公开(公告)号：US4049904A

公开(公告)日：1977-09-20

申请号：US300086

申请日：1972-10-24

申请人： Yutaka Hori ,  Zenzo Honda ,  Kenji Suzuki ,  Keiji Nakamoto ,  Yoshiharu Yamamoto

发明人： Yutaka Hori ,  Zenzo Honda ,  Kenji Suzuki ,  Keiji Nakamoto ,  Yoshiharu Yamamoto

IPC分类号： B32B15/08 ,  H01B11/10 ,  H01B13/10 ,  H01B7/18 ,  B32B7/02

CPC分类号： H01B13/103 ,  B32B15/08 ,  H01B11/1016 ,  Y10T428/24967 ,  Y10T428/31692 ,  Y10T428/31699

摘要： A plastic laminated metallic foil is prepared by laminating a first layer of a polymer selected from the group consisting of ethylene-unsaturated carboxylic acid copolymers, ethylene-unsaturated carboxylic acid ester copolymers, ethylene-unsaturated carboxylic acid-unsaturated carboxylic acid-ester ternary copolymers, ionomers containing these copolymers as the base, and graft copolymers of polyethylene and unsaturated carboxylic acids on at least one surface of a metallic foil, and further laminating a second layer of a polymer selected from the group consisting of polyethylene, ethylene-vinyl acetate copolymers, ethylene-unsaturated carboxylic acid ester copolymers, and graft copolymers of polyethylene and unsaturated carboxylic acid esters onto the first polymer layer of the metallic foil.

摘要翻译： 通过层压选自乙烯 - 不饱和羧酸共聚物，乙烯 - 不饱和羧酸酯共聚物，乙烯 - 不饱和羧酸 - 不饱和羧酸 - 酯三元共聚物， 含有这些共聚物作为碱的离聚物和在金属箔的至少一个表面上的聚乙烯和不饱和羧酸的接枝共聚物，并且还层压第二层选自聚乙烯，乙烯 - 乙酸乙烯酯共聚物， 乙烯 - 不饱和羧酸酯共聚物，以及聚乙烯和不饱和羧酸酯在金属箔的第一聚合物层上的接枝共聚物。

公开(公告)号：US4092452A

公开(公告)日：1978-05-30

申请号：US554831

申请日：1975-03-03

申请人： Yutaka Hori ,  Zenzo Honda ,  Kenji Suzuki ,  Keiji Nakamoto ,  Yoshiharu Yamamoto

发明人： Yutaka Hori ,  Zenzo Honda ,  Kenji Suzuki ,  Keiji Nakamoto ,  Yoshiharu Yamamoto

IPC分类号： B32B15/08 ,  H01B11/10 ,  H01B13/10 ,  B32B7/02 ,  H01B7/18

CPC分类号： H01B13/103 ,  B32B15/08 ,  H01B11/1016 ,  Y10T428/24967 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31913 ,  Y10T428/31928 ,  Y10T428/31935

摘要： A plastic laminated metallic foil is prepared by laminating a first layer of a polymer selected from the group consisting of ethylene-unsaturated carboxylic acid copolymers, ethylene-unsaturated carboxylic acid ester copolymers, ethylene-unsaturated carboxylic acid-unsaturated carboxylic acid-ester ternary copolymers, ionomers containing these copolymers as the base, and graft copolymers of polyethylene and unsaturated carboxylic acids on at least one surface of a metallic foil, and further laminating a second layer of a polymer selected from the group consisting of polyethylene, ethylene-vinyl acetate copolymers, ethylene-unsaturated carboxylic acid ester copolymers, and graft copolymers of polyethylene and unsaturated carboxylic acid esters onto the first polymer layer of the metallic foil.

摘要翻译： 通过层压选自乙烯 - 不饱和羧酸共聚物，乙烯 - 不饱和羧酸酯共聚物，乙烯 - 不饱和羧酸 - 不饱和羧酸 - 酯三元共聚物， 含有这些共聚物作为碱的离聚物和在金属箔的至少一个表面上的聚乙烯和不饱和羧酸的接枝共聚物，并且还层压第二层选自聚乙烯，乙烯 - 乙酸乙烯酯共聚物， 乙烯 - 不饱和羧酸酯共聚物，以及聚乙烯和不饱和羧酸酯在金属箔的第一聚合物层上的接枝共聚物。

公开(公告)号：US3950605A

公开(公告)日：1976-04-13

申请号：US387971

申请日：1973-08-13

申请人： Yutaka Hori ,  Zenzo Honda ,  Kenji Suzuki ,  Keiji Nakamoto ,  Yoshiharu Yamamoto

发明人： Yutaka Hori ,  Zenzo Honda ,  Kenji Suzuki ,  Keiji Nakamoto ,  Yoshiharu Yamamoto

