公开(公告)号：US20130337202A1

公开(公告)日：2013-12-19

申请号：US13979422

申请日：2012-01-16

申请人： Yutaka Aoki ,  Atsushi Takei ,  Yasushi Hirokawa ,  Yusuke Masuda

发明人： Yutaka Aoki ,  Atsushi Takei ,  Yasushi Hirokawa ,  Yusuke Masuda

IPC分类号： H01L21/673

CPC分类号： H01L21/673 ,  B32B27/08 ,  B32B27/302 ,  B32B2250/24 ,  B32B2270/00 ,  B32B2439/00 ,  B32B2553/00 ,  B65D2585/86 ,  C08L53/02 ,  C08L2205/02 ,  H01L21/67336 ,  Y10T428/1352 ,  Y10T428/24975 ,  C08L25/06

摘要： Disclosed are a multilayer styrenic resin sheet including 10 to 50 laminated layers which are each made of a styrenic resin composition that includes 29 to 65 mass % of a styrene/conjugated diene copolymer (A), 51 to 15 mass % of a polystyrene resin (B) and 20 to 9 mass % of an impact-resistant polystyrene resin (C) and which each have an average thickness of 2 to 50 μm; and a packaging material (such as carrier tape or tray) for electronic components which is formed from the multilayer styrenic resin sheet. The melt tension of the styrenic resin composition at 220° C. is preferably 10 to 30 mN, and the content of the conjugated diene is preferably 10 to 25 mass % relative to 100 mass % of the copolymer (A).

摘要翻译： 公开了一种多层苯乙烯树脂片，其包含10〜50层叠层，各层由苯乙烯系树脂组合物，苯乙烯/共轭二烯共聚物（A）29〜65质量％，聚苯乙烯树脂（质量％ B）和20〜9质量％的耐冲击性聚苯乙烯树脂（C），平均厚度为2〜50μm; 以及由多层苯乙烯树脂片形成的用于电子部件的包装材料（例如载带或托盘）。 苯乙烯树脂组合物在220℃下的熔融张力优选为10〜30mN，相对于共聚物（A）的100质量％，共轭二烯的含量优选为10〜25质量％。

公开(公告)号：US09646863B2

公开(公告)日：2017-05-09

申请号：US13979422

申请日：2012-01-16

申请人： Yutaka Aoki ,  Atsushi Takei ,  Yasushi Hirokawa ,  Yusuke Masuda

发明人： Yutaka Aoki ,  Atsushi Takei ,  Yasushi Hirokawa ,  Yusuke Masuda

IPC分类号： H01L21/673 ,  C08L25/04 ,  C08L53/02 ,  B32B27/08 ,  B32B27/30

CPC分类号： H01L21/673 ,  B32B27/08 ,  B32B27/302 ,  B32B2250/24 ,  B32B2270/00 ,  B32B2439/00 ,  B32B2553/00 ,  B65D2585/86 ,  C08L53/02 ,  C08L2205/02 ,  H01L21/67336 ,  Y10T428/1352 ,  Y10T428/24975 ,  C08L25/06

摘要： Disclosed are a multilayer styrenic resin sheet including 10 to 50 laminated layers which are each made of a styrenic resin composition that includes 29 to 65 mass % of a styrene/conjugated diene copolymer (A), 51 to 15 mass % of a polystyrene resin (B) and 20 to 9 mass % of an impact-resistant polystyrene resin (C) and which each have an average thickness of 2 to 50 μm; and a packaging material (such as carrier tape or tray) for electronic components which is formed from the multilayer styrenic resin sheet. The melt tension of the styrenic resin composition at 220° C. is preferably 10 to 30 mN, and the content of the conjugated diene is preferably 10 to 25 mass % relative to 100 mass % of the copolymer (A).

