公开(公告)号：US20210014429A1

公开(公告)日：2021-01-14

申请号：US17013287

申请日：2020-09-04

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Jukka Alasirnio ,  Tobias Senn ,  Ohad Meitav ,  Moshe Doron ,  Alireza Yasan ,  Mario Cesana ,  Florin Cutu ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Perez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: H04N5/247 ,  G03B37/04 ,  G03B35/08 ,  G03B15/05 ,  G03B17/12 ,  G02B13/00 ,  H04N5/225 ,  H04N5/33

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

公开(公告)号：US10771714B2

公开(公告)日：2020-09-08

申请号：US15121459

申请日：2015-02-23

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Jukka Alasirniö ,  Tobias Senn ,  Ohad Meitav ,  Moshe Doron ,  Alireza Yasan ,  Mario Cesana ,  Florin Cutu ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Perez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: H04N5/247 ,  G03B37/04 ,  G03B35/08 ,  G03B15/05 ,  G03B17/12 ,  G02B13/00 ,  H04N5/225 ,  H04N5/33

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

公开(公告)号：US11575843B2

公开(公告)日：2023-02-07

申请号：US17013287

申请日：2020-09-04

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Jukka Alasirnio ,  Tobias Senn ,  Ohad Meitav ,  Moshe Doron ,  Alireza Yasan ,  Mario Cesana ,  Florin Cutu ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Perez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: H04N5/247 ,  G03B37/04 ,  G03B35/08 ,  G03B15/05 ,  G03B17/12 ,  G02B13/00 ,  H04N5/225 ,  H04N5/33

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

公开(公告)号：US10459187B2

公开(公告)日：2019-10-29

申请号：US14970795

申请日：2015-12-16

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Jukka Alasirniö ,  Tobias Senn ,  Markus Rossi ,  Hartmut Rudmann ,  Ohad Meitav ,  Moshe Doron ,  Kai Engelhardt

IPC: G02B7/02 ,  G02B7/00

Abstract: Optical assemblies include a stack of optical elements each of which has one or more alignment features. Each alignment feature traces a respective curve along a surface of one of the optical elements. The alignment feature(s) of one optical element fit within the alignment feature(s) of the other. In some cases, the alignment features can help establish more precise lateral alignment of the optical elements.

公开(公告)号：US10349037B2

公开(公告)日：2019-07-09

申请号：US15300997

申请日：2015-03-31

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Moshe Doron ,  Ohad Meitav ,  Markus Rossi ,  Dmitry Ryuma ,  Alireza Yasan

IPC: H04N13/25 ,  H04N5/225 ,  H04N5/33 ,  G06T7/521 ,  G06T7/593

Abstract: The present disclosure describes structured-stereo imaging assemblies including separate imagers for different wavelengths. The imaging assembly can include, for example, multiple imager sub-arrays, each of which includes a first imager to sense light of a first wavelength or range of wavelengths and a second imager to sense light of a different second wavelength or range of wavelengths. Images acquired from the imagers can be processed to obtain depth information and/or improved accuracy. Various techniques are described that can facilitate determining whether any of the imagers or sub-arrays are misaligned.

公开(公告)号：US10299724B2

公开(公告)日：2019-05-28

申请号：US14787448

申请日：2014-04-28

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Ohad Meitav

IPC: A61B5/1455 ,  A61B5/02 ,  A61B5/00 ,  A61B5/0205 ,  A61B5/024

Abstract: A wristwatch includes a case containing electronic components of the wristwatch. An optoelectronic module including at least one light emitting element and at least one light sensing element is disposed within the case or within a fastener for the wristwatch. The optoelectronic module is operable to obtain physiological data of a person wearing the wristwatch by using the light emitting element and the light sensing element.