公开(公告)号：US20110259628A1

公开(公告)日：2011-10-27

申请号：US13124694

申请日：2009-08-07

申请人： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

发明人： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

IPC分类号： H05K1/09 ,  C08G59/02 ,  B32B37/00 ,  C08G59/14

CPC分类号： C08G59/08 ,  C08G59/3218 ,  H05K1/03 ,  H05K1/0326 ,  Y10T156/10 ,  Y10T428/249951

摘要： Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).

摘要翻译： 本发明提供一种固化性树脂组合物，它具有良好的耐热性和低热膨胀性，并且在溶剂中具有良好的溶解性，其固化产物，包含该组合物的印刷线路板，赋予这些性能的新型环氧树脂，和 生产相同。 固化性树脂组合物含有作为必要成分的环氧树脂（A），其分子结构中含有萘结构和环己二烯酮结构通过亚甲基彼此键合的缩水甘油氧基和骨架; 和固化剂（B）。

公开(公告)号：US20120308832A1

公开(公告)日：2012-12-06

申请号：US13577235

申请日：2011-01-19

申请人： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

发明人： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

IPC分类号： C08G8/28 ,  B32B27/38 ,  C08G59/14

CPC分类号： H05K1/0326 ,  C08G8/08 ,  C08G8/12 ,  C08K5/13 ,  H05K2201/012 ,  Y10T428/31515 ,  C08L61/06

摘要： A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n=1 and n=2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.

摘要翻译： 用作环氧树脂固化剂的酚醛树脂组合物包括由通式（1）表示的萘酚酚醛清漆树脂（a1）（其中R1和R2各自独立地表示氢原子，烷基或烷氧基，和 n为重复单元，1以上的整数）和通式（2）表示的化合物（a2）（式中，R 1和R 2各自独立地表示氢原子，烷基或烷氧基），式 存在于组合物中的通式（1）中n = 1且n = 2的化合物的总比例在10〜35％的范围内，通式（1）中n的平均值在 3.0〜7.0，组合物中化合物（a2）的含量为1〜6％。

公开(公告)号：US08168731B2

公开(公告)日：2012-05-01

申请号：US13124694

申请日：2009-08-07

申请人： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

发明人： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

IPC分类号： B32B27/04 ,  C08L63/00 ,  H05K1/03

CPC分类号： C08G59/08 ,  C08G59/3218 ,  H05K1/03 ,  H05K1/0326 ,  Y10T156/10 ,  Y10T428/249951

摘要： Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).

摘要翻译： 本发明提供一种固化性树脂组合物，它具有良好的耐热性和低热膨胀性，并且在溶剂中具有良好的溶解性，其固化产物，包含该组合物的印刷线路板，赋予这些性能的新型环氧树脂，和 生产相同。 固化性树脂组合物含有作为必要成分的环氧树脂（A），其分子结构中含有萘结构和环己二烯酮结构通过亚甲基彼此键合的缩水甘油氧基和骨架; 和固化剂（B）。

公开(公告)号：US08394911B2

公开(公告)日：2013-03-12

申请号：US13577235

申请日：2011-01-19

申请人： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

发明人： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

IPC分类号： C08G8/04 ,  C08G14/04 ,  H01R12/00 ,  H05K1/00

CPC分类号： H05K1/0326 ,  C08G8/08 ,  C08G8/12 ,  C08K5/13 ,  H05K2201/012 ,  Y10T428/31515 ,  C08L61/06

摘要： A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n=1 and n=2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.

摘要翻译： 用作环氧树脂固化剂的酚醛树脂组合物包括由通式（1）表示的萘酚酚醛清漆树脂（a1）（其中R1和R2各自独立地表示氢原子，烷基或烷氧基，和 n为重复单元，1以上的整数）和通式（2）表示的化合物（a2）（式中，R 1和R 2各自独立地表示氢原子，烷基或烷氧基），式 存在于组合物中的通式（1）中n = 1且n = 2的化合物的总比例在10〜35％的范围内，通式（1）中n的平均值在 3.0〜7.0，组合物中化合物（a2）的含量为1〜6％。

公开(公告)号：US08729192B2

公开(公告)日：2014-05-20

申请号：US12280934

申请日：2006-11-10

申请人： Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

发明人： Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

IPC分类号： C08G65/48 ,  C08L63/00 ,  C08F283/00 ,  C08G59/14 ,  C08G65/38

CPC分类号： C08G59/3218 ,  C08G59/245 ,  C08L63/00

摘要： The invention provides an epoxy resin composition, a novel epoxy resin, a novel phenol resin and a semiconductor encapsulating material. The cured article of the epoxy resin composition has superior characteristics in flame retardancy, heat-resistant and curing. The epoxy resin composition is a preferable resin composition using in a semiconductor device or a circuit board device, and has the structure in which a naphthalene structure is bonded with an arylene group through an oxygen atom, and the total number of the aromatic nucleus in both the naphthalene structures and the arylenes group is 2-8. The epoxy resin composition essentially includes an epoxy resin (A) having the glycidoxy group as a substituent in the aromatic nucleus and a curing agent (B).

