公开(公告)号：US10566468B2

公开(公告)日：2020-02-18

申请号：US16086868

申请日：2017-03-23

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Martin Lukas Balimann ,  Matthias Gloor ,  Philippe Bouchilloux ,  Jukka Alasirniö ,  Hartmut Rudmann ,  Nicola Spring

IPC: H01L31/02 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/0232 ,  H05K1/02 ,  H01L31/024 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L51/52 ,  H01S5/022 ,  H01S5/024 ,  H01L31/18

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

公开(公告)号：US10459187B2

公开(公告)日：2019-10-29

申请号：US14970795

申请日：2015-12-16

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Jukka Alasirniö ,  Tobias Senn ,  Markus Rossi ,  Hartmut Rudmann ,  Ohad Meitav ,  Moshe Doron ,  Kai Engelhardt

IPC: G02B7/02 ,  G02B7/00

Abstract: Optical assemblies include a stack of optical elements each of which has one or more alignment features. Each alignment feature traces a respective curve along a surface of one of the optical elements. The alignment feature(s) of one optical element fit within the alignment feature(s) of the other. In some cases, the alignment features can help establish more precise lateral alignment of the optical elements.

公开(公告)号：US10890733B2

公开(公告)日：2021-01-12

申请号：US15564255

申请日：2016-04-05

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Jukka Alasirniö ,  Kyu Won Hwang ,  Hartmut Rudmann

IPC: H04N5/225 ,  G02B7/09 ,  G03B3/10 ,  G03B17/12 ,  G02B7/02

Abstract: The present disclosure describes image sensor modules that can include auto focus control. The modules also include features that can help reduce or eliminate tilt of the module's optical sub-assembly with respect to the plane of the image sensor. In some instances, the modules include features to facilitate highly precise positioning of the optical sub-assembly, and also can result in modules having a very small z height.

公开(公告)号：US10771714B2

公开(公告)日：2020-09-08

申请号：US15121459

申请日：2015-02-23

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Jukka Alasirniö ,  Tobias Senn ,  Ohad Meitav ,  Moshe Doron ,  Alireza Yasan ,  Mario Cesana ,  Florin Cutu ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Perez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: H04N5/247 ,  G03B37/04 ,  G03B35/08 ,  G03B15/05 ,  G03B17/12 ,  G02B13/00 ,  H04N5/225 ,  H04N5/33

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

公开(公告)号：US10438984B2

公开(公告)日：2019-10-08

申请号：US15958494

申请日：2018-04-20

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Jukka Alasirniö

IPC: H01L27/146 ,  H01L31/0232 ,  H04N5/225 ,  H01L27/148

Abstract: The disclosure describes customizable optoelectronic modules and methods for standardizing a plurality of the customizable optoelectronic modules. The customizable optoelectronic modules can be configured to mitigate dimensional variations and misalignments in a number of their respective constituent components such as optical assemblies and sensor covers. The customizable optoelectronic modules and methods for standardizing a plurality of the customizable optoelectronic modules can obviate the need for binning during manufacturing thereby saving considerable resources such as time and expense.