paths made of a conductive material, insulated from one another, and extending through the insulating base in a thickness direction of the insulating base.

    摘要翻译： 本发明的目的是提供一种探针卡，即使在老化试验中暴露于高温之后，测试电极和测试电极之间的连接也具有良好的稳定性，并且不太容易受到在 测试电极和导电部分，或者即使在重复使用探针卡之后，在导电部分和探针或测试电极之间。 本发明的探针卡是一种探针卡，其包括测试电路板，其具有形成为对应于测试电极的测试电极和将测试电极与测试电极电连接的各向异性导电部件。 测试电极形成为使得测试电极的至少一端从测试电路板的表面突出，并且各向异性导电构件是具有由其中具有微孔的阳极氧化铝膜制成的绝缘基底的构件，并且多个 由导电材料制成的导电路径彼此绝缘，并且在绝缘基底的厚度方向上延伸穿过绝缘基底。

    ANISOTROPIC CONDUCTIVE JOINT PACKAGE
    2.
    发明申请
    ANISOTROPIC CONDUCTIVE JOINT PACKAGE 有权
    ANISOTROPIC导电接头包

    公开(公告)号：US20100294547A1

    公开(公告)日：2010-11-25

    申请号：US12747128

    申请日：2008-12-01

    申请人： Yusuke Hatanaka ,  Yoshinori Hotta ,  Tadabumi Tomita

    发明人： Yusuke Hatanaka ,  Yoshinori Hotta ,  Tadabumi Tomita

    IPC分类号： H05K1/09 ,  H01R43/00

    CPC分类号： H01L23/5389 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R12/714 ,  Y10T29/49126 ,  Y10T29/4921 ,  Y10T428/24074 ,  Y10T428/24083 ,  Y10T428/24091 ,  Y10T428/24174 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249956 ,  H01L2924/00

    摘要： An anisotropic conductive joint package in which an anisotropic conductive film is joined to at least one conductive material selected from among the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), a tin oxide doped with indium (ITO), molybdenum (Mo), iron (Fe), palladium (Pd), beryllium (Be), and rhenium (Re). The package is characterized in that: the anisotropic conductive film has an insulating base and conductive paths composed of conductive members, insulated from one another, and extending through the insulating base in the direction of the thickness of the insulating base, one ends of the conductive paths are exposed from one side of the insulating base, the other ends are exposed from the other side, the density of the conductive paths is 3,000,000 pieces/mm2 or more, the insulating base is a structural body composed of an anodic oxide film of an aluminum substrate having micropores, and each micropore does not have a branch structure along the depth. The package can be used as an anisotropic conductive member of an electronic component of a semiconductor device or the like or a connector for inspection even if the structure has a much higher degree of integration realized by drastically improving the installation density of the conductive paths.

    摘要翻译： 一种各向异性导电接头封装，其中各向异性导电膜与至少一种选自金（Au），银（Ag），铜（Cu），铝（Al），镁（Mg） ，镍（Ni），掺有铟（ITO），钼（Mo），铁（Fe），钯（Pd），铍（Be）和铼（Re）的氧化锡。 封装的特征在于：各向异性导电膜具有绝缘基底和由导电构件构成的导电路径，彼此绝缘并且在绝缘基底的厚度方向上延伸穿过绝缘基底，导电的一端 路径从绝缘基体的一侧露出，另一端从另一侧露出，导电路径的密度为3,000,000个/ mm 2以上，绝缘基底是由阳极氧化膜 铝基板具有微孔，并且每个微孔不具有沿深度的分支结构。 该封装可以用作半导体器件等的电子部件的各向异性导电部件或用于检查的连接器，即使通过显着提高导电路径的安装密度而实现的结构具有高得多的集成度。

    Microstructure and method of manufacturing the same
    3.
    发明授权
    Microstructure and method of manufacturing the same 有权
    微结构及其制造方法

    公开(公告)号：US07722754B2

    公开(公告)日：2010-05-25

    申请号：US11808502

    申请日：2007-06-11

    申请人： Yusuke Hatanaka ,  Tadabumi Tomita ,  Yoshinori Hotta ,  Akio Uesugi

    发明人： Yusuke Hatanaka ,  Tadabumi Tomita ,  Yoshinori Hotta ,  Akio Uesugi

    IPC分类号： C25D11/06 ,  B32B3/26

    CPC分类号： C25D11/12 ,  C25D11/045 ,  C25D11/18 ,  Y10T428/249953

    摘要： A method of manufacturing a microstructure wherein an aluminum member having an aluminum substrate and a micropore-bearing anodized film present on a surface of the aluminum substrate is subjected at least to, in order, a pore-ordering treatment which involves performing one or more cycles of a step that includes a first film dissolution treatment for dissolving the anodized film until a barrier layer has a thickness of 3 to 50 nm, and an anodizing treatment which follows the first film dissolution treatment; and a second film dissolution treatment for dissolving the anodized film so that a ratio of a diameter of a micropore opening “a” to a micropore diameter at a height “a/2” from a micropore bottom “b” (a/b) is in a range of 0.9 to 1.1, whereby the microstructure having micropores formed on a surface thereof is obtained. The manufacturing method enables microstructures having an ordered array of pits to be obtained in a short period of time.