摘要翻译： 本发明提供环氧树脂组合物，新型环氧树脂，新型酚醛树脂和半导体封装材料。 环氧树脂组合物的固化物具有优异的阻燃性，耐热性和固化性。 环氧树脂组合物是在半导体装置或电路基板装置中使用的优选的树脂组合物，具有萘结构通过氧原子与亚芳基键合的结构，并且在两者中的芳香核总数 萘结构和亚芳基为2-8。 环氧树脂组合物基本上包括在芳环中具有缩水甘油氧基作为取代基的环氧树脂（A）和固化剂（B）。

公开(公告)号：US07718741B2

公开(公告)日：2010-05-18

申请号：US11908464

申请日：2006-03-16

申请人： Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

发明人： Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

IPC分类号： C08L63/08 ,  C08G59/00

CPC分类号： C08G59/621 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin.

摘要翻译： 本发明涉及含有作为主要骨架的聚亚芳基氧基结构，（甲基）缩水甘油氧基和芳烷基的环氧树脂作为主要成分的组合物，其导入聚亚芳基氧基的芳香环上 结构，并且具有低粘度，根据本发明，可以提供一种环氧树脂组合物，其可以赋予固化制品及其固化制品，环氧树脂，酚醛树脂以显着优异的阻燃性和介电特性 环氧树脂的中间体，以及环氧树脂的制造方法。

公开(公告)号：US20090099303A1

公开(公告)日：2009-04-16

申请号：US12280934

申请日：2006-11-10

申请人： Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

发明人： Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

IPC分类号： C08L63/08 ,  C08G65/38

CPC分类号： C08G59/3218 ,  C08G59/245 ,  C08L63/00

摘要： The invention provides an epoxy resin composition, a novel epoxy resin, a novel phenol resin and a semiconductor encapsulating material. The cured article of the epoxy resin composition has superior characteristics in flame retardancy, heat-resistant and curing. The epoxy resin composition is a preferable resin composition using in a semiconductor device or a circuit board device, and has the structure in which a naphthalene structure is bonded with an arylene group through an oxygen atom, and the total number of the aromatic nucleus in both the naphthalene structures and the arylenes group is 2-8. The epoxy resin composition essentially includes an epoxy resin (A) having the glycidoxy group as a substituent in the aromatic nucleus and a curing agent (B).

摘要翻译： 本发明提供环氧树脂组合物，新型环氧树脂，新型酚醛树脂和半导体封装材料。 环氧树脂组合物的固化物具有优异的阻燃性，耐热性和固化性。 环氧树脂组合物是在半导体装置或电路基板装置中使用的优选的树脂组合物，具有萘结构通过氧原子与亚芳基键合的结构，并且在两者中的芳香核总数 萘结构和亚芳基为2-8。 环氧树脂组合物基本上包括在芳环中具有缩水甘油氧基作为取代基的环氧树脂（A）和固化剂（B）。

公开(公告)号：US08084567B2

公开(公告)日：2011-12-27

申请号：US12615459

申请日：2009-11-10

申请人： Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

发明人： Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

IPC分类号： C08G59/00

CPC分类号： C08G59/621 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin.

摘要翻译： 本发明涉及含有作为主要骨架的聚亚芳基氧基结构，（甲基）缩水甘油氧基和芳烷基的环氧树脂作为主要成分的组合物，其导入聚亚芳基氧基的芳香环上 结构，并且具有低粘度，根据本发明，可以提供一种环氧树脂组合物，其可以赋予固化制品及其固化制品，环氧树脂，酚醛树脂以显着优异的阻燃性和介电特性 环氧树脂的中间体，以及环氧树脂的制造方法。

公开(公告)号：US20090069490A1

公开(公告)日：2009-03-12

申请号：US11908464

申请日：2006-03-16

申请人： Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

发明人： Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

IPC分类号： C08L63/08 ,  C08G65/48 ,  C08G59/00

CPC分类号： C08G59/621 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin.

摘要翻译： 本发明涉及含有作为主要骨架的聚亚芳基氧基结构，（甲基）缩水甘油氧基和芳烷基的环氧树脂作为主要成分的组合物，其导入聚亚芳基氧基的芳香环上 结构，并且具有低粘度，根据本发明，可以提供一种环氧树脂组合物，其可以赋予固化制品及其固化制品，环氧树脂，酚醛树脂以显着优异的阻燃性和介电特性 环氧树脂的中间体，以及环氧树脂的制造方法。

公开(公告)号：US20090088535A1

公开(公告)日：2009-04-02

申请号：US12280941

申请日：2006-11-01

申请人： Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

发明人： Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

IPC分类号： C08G65/48 ,  C08G65/38

CPC分类号： C08G59/063 ,  C08G59/245 ,  C08G65/38

摘要： The present invention provides a method to producing a phenol resin by which a polyarylene having low melt viscosity ether can be industrially produced by extremely simple and easy method, without the need of a special aftertreatment after polymerization and complicated multistep reaction, and produces a method of producing an epoxy resin from a phenol resin obtained by the above-mentioned method. The method of producing a phenol resin having a polyarylene ether structure includes a step of a dehydration condensation reaction of reacting a polyhydroxyaromatic compound (A) having two or more phenolic hydroxyl groups per molecule in the presence of a basic catalysis (B).

摘要翻译： 本发明提供一种生产酚醛树脂的方法，通过该方法可以通过非常简单和容易的方法在工业上制造具有低熔融粘度的乙烯的聚亚芳基，而不需要在聚合后进行特殊的后处理和复杂的多步反应，并产生一种方法 由通过上述方法获得的酚醛树脂生产环氧树脂。 具有聚亚芳基醚结构的酚醛树脂的制造方法包括在碱催化剂（B）的存在下，使每分子具有两个以上酚羟基的多羟基芳族化合物（A）进行脱水缩合反应的工序。