公开(公告)号：US20130251970A1

公开(公告)日：2013-09-26

申请号：US13877747

申请日：2011-10-06

申请人： Yutaka Aoki ,  Atsushi Takei ,  Yasushi Hirokawa ,  Yusuke Masuda

发明人： Yutaka Aoki ,  Atsushi Takei ,  Yasushi Hirokawa ,  Yusuke Masuda

IPC分类号： B32B27/08

CPC分类号： B32B27/08 ,  B32B27/18 ,  B32B27/302 ,  B32B27/36 ,  B32B27/365 ,  B32B2250/05 ,  B32B2307/202 ,  B65D73/02 ,  B65D2213/02 ,  Y10T428/24975

摘要： A surface conductive thermoplastic resin sheet and a molded member, such as an embossed carrier tape, using the sheet, in which burr- and flash-related faults are prevented, whatever the molding equipment, by a slitting method or punching when embossing. Provided is a conductive multilayered sheet, and an electronic component package, a carrier tape and a tray consisting of the conductive multilayered sheet, wherein respective layers with a mean thickness of 2 to 50 μm are composed of a thermoplastic resin, or a resin composition having the thermoplastic resin as a main component, and wherein a conductive resin layer consisting of 65 to 95 wt % of a thermoplastic resin, or a resin composition having the thermoplastic resin as a main component, and 5 to 35 wt % of carbon black, on one side or both sides of the base sheet consisting of multiple layers wherein 10 to 50 respective layers are layered.

摘要翻译： 使用片材的表面导电性热塑性树脂片材和模压部件，例如使用该片材的压花载带，其中防止毛刺和闪光相关的缺陷，无论成型设备如何，通过切割方法或在压花时冲压。 提供一种导电性多层片材，以及由导电性多层片材构成的电子部件封装体，载体带和托盘，其中平均厚度为2〜50μm的各层由热塑性树脂构成，或具有 热塑性树脂作为主要成分，并且其中由65至95重量％的热塑性树脂或具有热塑性树脂作为主要成分的树脂组合物和5至35重量％的炭黑组成的导电树脂层在 由多层构成的基片的一侧或两面，其中层叠有10〜50层。

公开(公告)号：US08283625B2

公开(公告)日：2012-10-09

申请号：US12443461

申请日：2007-09-21

申请人： Taka-aki Sato ,  Yutaka Aoki ,  Takashi Shimada ,  Atsuhiko Toyama

发明人： Taka-aki Sato ,  Yutaka Aoki ,  Takashi Shimada ,  Atsuhiko Toyama

IPC分类号： B01D59/44

CPC分类号： H01J49/164 ,  G01N1/2806 ,  G01N1/2813 ,  H01J49/0004 ,  H01J49/0418

摘要： It is intended to provide a method of preparing sample for matrix-assisted laser desorption/ionization mass spectrometry using a matrix capable of generating preferred crystals that cause effective ionization of a molecule to be measured. A method of preparing a sample for matrix-assisted laser desorption/ionization mass spectrometry comprising the steps of: preparing a solution of 2,5-dihydroxybenzoic acid of 40 mg/mL to saturated concentration as a matrix solution; and dispensing the matrix solution to a sample to be analyzed by using an inkjet mechanism, to crystallize the 2,5-dihydroxybenzoic acid.

摘要翻译： 旨在提供一种使用能够产生优选的晶体的基质辅助激光解吸/电离质谱法的样品的制备方法，所述晶体能够产生有效电离被测分子。 一种制备用于基体辅助激光解吸/电离质谱的样品的方法，包括以下步骤：以饱和浓度制备40mg / mL的2,5-二羟基苯甲酸溶液作为基质溶液; 并通过使用喷墨机构将基质溶液分配到要分析的样品上，使2,5-二羟基苯甲酸结晶。

公开(公告)号：US20120218162A1

公开(公告)日：2012-08-30

申请号：US13505041

申请日：2011-02-22

申请人： Yutaka Aoki ,  Shigeru Yagi ,  Akira Saitou ,  Kazuhiko Honjo

发明人： Yutaka Aoki ,  Shigeru Yagi ,  Akira Saitou ,  Kazuhiko Honjo

IPC分类号： H01Q21/00 ,  H01Q5/00 ,  H01Q19/10

CPC分类号： H01Q9/285 ,  H01Q1/242 ,  H01Q5/321

摘要： The multifrequency antenna comprises a substrate, antenna elements, shunt inductor conductors, series capacitor conductors, series inductor conductors, a connection point, and input/output terminals. The antenna elements are provided on the substrate and electrically connected to the connection point via the shunt inductor conductors. The antenna elements form capacitors together with the parts facing the series capacitor conductors and are electrically connected to the input/output terminals via these capacitors and series inductor conductors.