IPC分类号： B05D1/26 ,  B29C47/00 ,  B32B15/08 ,  H01B11/10 ,  H01B13/10 ,  H01B13/12 ,  H01B7/18

CPC分类号： H01B13/12 ,  B32B15/08 ,  H01B11/1016 ,  H01B13/103 ,  B29C47/0004 ,  B29C47/0014 ,  B29C47/0016 ,  B29C47/0021 ,  B29C47/025 ,  B29C47/065 ,  Y10T428/24975 ,  Y10T428/31681 ,  Y10T428/31696 ,  Y10T428/31917 ,  Y10T428/31928

摘要： A metal foil-plastic laminate comprising an upper layer of a member selected from the group consisting of a polyethylene-vinyl acetate and ethylene-vinyl acetate copolymer containing no more than 8 wt. % of vinyl acetate and a lower layer of an ethylene-vinyl acetate copolymer containing 10-45 wt. % of vinyl acetate, thermally pressed on at least one surface of a metal foil, said lower layer being in contact with the metal foil and method for preparing the same.

摘要翻译： 一种金属箔 - 塑料层压材料，其包含选自聚乙烯 - 乙酸乙烯酯和乙烯 - 乙酸乙烯酯共聚物的成员的上层，其含有不超过8wt。 ％的乙酸乙烯酯和含有10-45wt。％的乙烯 - 乙酸乙烯酯共聚物的下层。 ％的乙酸乙烯酯，热压在金属箔的至少一个表面上，所述下层与金属箔接触及其制备方法。

公开(公告)号：US5264552A

公开(公告)日：1993-11-23

申请号：US413502

申请日：1989-09-27

申请人： Masao Abe ,  Akira Ohtani ,  Hiroyuki Higuchi ,  Minoru Ezoe ,  Shinya Akizuki ,  Keiji Nakamoto ,  Keiko Mochizuki ,  Yasuhiro Umemoto ,  Michio Umeda

发明人： Masao Abe ,  Akira Ohtani ,  Hiroyuki Higuchi ,  Minoru Ezoe ,  Shinya Akizuki ,  Keiji Nakamoto ,  Keiko Mochizuki ,  Yasuhiro Umemoto ,  Michio Umeda

IPC分类号： C08J5/18 ,  C08G73/00 ,  C08G73/02 ,  C08L79/00 ,  C09D179/00 ,  D01F6/74 ,  H01B1/12 ,  H01M4/60

CPC分类号： H01M4/60 ,  C08G73/0266 ,  H01B1/128

摘要： This invention relates to an organic polymer having, as the main repeating unit, the compound represented by the general formula: ##STR1## (wherein, m and n respectively show the molar fraction of quinonediimine structure unit and phenylenediamine structure unit in the repeating unit, and 0

公开(公告)号：US5476565A

公开(公告)日：1995-12-19

申请号：US180385

申请日：1994-01-12

申请人： Yuzo Akada ,  Koji Akazawa ,  Keiji Nakamoto

发明人： Yuzo Akada ,  Koji Akazawa ,  Keiji Nakamoto

IPC分类号： C09J7/02 ,  C09J4/00 ,  C09J163/00 ,  H01L21/301 ,  H01L21/302 ,  H01L21/58 ,  H01L21/68 ,  B32B31/00

CPC分类号： H01L21/6836 ,  H01L21/302 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T428/24826 ,  Y10T428/2486 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2887 ,  Y10T428/2891

摘要： A dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm.times.10 mm can easily be picked up.

摘要翻译： 一种切割/芯片接合薄膜，其具有紫外线透射性基板，其上设有紫外线固化型粘合剂层和粘合剂层，所述粘合剂层已被部分紫外线固化以具有固化部分和未固化 部分。 该膜在切割和释放性能方面具有用于支撑半导体晶片的保持力的良好平衡的组合，以使切割的芯片能够与粘合剂层一起容易地释放，使得即使大于10mm×10mm的大尺寸芯片也可以容易地 被拾起

公开(公告)号：US4556623A

公开(公告)日：1985-12-03

申请号：US688119

申请日：1984-12-31

申请人： Shohei Tamura ,  Sadamitsu Sasaki ,  Takeshi Sasaki ,  Hisashi Ichinose ,  Keiji Nakamoto ,  Masao Abe ,  Hitoshi Nakazawa

发明人： Shohei Tamura ,  Sadamitsu Sasaki ,  Takeshi Sasaki ,  Hisashi Ichinose ,  Keiji Nakamoto ,  Masao Abe ,  Hitoshi Nakazawa

IPC分类号： C08G73/00 ,  H01B1/12 ,  H01M4/60 ,  G03G5/07

CPC分类号： H01B1/128 ,  C08G73/00 ,  H01M4/60

摘要： An electroconductive porous film is described comprising a porous film substrate having deposited thereon an electroconductive organic polymer containing an electron acceptor as a doptant, substantially comprising a linear polymer having as a main repeating unit thereof a quinonediimine structure represented by formula (III). ##STR1## wherein R.sub.1 and R.sub.2, which are the same or different, each represents a hydrogen atom or an alkyl group.

