摘要:
There is provided a connecting rod including a connecting rod body and a cap having excellent alignment properties, and a method of producing such a connecting rod. A connecting rod body and a cap are produced through the steps of molding green compacts respectively corresponding to the connecting rod body and the cap; sintering and unifying both the green compacts; forging the resultant sintered product in a mold; and fracturing the resultant forged product. The green compact corresponding to the cap and/or the green compact corresponding to the connecting rod body includes opposite circumferential end faces formed with one or more projection. A clearance c is formed between both circumferential end faces of the sintered product due to the projection. With this clearance c, both the circumferential end faces are formed with recesses and projections which are fitted to each other during the forging process and which are relatively large and thus have large biting amounts. During the fracturing process, the recesses and the projections are separated into two pieces.
摘要:
A silica powder containing an ultrafine powder in an amount of from 0.1 to 20 mass % and having an average sphericity of at least 0.85, wherein the ultrafine powder has, as the particle size measured by a dynamic light scattering particle size distribution measuring apparatus, an average particle size of from 150 to 250 nm, less than 10 mass % of the ultrafine powder having a particle size of at most 100 nm being less than 10 mass % (not including 0 mass %) and from 10 to 50 mass % of the ultrafine powder having a particle size exceeding 100 nm and not exceeding 150 nm.
摘要:
A semiconductor encapsulation material which exhibits a low viscosity and further improved moldability in encapsulation even when highly loaded with an inorganic filler; an amorphous siliceous powder suitable for the preparation of a resin composition useful as the encapsulation material; and a process for the production of the amorphous siliceous powder. An amorphous siliceous powder having a content of Si and Al of 99.5 mass % or above in terms of oxides, wherein the Al content in the particle size region of 15 μm to less than 70 μm is 100 to 30000 ppm in terms of oxides; the Al content in the particle size region of 3 μm to less than 15 μm is 100 to 7000 ppm in terms of oxides; and the Al content in the whole particle size region is 100 to 25000 ppm in terms of oxides. It is preferable that the (A)/(B) ratio of the Al content (A) in the particle size region of 15 μm to less than 70 μm to the Al content (B) in the particle size region of 3 μm to less than 15 μm be 1.0 to 20.
摘要:
A semiconductor encapsulation material which exhibits a low viscosity and further improved moldability in encapsulation even when highly loaded with an inorganic filler; an amorphous siliceous powder suitable for the preparation of a resin composition useful as the encapsulation material; and a process for the production of the amorphous siliceous powder. An amorphous siliceous powder having a content of Si and Al of 99.5 mass % or above in terms of oxides, wherein the Al content in the particle size region of 15 μm to less than 70 μm is 100 to 30000 ppm in terms of oxides; the Al content in the particle size region of 3 μm to less than 15 μm is 100 to 7000 ppm in terms of oxides; and the Al content in the whole particle size region is 100 to 25000 ppm in terms of oxides. It is preferable that the (A)/(B) ratio of the Al content (A) in the particle size region of 15 μm to less than 70 μm to the Al content (B) in the particle size region of 3 μm to less than 15 μm be 1.0 to 20.
摘要:
To provide a silica powder which is excellent in flowability and packing properties and which is less likely to form a flash, a process for its production, and a composition having it incorporated in at least one of a rubber and a resin, particularly a sealing material.A silica powder containing an ultrafine powder in an amount of from 0.1 to 20 mass % and having an average sphericity of at least 0.85, wherein the ultrafine powder has, as the particle size measured by a dynamic light scattering particle size distribution measuring apparatus, an average particle size of from 150 to 250 nm, a content of particles having a particle size of at most 100 nm being less than 10 mass % (not including 0 mass %) and a content of particles having a particle size exceeding 100 nm and not exceeding 150 nm being from 10 to 50 mass %. A process for producing a silica powder, which comprises spraying a silica powder material to a high temperature zone of at least 1,750° C. formed by a burner for heat treatment, wherein the high temperature zone is formed in a range of from the forward end of the burner to 3.0-4.5 m therefrom, and to such a high temperature zone, a silica powder material containing from 0.05 to 10 mass % of a metal silicon powder is sprayed. A sealing material employing the silica powder of the present invention.
摘要:
The problem of the present invention is to provide a cosmetic composition, which has a moisturizing effect, and whose ability to inhibit hyaluronidase activity is high. According to the present invention, by using one or more substances selected from sulfated cellulose and a salt thereof in combination with polyhydric alcohol, the moisturizing effect of sulfated cellulose and the ability to inhibit hyaluronidase activity can be further improved, and thereby the above-described problem can be solved. In addition, the present invention can provide a cosmetic composition having excellent stability through inclusion of an electrolyte having pH buffering ability.