摘要翻译： 多频天线包括基板，天线元件，并联电感器导体，串联电容器导体，串联电感器导体，连接点和输入/输出端子。 天线元件设置在基板上，并通过并联电感器导体电连接到连接点。 天线元件与面向串联电容器导体的部件形成电容器，并通过这些电容器和串联电感器导体电连接到输入/输出端子。

公开(公告)号：US20110212697A1

公开(公告)日：2011-09-01

申请号：US13127782

申请日：2010-03-04

申请人： Yutaka Aoki ,  Kazuhiko Honjo ,  Akira Saitou

发明人： Yutaka Aoki ,  Kazuhiko Honjo ,  Akira Saitou

IPC分类号： H04B1/06 ,  H01Q19/10 ,  H03D7/16

CPC分类号： H01Q3/44 ,  H01Q25/00

摘要： A miniature variable-beam microwave antenna (1) comprises antenna conductors (100a, 100b), an EBG conductor (120), a variable reactance element (130), and an adjusting part (150). The EBG conductor (120) is connected to a grounded part (160) through the variable reactance element (130). The adjusting part (150) changes the apparent reactance of the EBG conductor (120) by changing the capacity of the variable reactance element (130). As the apparent reactance of the EBG conductor (120) changes, the directivity of the miniature variable-beam microwave antenna (1) also changes.

摘要翻译： 微型可变光束微波天线（1）包括天线导体（100a，100b），EBG导体（120），可变电抗元件（130）和调节部分（150）。 EBG导体（120）通过可变电抗元件（130）连接到接地部分（160）。 调整部件（150）通过改变可变电抗元件（130）的容量来改变EBG导体（120）的表面电抗。 随着EBG导体（120）的明显电抗变化，微型可变波束微波天线（1）的方向性也发生变化。

公开(公告)号：US20110210899A1

公开(公告)日：2011-09-01

申请号：US13127274

申请日：2010-03-04

申请人： Yutaka Aoki ,  Akira Saitou ,  Kazuhiko Honjo

发明人： Yutaka Aoki ,  Akira Saitou ,  Kazuhiko Honjo

IPC分类号： H01Q5/01

CPC分类号： H01Q5/0062 ,  H01Q5/328 ,  H01Q5/335 ,  H01Q5/378 ,  H01Q9/0457 ,  H01Q9/32 ,  H01Q9/40

摘要： A multi-frequency antenna (1) comprises a dielectric substrate (100), an antenna element (110), a shunt inductor (120), a capacitor conductor (130), a series inductor (140), a grounded part (150) and a feeding point (160). The antenna element (110) is arranged on the substrate (100), and is electrically connected to the grounded part (150) through the shunt inductor (120). Moreover, the antenna element (110) is electrically connected to the feeding point (160) through a series capacitor formed by a part where the antenna element (110) faces the capacitor conductor (130) and the substrate (100) therebetween, and through the series inductor (140).

摘要翻译： 多频天线（1）包括电介质基板（100），天线元件（110），并联电感器（120），电容器导体（130），串联电感器（140），接地部分（150） 和馈送点（160）。 天线元件（110）布置在基板（100）上，并且通过分流电感器（120）电连接到接地部分（150）。 此外，天线元件（110）通过由天线元件（110）面对电容器导体（130）的部分和其间的基板（100）形成的串联电容器电连接到馈电点（160），并且通过 串联电感器（140）。

公开(公告)号：US07852258B2

公开(公告)日：2010-12-14

申请号：US12254314

申请日：2008-10-20

申请人： Yusuke Kato ,  Yutaka Aoki

发明人： Yusuke Kato ,  Yutaka Aoki

IPC分类号： H01Q1/42 ,  G01P21/00 ,  G01S13/00 ,  G01S7/40

CPC分类号： G01S7/4008 ,  G01S13/931 ,  G01S2013/9375 ,  G01S2013/9389

摘要： In a power-loss reducing system, a transmitting unit causes a radar to transmit a measurement radio wave, and a power monitoring unit monitors power of the measurement radio wave transmitted from the radar through a cover while changing a positional relationship between the cover and the radar. An extracting unit extracts a value of the changed positional relationship between the cover and the radar based on a result of the monitoring of the power such that the extracted value of the positional relationship allows reduction of power loss of a radar wave transmitted, through the cover, from the radar located based on the extracted value of the positional relationship.

