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    OLED WITH PASS-THROUGH HOLE
    2.
    发明公开
    OLED WITH PASS-THROUGH HOLE 审中-公开

    公开(公告)号：US20240049498A1

    公开(公告)日：2024-02-08

    申请号：US18340523

    申请日：2023-06-23

    申请人： OLEDWorks GmbH

    发明人： Michael BOROSON ,  Thomas HOEGEN

    IPC分类号： H10K50/84 ,  H10K50/805 ,  H10K50/844 ,  H10K71/00

    CPC分类号： H10K50/84 ,  H10K50/805 ,  H10K50/844 ,  H10K71/00

    摘要： A fully encapsulated OLED panel with a first area for light emission which entirely surrounds a non-light emitting second area with a pass-through hole with cut edges comprising: a substrate that extends throughout the first area and second areas to the cut edges of the pass-through hole; a first electrode over the substrate located at least in the first area; at least one organic layer for light emission located over the first electrode in the first area but is not present in the second area; a second electrode located over the at least one organic layer in at least in the first area; encapsulation at least located over the second electrode in first area, over the second area and extends at least partially into the cut-edges of the pass-through hole; and wherein the area of the pass-through hole is smaller than the second area so that the second area entirely surrounds the pass-through hole. Arranging a smaller pass-through hole within a larger non-light emitting area enables encapsulation within the pass-through hole.

    Ultrathin OLED lighting panel
    3.
    发明授权
    Ultrathin OLED lighting panel 有权

    公开(公告)号：US11506363B2

    公开(公告)日：2022-11-22

    申请号：US16954933

    申请日：2019-01-09

    申请人： OLEDWorks GmbH

    发明人： Manfred Ruske ,  Konrad Sell ,  Thomas Hoegen ,  Joerg Knipping

    IPC分类号： F21V19/00 ,  F21V15/01 ,  H01L51/50 ,  H01L51/52 ,  H05K1/02 ,  H05K1/18 ,  F21Y115/15

    摘要： A flexible lighting panel comprising a light-emitting unit with electrical contact pads on a flexible substrate; a flat flexible printed circuit board with a bendable extension tab, wherein the circuit board is located on the opposite side of the light-emitting unit from the substrate; the area of the circuit board, not including the extension tab, is the same or greater than and overlaps the emissive area of the light-emitting unit; and the circuit board has at least two flat electrical connectors in electrical contact with the contact pads of the light-emitting unit; the flat electrical connectors extending along the extension tab of the circuit board for connection to a power source. The light emitting unit can be an OLED. The extension tab can be bent so that the flat electrical connections become accessible in different orientations. The panel can be ultrathin.

    Light emitting device with improved internal out-coupling and method of providing the same
    5.
    发明授权
    Light emitting device with improved internal out-coupling and method of providing the same 有权
    具有改进的内部输出耦合的发光器件及其提供方法

    公开(公告)号：US09349994B2

    公开(公告)日：2016-05-24

    申请号：US14441683

    申请日：2013-10-25

    申请人： OLEDWORKS GMBH

    发明人： Georg Friedrich Gaertner ,  Gerardus Henricus Rietjens ,  Joanna Maria Elisabeth Baken ,  Johannes 'T Hart ,  Hans-Peter Loebl

    IPC分类号： H01L33/00 ,  H01L21/00 ,  H01L51/52 ,  H01L51/00 ,  H01L51/56

    CPC分类号： H01L51/5275 ,  H01L51/0096 ,  H01L51/5209 ,  H01L51/5215 ,  H01L51/56 ,  H01L2251/308

    摘要： The present invention relates to a method of manufacturing a light emitting device with improved internal out-coupling by providing an intermediate layer (11) with a modulated surface. This is achieved by exposure of a flat glass surface (100) to a saturated etching fluid or by providing local changes in the chemical surface composition of the glass substrate or by depositing locally separated sub-μm particles. By removal of the etching fluid, either ultrafine particles (12) are deposited or defects are generated consisting of glass component areas of sub^m-size extension with a high sticking coefficient with respect to the species deposited later on from the gas phase. These ultrafine particles or defects induce locally different growth by different sticking coefficients, with preferential columnar cone shaped growth, leading to small bumps (14) on the top surface of the intermediate layer (11), which are then over-coated with the layers (200) of the light emitting element and induce sufficient scattering by subsequent reflections.

