公开(公告)号：US20140284795A1

公开(公告)日：2014-09-25

申请号：US14011930

申请日：2013-08-28

申请人： SK hynix Inc.

发明人： Sang Eun LEE ,  Chang Il KIM

IPC分类号： H01L23/00

CPC分类号： H01L24/06 ,  H01L23/13 ,  H01L23/49883 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/06155 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/245 ,  H01L2224/24997 ,  H01L2224/25175 ,  H01L2224/2612 ,  H01L2224/27436 ,  H01L2224/27442 ,  H01L2224/29015 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/8201 ,  H01L2224/82097 ,  H01L2224/82105 ,  H01L2224/82138 ,  H01L2224/82143 ,  H01L2224/82385 ,  H01L2224/82815 ,  H01L2224/8291 ,  H01L2224/83138 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

摘要： Various embodiments are directed to a semiconductor package and a method for manufacturing the same. A semiconductor package includes the following: a substrate having a plurality of connection pads; a semiconductor chip provided with a plurality of bonding pads on a first surface thereof and attached onto the substrate in a face-down position so that the bonding pads are positioned right above the corresponding connection pads; and thermoplastic conductive members introduced between the substrate and the semiconductor chip such that the bonding pad and the corresponding connection pad may be electrically connected.

摘要翻译： 各种实施例涉及半导体封装及其制造方法。 半导体封装包括以下：具有多个连接焊盘的衬底; 半导体芯片，其在其第一表面上设置有多个接合焊盘，并以面朝下的位置附接到所述基板上，使得所述接合焊盘位于相应的连接焊盘的正上方; 以及引入在基板和半导体芯片之间的热塑性导电构件，使得焊盘和相应的连接焊盘可以电连接。