摘要翻译： 描述了一种导电多孔膜，其包括在其上沉积有包含电子受体作为试剂的导电有机聚合物的多孔膜基材，其基本上包含作为其主要重复单元的线性聚合物为由式（III）表示的醌二亚胺结构。 （III）其中相同或不同的R 1和R 2各自表示氢原子或烷基。

公开(公告)号：US5728321A

公开(公告)日：1998-03-17

申请号：US471256

申请日：1995-06-06

申请人： Masao Abe ,  Akira Ohtani ,  Hiroyuki Higuchi ,  Minoru Ezoe ,  Shinya Akizuki ,  Keiji Nakamoto ,  Keiko Mochizuki ,  Yasuhiro Umemoto ,  Michio Umeda

发明人： Masao Abe ,  Akira Ohtani ,  Hiroyuki Higuchi ,  Minoru Ezoe ,  Shinya Akizuki ,  Keiji Nakamoto ,  Keiko Mochizuki ,  Yasuhiro Umemoto ,  Michio Umeda

IPC分类号： C08G73/02 ,  H01B1/12 ,  H01M4/60 ,  H01B1/00 ,  H01B1/04

CPC分类号： H01B1/128 ,  C08G73/0266 ,  H01M4/60 ,  Y10T428/29 ,  Y10T428/2913

摘要： This invention relates to a conducting organic polymer formed by doping an organic polymer with a protonic acid having a dissociation constant value pKa of less than 4.8, wherein the organic polymer has, as the main repeating unit, a compound represented by the general formula: ##STR1## wherein, m and n, respectively, show the molar fraction of the quinonediimine structural unit and phenylenediamine structural unit in the repeating unit, and 0

摘要翻译： 本发明涉及通过用解离常数值pKa小于4.8的质子酸掺杂有机聚合物而形成的导电有机聚合物，其中有机聚合物具有作为主要重复单元的由以下通式表示的化合物： 其中，m和n分别表示重复单元中醌二亚胺结构单元和苯二胺结构单元的摩尔分数，0

公开(公告)号：US4615829A

公开(公告)日：1986-10-07

申请号：US671155

申请日：1984-11-13

申请人： Shohei Tamura ,  Sadamitsu Sasaki ,  Masao Abe ,  Hitoshi Nakazawa ,  Hisashi Ichinose ,  Keiji Nakamoto ,  Satoshi Yumoto

发明人： Shohei Tamura ,  Sadamitsu Sasaki ,  Masao Abe ,  Hitoshi Nakazawa ,  Hisashi Ichinose ,  Keiji Nakamoto ,  Satoshi Yumoto

IPC分类号： C08G73/00 ,  C08G73/02 ,  C08L79/00 ,  H01B1/12 ,  H01L51/30 ,  H01M4/60 ,  H01B1/00

CPC分类号： H01M4/60 ,  C08G73/00 ,  C08G73/026 ,  C08G73/0266 ,  C08L79/00 ,  H01B1/128 ,  H01L51/0035

摘要： An electroconductive organic polymer exhibiting outstanding electroconductivity is described, containing an electron acceptor as a dopant, and having electroconductivity of not less than 10.sup.-6 S/cm, substantially comprising a linear polymer having as a main repeating unit thereof a quinonediimine structure represented by formula (III) ##STR1## wherein R represents a hydrogen atom or an alkyl group. This polymer can be obtained by oxidative polymerization of an aniline compound or a water-soluble salt thereof with an oxidizing agent in a reaction medium containing a protonic acid.

摘要翻译： 描述了显示出优异的导电性的导电有机聚合物，其含有电子受体作为掺杂剂，并且具有不小于10 -6 S / cm的导电率，基本上包含具有作为主要重复单元的线性聚合物，由式 （III）其中R表示氢原子或烷基。 该聚合物可以通过苯胺化合物或其水溶性盐与含有质子酸的反应介质中的氧化剂进行氧化聚合而获得。

公开(公告)号：US5304418A

公开(公告)日：1994-04-19

申请号：US998847

申请日：1992-12-30

申请人： Yuzo Akada ,  Koji Akazawa ,  Keiji Nakamoto

发明人： Yuzo Akada ,  Koji Akazawa ,  Keiji Nakamoto

IPC分类号： C09J7/02 ,  C09J4/00 ,  C09J163/00 ,  H01L21/301 ,  H01L21/302 ,  H01L21/58 ,  H01L21/68 ,  B32B7/12

CPC分类号： H01L21/6836 ,  H01L21/302 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T428/24826 ,  Y10T428/2486 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2887 ,  Y10T428/2891

摘要： A dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm.times.10 mm can easily be picked up.

摘要翻译： 一种切割/芯片接合薄膜，其具有紫外线透射性基板，其上设有紫外线固化型粘合剂层和粘合剂层，所述粘合剂层已被部分紫外线固化以具有固化部分和未固化 部分。 该薄膜在切割和释放性能方面具有用于支撑半导体晶片的保持力的良好平衡的组合，以使切割的芯片能够与粘合剂层一起容易地释放，使得即使大于10mm×10mm的大尺寸芯片 可以很容易地拿起来