    摘要翻译： 本发明涉及通过提供具有调制表面的中间层（11）来制造具有改进的内部输出耦合的发光器件的方法。 这是通过将平坦玻璃表面（100）暴露于饱和蚀刻流体或通过提供玻璃基板的化学表面组成的局部变化或通过沉积局部分离的亚微米颗粒来实现的。 通过去除蚀刻流体，沉积超细颗粒（12）或由相对于稍后从气相沉积的物质具有高粘附系数的亚尺寸延伸的玻璃组分区域产生缺陷。 这些超细颗粒或缺陷通过不同的粘附系数诱导局部不同的生长，具有优选的柱状锥形生长，导致在中间层（11）的顶表面上的小凸起（14），然后将其覆盖层 200），并通过随后的反射诱导足够的散射。

    ELECTRONIC DEVICE, DEVICE DRIVER, AND DRIVING METHOD
    9.
    发明申请
    ELECTRONIC DEVICE, DEVICE DRIVER, AND DRIVING METHOD 有权
    电子设备，设备驱动器和驱动方法

    公开(公告)号：US20170019974A1

    公开(公告)日：2017-01-19

    申请号：US15124546

    申请日：2015-03-10

    申请人： OLEDWORKS GMBH

    发明人： Christophß Rickers

    IPC分类号： H05B33/08 ,  H01L33/38 ,  H01L51/52 ,  H01L23/544

    CPC分类号： H05B33/0896 ,  H01L23/544 ,  H01L33/38 ,  H01L51/52 ,  H01L51/5209 ,  H01L51/5225 ,  H01L2223/54413 ,  H01L2223/54493 ,  H05B33/0848

    摘要： An electronic device is provided in which a dedicated area of the device substrate is patterned to form a resistive track so that it can be contacted by a readout arrangement. The resistive track is used to encode information. The information is provided to a driver which can then derive information about the type of device being driven. The driver can thus be controlled accordingly.

    摘要翻译： 提供了一种电子器件，其中将器件基板的专用区域图案化以形成电阻轨迹，使得其可以通过读出装置接触。 电阻轨迹用于对信息进行编码。 该信息被提供给驱动器，然后可以获得关于被驱动的设备的类型的信息。 因此可以相应地控制驾驶员。

    ENCAPSULATED SEMICONDUCTOR DEVICE AND ENCAPSULATION METHOD
    10.
    发明申请
    ENCAPSULATED SEMICONDUCTOR DEVICE AND ENCAPSULATION METHOD 有权
    封装半导体器件和封装方法

    公开(公告)号：US20160343988A1

    公开(公告)日：2016-11-24

    申请号：US15112104

    申请日：2015-01-13

    申请人： KONINKLIJKE PHILIPS N.V.

    发明人： Jens Meyer ,  Rainald Manfred Gierth ,  Stefan Peter Grabowski ,  Herbert Lifka ,  Peter Van De Weijer ,  Petrus Cornelis-Paulus Bouten ,  Volker Lambert Van Elsbergen ,  Manfred Stephan Ruske ,  Soren Hartmann

    IPC分类号： H01L51/52 ,  H01L51/44 ,  H01L51/00

    CPC分类号： H01L51/5256 ,  H01L51/0097 ,  H01L51/448 ,  H01L2251/5338 ,  H01L2251/566

    摘要： The present invention relates to an encapsulated semiconductor device (20) provided on a flexible substrate (1), a method of providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1) and a software product for providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1). In a preferred embodiment, an encapsulation method is presented in which the organic layer (3) of an inorganic/organic/inorganic multilayer barrier (5) on a plastic foil (1) as a substrate is removed at the edges of an OLED (13). The edges are subsequently sealed with a standard TFE process to encapsulate the OLED (13). This enables cuttable OLEDs (20) that are cut out of a larger plastic substrate (1) and gives a method to reduce side leakage in OLEDs (20) that have been manufactured in a roll-to-toll process.

    摘要翻译： 本发明涉及一种设置在柔性基板（1）上的封装半导体器件（20），一种在柔性基板（1）上提供至少部分封装的半导体器件（20）的方法和用于提供在 在柔性基板（1）上的最小部分封装的半导体器件（20）。 在一个优选的实施方案中，提出了一种封装方法，其中在作为衬底的塑料箔（1）上的无机/有机/无机多层屏障（5）的有机层（3）在OLED（13 ）。 随后用标准TFE工艺密封边缘以封装OLED（13）。 这使得能够从更大的塑料基板（1）切出的可切割OLED（20）并且提供了一种减少已经在卷到卷收工艺中制造的OLED（20）中的侧漏的方法。