    摘要翻译： 一种制造微结构的方法，其中具有铝基板和存在于铝基板表面上的具有微孔阳极氧化膜的铝构件至少依次进行包括执行一个或多个循环的孔序处理 包括用于溶解阳极氧化膜直到阻挡层具有3至50nm的厚度的第一膜溶解处理和在第一膜溶解处理之后的阳极氧化处理的步骤; 以及用于溶解阳极化膜的第二膜溶解处理，使得微孔开口“a”的直径与微孔底部“b”（a / b）的高度“a / 2”处的微孔直径的比率为 在0.9〜1.1的范围内，由此得到其表面上形成微孔的微结构。 该制造方法能够在短时间内获得具有有序排列阵列的微结构。

    Anisotropically conductive member and method for producing the same
    4.
    发明授权
    Anisotropically conductive member and method for producing the same 有权
    各向异性导电构件及其制造方法

    公开(公告)号：US08742263B2

    公开(公告)日：2014-06-03

    申请号：US13201784

    申请日：2010-02-17

    申请人： Tadabumi Tomita ,  Yusuke Hatanaka ,  Shinya Suzuki ,  Atsushi Matsuura ,  Yoshinori Hotta ,  Akio Uesugi

    发明人： Tadabumi Tomita ,  Yusuke Hatanaka ,  Shinya Suzuki ,  Atsushi Matsuura ,  Yoshinori Hotta ,  Akio Uesugi

    IPC分类号： H05K1/11

    CPC分类号： H01R13/2435 ,  H01B1/023 ,  H01R12/7082

    摘要： Provided is an anisotropically conductive member that has a dramatically increased density of disposed conductive paths, can be used as an electrically connecting member or inspection connector for electronic components such as semiconductor devices even today when still higher levels of integration have been achieved, and has excellent flexibility. The anisotropically conductive member includes an insulating base and a plurality of conductive paths made of a conductive material, insulated from one another, and extending through the insulating base in the thickness direction of the insulating base, one end of each of the conductive paths protruded on one side of the insulating base, the other end of each of the conductive paths exposed or protruded on the other side thereof. The insulating base is made of a resin material and the conductive paths are formed at a density of at least 1,000,000 conductive paths/mm2.

    摘要翻译： 提供具有显着增加的设置导电路径密度的各向异性导电构件，甚至可以用作电连接构件或诸如半导体器件的电子部件的检查连接器，甚至在仍然具有更高的集成度的情况下也具有优异的 灵活性。 各向异性导电构件包括绝缘基底和由导电材料制成的多个彼此绝缘的导电路径，并且在绝缘基底的厚度方向上延伸穿过绝缘基底，每个导电路径的一端突出在 绝缘基座的一侧，每个导电路径的另一端在其另一侧上露出或突出。 绝缘基底由树脂材料制成，并且导电路径以至少1,000,000导电通路/ mm2的密度形成。

    Microstructure and method of manufacturing the same
    6.
    发明申请
    Microstructure and method of manufacturing the same 有权
    微结构及其制造方法

    公开(公告)号：US20080081173A1

    公开(公告)日：2008-04-03

    申请号：US11702189

    申请日：2007-02-05

    申请人： Yusuke Hatanaka ,  Tadabumi Tomita ,  Yoshinori Hotta ,  Akio Uesugi

    发明人： Yusuke Hatanaka ,  Tadabumi Tomita ,  Yoshinori Hotta ,  Akio Uesugi

    IPC分类号： C23F1/02

    CPC分类号： C25D11/20 ,  C25D11/12 ,  C25D11/24 ,  Y10T428/12042 ,  Y10T428/12056 ,  Y10T428/249953 ,  Y10T428/24997 ,  Y10T428/249974

    摘要： In a method of manufacturing a microstructure, an aluminum member having an aluminum substrate and a micropore-bearing anodized layer present on a surface of the aluminum substrate is subjected at least to, in order, a pore-ordering treatment which involves performing one or more cycles of a step that includes a first film dissolution treatment for dissolving 0.001 to 20 wt % of a material constituting the anodized layer and an anodizing treatment which follows the first film dissolution treatment; and a second film dissolution treatment for dissolving the anodized layer, thereby obtaining the microstructure having micropores formed on a surface thereof. This method enables a microstructure having an ordered array of pits to be obtained in a short period of time.