摘要翻译： 在功率损耗降低系统中，发送单元使雷达发送测量无线电波，并且功率监视单元通过盖监视从雷达发送的测量无线电波的功率，同时改变盖和 雷达。 提取单元基于监视功率的结果，提取盖和雷达之间的改变的位置关系的值，使得提取的位置关系的值允许通过盖子减少发送的雷达波的功率损耗 ，从位于雷达位置的提取值的位置关系。

公开(公告)号：USRE41511E1

公开(公告)日：2010-08-17

申请号：US11726763

申请日：2007-03-22

申请人： Yutaka Aoki ,  Ichiro Mihara ,  Takeshi Wakabayashi ,  Katsumi Watanabe

发明人： Yutaka Aoki ,  Ichiro Mihara ,  Takeshi Wakabayashi ,  Katsumi Watanabe

IPC分类号： H01L23/522 ,  H01L23/50

CPC分类号： H01L23/3114 ,  H01L23/5223 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/525 ,  H01L2924/0002 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/00

摘要： In a semiconductor device, re-wiring is provided on a circuit element formation region of a semiconductor substrate. A columnar electrode for connection with a circuit board is provided on the rewiring. A first insulating film is provided over the semiconductor substrate excluding a connection pad, and a ground potential layer connected to a ground potential is provided on an upper surface of the first insulating film. A re-wiring is provided over the ground potential layer with a second insulating film interposed. The ground potential layer serves as a barrier layer for preventing crosstalk between the re-wiring and circuit element formation region. A thin-film circuit element is provided on the second insulating film, and a second ground potential layer is provided as a second barrier layer over the thin-film circuit element with an insulating film interposed. Re-wiring is provided over the second ground potential layer.

摘要翻译： 在半导体器件中，在半导体衬底的电路元件形成区域上设置再布线。 在重新布线时提供用于与电路板连接的柱状电极。 第一绝缘膜设置在除了连接焊盘之外的半导体衬底上，并且在第一绝缘膜的上表面上设置连接到接地电位的接地电位层。 在地电位层上提供再布线，其中插入有第二绝缘膜。 地电位层用作防止重新布线和电路元件形成区域之间的串扰的阻挡层。 薄膜电路元件设置在第二绝缘膜上，第二接地电位层设置在薄膜电路元件上，作为第二阻挡层，绝缘膜被插入。 在第二接地电位层上提供重新布线。

公开(公告)号：US07710312B2

公开(公告)日：2010-05-04

申请号：US12289011

申请日：2008-10-17

申请人： Yusuke Kato ,  Akihisa Fujita ,  Yutaka Aoki

发明人： Yusuke Kato ,  Akihisa Fujita ,  Yutaka Aoki

IPC分类号： G01S7/28 ,  G01S13/93

CPC分类号： G01S13/931 ,  G01S7/034 ,  G01S2013/9375 ,  G01S2013/9389 ,  H01Q1/3233 ,  H01Q3/40

摘要： The radar apparatus includes an antenna device including a transmitting antenna and a receiving antenna, a main body which generates a radar wave, transmits the radar wave from the transmitting antenna, and receives the radar wave reflected from an obstacle to be detected by the receiving antenna, and a cover member covering the main body and the antenna device on a side of a transmission direction of the radar wave and located out of contact with the main body and the antenna device. The cover member has a transmission portion allowing the radar wave to pass therethrough, a surface of the transmission portion facing the antenna device being inclined by an angle greater than 3 degrees with respect to an antenna surface of the receiving antenna.

摘要翻译： 该雷达装置包括天线装置，包括发射天线和接收天线，产生雷达波的主体，发射天线的雷达波，并接收由接收天线要检测的障碍物反射的雷达波 以及覆盖所述主体和所述天线装置的覆盖部件，所述盖体在所述雷达波的传输方向的一侧并且与所述主体和所述天线装置不接触。 盖构件具有允许雷达波通过的传输部分，面向天线装置的传输部分的表面相对于接收天线的天线表面倾斜大于3度的角度。