ELECTRONIC COMPONENT MOUNTING BOARD, METHOD FOR MANUFACTURING THE SAME AND ELECTRONIC CIRCUIT UNIT
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    发明申请
    ELECTRONIC COMPONENT MOUNTING BOARD, METHOD FOR MANUFACTURING THE SAME AND ELECTRONIC CIRCUIT UNIT 失效
    电子元件安装板及其制造方法和电子电路单元

    公开(公告)号:US20090242242A1

    公开(公告)日:2009-10-01

    申请号:US12411035

    申请日:2009-03-25

    IPC分类号: H05K1/02 H05K3/00

    摘要: An electronic component mounting board, including: a substrate base made of a flat-plate-like elastic body, the substrate base having a plurality of through-holes in a manner spaced a predetermined distance apart from each other; conductive members, each of which has a main unit portion filled in the through-hole, the main unit portion having a first protrusion portion and a second protrusion portion respectively on a first end and a second end thereof, with the first protrusion portion arranged so as to protrude from a first surface of the substrate base and the second protrusion portion arranged so as to protrude from a second surface of the substrate base; a flexible substrate that is arranged on the first surface of the substrate base and that has first opening portions for penetration of the first protrusion portions; and a plurality of oval electrodes arranged on the substrate, each of which has a second opening portion for penetration of the first protrusion portion, in which the electrodes are arranged in a manner spaced apart from each other, and each of the second opening portions is formed on a first end side of each of the electrodes.

    摘要翻译: 一种电子部件安装板,包括:由平板状弹性体制成的基板基板,所述基板基部具有彼此隔开预定距离的多个通孔; 导电构件,每个导电构件具有填充在通孔中的主单元部分,主单元部分分别在第一端部和第二端部上分别具有第一突出部分和第二突出部分,第一突出部分布置成 从基板基板的第一表面突出并且第二突出部分布置成从基板基底的第二表面突出; 柔性基板,布置在基板基体的第一表面上,并且具有用于使第一突出部分穿透的第一开口部分; 以及布置在所述基板上的多个椭圆形电极,每个所述椭圆形电极具有用于使所述第一突起部分穿透的第二开口部分,其中所述电极以彼此间隔开的方式布置,并且每个所述第二开口部分 形成在每个电极的第一端侧。