    摘要翻译： 在制造微结构的方法中，具有铝基板和存在于铝基板表面上的微孔阳极氧化层的铝构件至少依次进行孔序处理，其涉及执行一个或多个 包括第一膜溶解处理以使构成阳极氧化层的材料为0.001〜20重量％的步骤的循环和在第一膜溶解处理之后的阳极氧化处理; 以及用于溶解阳极氧化层的第二膜溶解处理，从而获得在其表面上形成有微孔的微结构。 该方法能够在短时间内获得具有有序排列阵列的微结构。

    Anisotropic conductive joint package
    8.
    发明授权
    Anisotropic conductive joint package 有权
    各向异性导电接头包装

    公开(公告)号：US08516690B2

    公开(公告)日：2013-08-27

    申请号：US12747128

    申请日：2008-12-01

    申请人： Yusuke Hatanaka ,  Yoshinori Hotta ,  Tadabumi Tomita

    发明人： Yusuke Hatanaka ,  Yoshinori Hotta ,  Tadabumi Tomita

    IPC分类号： H01R43/00

    CPC分类号： H01L23/5389 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R12/714 ,  Y10T29/49126 ,  Y10T29/4921 ,  Y10T428/24074 ,  Y10T428/24083 ,  Y10T428/24091 ,  Y10T428/24174 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249956 ,  H01L2924/00

    摘要： An anisotropic conductive joint package in which an anisotropic conductive film is joined to at least one conductive material selected from among the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), a tin oxide doped with indium (ITO), molybdenum (Mo), iron (Fe), palladium (Pd), beryllium (Be), and rhenium (Re). The package is characterized in that: the anisotropic conductive film has an insulating base and conductive paths composed of conductive members, insulated from one another, and extending through the insulating base in the direction of the thickness of the insulating base, one ends of the conductive paths are exposed from one side of the insulating base, the other ends are exposed from the other side, the density of the conductive paths is 3,000,000 pieces/mm2 or more, the insulating base is a structural body composed of an anodic oxide film of an aluminum substrate having micropores, and each micropore does not have a branch structure along the depth. The package can be used as an anisotropic conductive member of an electronic component of a semiconductor device or the like or a connector for inspection even if the structure has a much higher degree of integration realized by drastically improving the installation density of the conductive paths.

    摘要翻译： 一种各向异性导电接头封装，其中各向异性导电膜与至少一种选自金（Au），银（Ag），铜（Cu），铝（Al），镁（Mg） ，镍（Ni），掺有铟（ITO），钼（Mo），铁（Fe），钯（Pd），铍（Be）和铼（Re）的氧化锡。 封装的特征在于：各向异性导电膜具有绝缘基底和由导电构件构成的导电路径，彼此绝缘并且在绝缘基底的厚度方向上延伸穿过绝缘基底，导电的一端 路径从绝缘基体的一侧露出，另一端从另一侧露出，导电路径的密度为3,000,000个/ mm 2以上，绝缘基底是由阳极氧化膜 铝基板具有微孔，并且每个微孔不具有沿深度的分支结构。 该封装可以用作半导体器件等的电子部件的各向异性导电部件或用于检查的连接器，即使通过显着提高导电路径的安装密度而实现的结构具有高得多的集成度。

    ANISOTROPICALLY CONDUCTIVE MEMBER AND METHOD FOR PRODUCING THE SAME
    9.
    发明申请
    ANISOTROPICALLY CONDUCTIVE MEMBER AND METHOD FOR PRODUCING THE SAME 有权
    非均匀导电构件及其制造方法

    公开(公告)号：US20120168218A1

    公开(公告)日：2012-07-05

    申请号：US13201784

    申请日：2010-02-17

    申请人： Tadabumi Tomita ,  Yusuke Hatanaka ,  Shinya Suzuki ,  Atsushi Matsuura ,  Yoshinori Hotta ,  Akio Uesugi

    发明人： Tadabumi Tomita ,  Yusuke Hatanaka ,  Shinya Suzuki ,  Atsushi Matsuura ,  Yoshinori Hotta ,  Akio Uesugi

    IPC分类号： H05K1/11 ,  C25D11/24 ,  C25D5/48 ,  C25D11/18

    CPC分类号： H01R13/2435 ,  H01B1/023 ,  H01R12/7082

    摘要： Provided is an anisotropically conductive member that has a dramatically increased density of disposed conductive paths, can be used as an electrically connecting member or inspection connector for electronic components such as semiconductor devices even today when still higher levels of integration have been achieved, and has excellent flexibility. The anisotropically conductive member includes an insulating base and a plurality of conductive paths made of a conductive material, insulated from one another, and extending through the insulating base in the thickness direction of the insulating base, one end of each of the conductive paths protruded on one side of the insulating base, the other end of each of the conductive paths exposed or protruded on the other side thereof. The insulating base is made of a resin material and the conductive paths are formed at a density of at least 1,000,000 conductive paths/mm2.

    摘要翻译： 提供具有显着增加的设置导电路径密度的各向异性导电构件，甚至可以用作电连接构件或诸如半导体器件的电子部件的检查连接器，甚至在仍然具有更高的集成度的情况下也具有优异的 灵活性。 各向异性导电构件包括绝缘基底和由导电材料制成的多个彼此绝缘的导电路径，并且在绝缘基底的厚度方向上延伸穿过绝缘基底，每个导电路径的一端突出在 绝缘基座的一侧，每个导电路径的另一端在其另一侧上露出或突出。 绝缘基底由树脂材料制成，并且导电路径以至少1,000,000导电通路/ mm2的密度形成。