公开(公告)号：US11961819B2

公开(公告)日：2024-04-16

申请号：US17435041

申请日：2020-03-04

申请人： SHINKAWA LTD.

发明人： Naoki Sekine ,  Yasuo Nagashima

IPC分类号： B23K20/00 ,  H01L23/00 ,  B23K101/40

CPC分类号： H01L24/78 ,  B23K20/005 ,  B23K2101/40 ,  H01L2224/7855 ,  H01L2224/78611 ,  H01L2224/78824 ,  H01L2224/78901

摘要： A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails (183a, 283a, 383a) formed in continuation to a first bonding point can be prevented from coming into contact with each other.

公开(公告)号：US11908827B2

公开(公告)日：2024-02-20

申请号：US17435041

申请日：2020-03-04

申请人： SHINKAWA LTD.

发明人： Naoki Sekine ,  Yasuo Nagashima

IPC分类号： B23K20/00 ,  H01L23/00 ,  B23K101/40

CPC分类号： H01L24/78 ,  B23K20/005 ,  B23K2101/40 ,  H01L2224/7855 ,  H01L2224/78611 ,  H01L2224/78824 ,  H01L2224/78901

摘要： A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails (183a, 283a, 383a) formed in continuation to a first bonding point can be prevented from coming into contact with each other.

公开(公告)号：US09337166B2

公开(公告)日：2016-05-10

申请号：US14081104

申请日：2013-11-15

申请人： Shinkawa Ltd.

发明人： Yoshihito Hagiwara ,  Naoki Sekine ,  Koichi Takahashi ,  Yasuo Nagashima ,  Motoki Nakazawa

IPC分类号： H01L23/00 ,  H01L25/065

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/78621 ,  H01L2224/78802 ,  H01L2224/78804 ,  H01L2224/85047 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/95 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： Provided is a wire bonding apparatus capable of performing high-speed wedge wire bonding, the apparatus including: a bonding tool having a through hole and a pressing surface for pressing a wire; a clamper for holding the wire; and a control unit. The control unit includes: wire tail extension unit that moves the bonding tool, after wedge bonding of the wire to a first lead, upward and along a second straight line connecting a second pad and a second lead, and causes the wire to extend from the through hole in a direction along the second straight line from the second pad to the second lead; and tail cut unit that, after causing the wire tail to extend, cuts the wire tail by moving the bonding tool in the direction along the second straight line connecting the second pad and the second lead while the clamper is closed.

摘要翻译： 提供一种能够进行高速楔形丝接合的引线接合装置，该装置包括：具有通孔和用于按压线的按压表面的接合工具; 夹持电线的夹持器; 和控制单元。 所述控制单元包括：线尾延伸单元，其在将所述线材楔形接合到第一引线之后向上并沿着连接第二焊盘和第二引线的第二直线移动所述接合工具，并且使所述线材从所述第二引线延伸 沿着从第二衬垫到第二引线的第二直线的方向的通孔; 以及尾部切割单元，其在使所述线尾延伸之后，在所述夹持器关闭的同时沿着连接所述第二焊盘和所述第二引线的所述第二直线的方向移动所述焊接工具来切割所述线尾。

公开(公告)号：US09793236B2

公开(公告)日：2017-10-17

申请号：US14712932

申请日：2015-05-15

申请人： SHINKAWA LTD.

发明人： Naoki Sekine ,  Motoki Nakazawa ,  Yasuo Nagashima

IPC分类号： B23K31/02 ,  H01L23/00 ,  B23K20/00 ,  B23K20/10

CPC分类号： H01L24/78 ,  B23K20/005 ,  B23K20/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78343 ,  H01L2224/78901 ,  H01L2224/85186 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/013 ,  H01L2924/20753 ,  H01L2224/4554

摘要： Provided is a wire-bonding apparatus (10) including: a capillary (28) through which a wire (30) inserted; and a controller (80). The controller (80) is configured to execute operations including: a disconnection operation, after the second bonding operation, of moving the capillary through which the wire is inserted within a horizontal plane vertical to an axial direction of the capillary while the wire is held in the clamped state, and thereby disconnecting the wire from the second bonding point; a preliminary bonding operation of feeding the wire from the second bonding point to a predetermined preliminary bonding point, and performing preliminary bonding at the preliminary bonding point; and a shaping operation, after the preliminary bonding operation, of shaping the wire projecting from a tip of the capillary into a predetermined flexed shape.

公开(公告)号：US09379086B2

公开(公告)日：2016-06-28

申请号：US14883629

申请日：2015-10-15

申请人： SHINKAWA LTD.

发明人： Shinji Kumamoto ,  Naoki Sekine ,  Motoki Nakazawa ,  Yasuo Nagashima

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L25/00

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2225/06506 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device includes a common wire that sequentially connects three or more pads; bonding portions at which a side surface of the wire is bonded to the pads; and looping portions looped from the bonding portions onto the other pads adjacent to the pads, the bonding portions and the looping portions are formed alternately. When the pads are recessed from the surface of semiconductor chips, the common wire is crushed to a thickness greater than the recess depth of the pads to be made into a flat shape. Thus, on the semiconductor device, wire connection is performed with a smaller bonding count while reducing damage to the semiconductor chips, and at the same time bonding is performed efficiently to the electrodes recessed from the surface of the semiconductor chips.

摘要翻译： 半导体器件包括顺序地连接三个或更多个焊盘的公共线; 将导线的侧面接合到焊盘的接合部分; 以及从接合部分环绕到邻近焊盘的其它焊盘的环形部分，接合部分和环形部分交替地形成。 当焊盘从半导体芯片的表面凹陷时，普通焊丝被压制成大于焊盘的凹陷深度的厚度，以使其成为平坦的形状。 因此，在半导体器件上，以更小的接合数进行导线连接，同时减少对半导体芯片的损伤，并且同时对从半导体芯片的表面凹陷的电极有效地进行接合。