-
公开(公告)号：US12057431B2
公开(公告)日：2024-08-06
申请号：US17550729
申请日：2021-12-14
发明人： Basil Milton , Romeo Olida , Jonathan Geller , Tomer Levinson
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , H01L24/43 , H01L24/78 , H01L2224/4383 , H01L2224/43985 , H01L2224/7825 , H01L2224/78343 , H01L2224/7855 , H01L2224/85035 , H01L2224/85047 , H01L2224/85205
摘要： A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to a position above the wire bond; (c) moving the wire bonding tool to contact the length of wire, at a position along the length of wire, to partially sever the length of wire at the position along the length of wire; and (d) separating the length of wire from a wire supply at the position along the length of wire, thereby providing a wire interconnect structure bonded to the bonding location.
-
公开(公告)号：US08053906B2
公开(公告)日：2011-11-08
申请号：US12501285
申请日：2009-07-10
申请人： Hsiao Chuan Chang , Tsung Yueh Tsai , Yi Shao Lai , Ho Ming Tong , Jian Cheng Chen , Wei Chi Yih , Chang Ying Hung , Cheng Tsung Hsu , Chih Cheng Hung
发明人： Hsiao Chuan Chang , Tsung Yueh Tsai , Yi Shao Lai , Ho Ming Tong , Jian Cheng Chen , Wei Chi Yih , Chang Ying Hung , Cheng Tsung Hsu , Chih Cheng Hung
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05624 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/73265 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85047 , H01L2224/85201 , H01L2224/85365 , H01L2224/85947 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/48824 , H01L2924/00012
摘要： A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.
摘要翻译： 铜接合线包括线部分和非球形块部分。 非球形块部分物理连接到线路部分，非球形块部分的横截面面积大于线路部分的横截面面积。
-
公开(公告)号：US08048720B2
公开(公告)日：2011-11-01
申请号：US12375238
申请日：2008-01-30
CPC分类号： H01L24/85 , H01L21/6835 , H01L23/4952 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/32225 , H01L2224/4809 , H01L2224/48095 , H01L2224/48247 , H01L2224/48455 , H01L2224/4846 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48511 , H01L2224/49171 , H01L2224/73265 , H01L2224/78302 , H01L2224/78901 , H01L2224/85001 , H01L2224/85045 , H01L2224/85047 , H01L2224/85051 , H01L2224/85181 , H01L2224/85186 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85399 , H01L2224/85947 , H01L2224/85986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2224/45099 , H01L2224/48227 , H01L2924/00 , H01L2224/4554
摘要： A method of forming a wire loop is provided. The method includes: (1) forming a first fold of wire; (2) bonding the first fold of wire to a first bonding location to form a first bond; (3) extending a length of wire, continuous with the first bond, between (a) the first bond and (b) a second bonding location; and (4) bonding a portion of the wire to the second bonding location to form a second bond.
摘要翻译： 提供一种形成线环的方法。 该方法包括：（1）形成线的第一折叠; （2）将所述第一折叠线接合到第一接合位置以形成第一接合; （3）在（a）第一键和（b）第二结合位置之间延伸一段与第一键连续的线的长度; 和（4）将所述导线的一部分接合到所述第二接合位置以形成第二接合。
-
公开(公告)号：US20100007009A1
公开(公告)日：2010-01-14
申请号：US12501285
申请日：2009-07-10
申请人： Hsiao Chuan CHANG , Tsung Yueh TSAI , Yi Shao LAI , Ho Ming TONG , Jian Cheng CHEN , Wei Chi YIH , Chang Ying HUNG , Cheng Tsung HSU , Chih Cheng HUNG
发明人： Hsiao Chuan CHANG , Tsung Yueh TSAI , Yi Shao LAI , Ho Ming TONG , Jian Cheng CHEN , Wei Chi YIH , Chang Ying HUNG , Cheng Tsung HSU , Chih Cheng HUNG
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L24/85 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05624 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/73265 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85047 , H01L2224/85201 , H01L2224/85365 , H01L2224/85947 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/48824 , H01L2924/00012
摘要： A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.
摘要翻译： 铜接合线包括线部分和非球形块部分。 非球形块部分物理连接到线路部分，非球形块部分的横截面面积大于线路部分的横截面面积。
-
公开(公告)号：US20080185737A1
公开(公告)日：2008-08-07
申请号：US12024470
申请日：2008-02-01
CPC分类号： H01L24/85 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/05554 , H01L2224/43 , H01L2224/45014 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48451 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/49175 , H01L2224/78301 , H01L2224/85009 , H01L2224/85045 , H01L2224/85047 , H01L2224/85181 , H01L2224/85205 , H01L2224/85947 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599 , H01L2924/206
摘要： An integrated circuit system is provided including forming a wire ball on a bond wire; forming a shaped ball from the wire ball; and attaching the shaped ball on an integrated circuit die.
摘要翻译： 提供一种集成电路系统，包括在接合线上形成线球; 从丝球形成成形球; 并将成形球附接到集成电路管芯上。
-
公开(公告)号：US20170179075A1
公开(公告)日：2017-06-22
申请号：US15370999
申请日：2016-12-06
发明人： Yoh SATO
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , B23K20/007 , B23K20/10 , B23K20/2333 , B23K2101/32 , B23K2101/36 , B23K2103/10 , B23K2103/12 , B23K2103/18 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05624 , H01L2224/45147 , H01L2224/45565 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/45676 , H01L2224/48453 , H01L2224/48465 , H01L2224/48824 , H01L2224/78301 , H01L2224/85035 , H01L2224/85045 , H01L2224/85047 , H01L2224/85051 , H01L2224/85181 , H01L2224/85986 , H01L2924/00014 , H01L2924/30101 , H01L2924/35121
摘要： With this copper wire joining method, a rubbed portion on which a coating remains between an electrode and a core wire is formed on the electrode. Then, after a capillary is moved away from the rubbed portion, and a ball is formed by melting a copper wire at a tip end of the capillary. Next, the ball is joined to the rubbed portion by pressing the ball against the rubbed portion.
-
公开(公告)号：US20160163673A1
公开(公告)日：2016-06-09
申请号：US15045758
申请日：2016-02-17
申请人： Shinkawa Ltd.
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0655 , H01L25/0657 , H01L2224/04042 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2224/49173 , H01L2224/49175 , H01L2224/73265 , H01L2224/78301 , H01L2224/7855 , H01L2224/78621 , H01L2224/78802 , H01L2224/78804 , H01L2224/85047 , H01L2224/851 , H01L2224/85181 , H01L2224/85186 , H01L2224/85205 , H01L2224/95 , H01L2225/06506 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01082 , H01L2924/12041 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： Provided is a wire bonding apparatus capable of performing high-speed wedge wire bonding, the apparatus including: a bonding tool having a through hole and a pressing surface for pressing a wire; a clamper for holding the wire; and a control unit. The control unit includes: wire tail extension unit that moves the bonding tool, after wedge bonding of the wire to a first lead, upward and along a second straight line connecting a second pad and a second lead, and causes the wire to extend from the through hole in a direction along the second straight line from the second pad to the second lead; and tail cut unit that, after causing the wire tail to extend, cuts the wire tail by moving the bonding tool in the direction along the second straight line connecting the second pad and the second lead while the clamper is closed.
摘要翻译： 提供一种能够进行高速楔形丝接合的引线接合装置，该装置包括：具有通孔和用于按压线的按压表面的接合工具; 夹持电线的夹持器; 和控制单元。 所述控制单元包括：线尾延伸单元，其在将所述线材楔形接合到第一引线之后向上并沿着连接第二焊盘和第二引线的第二直线移动所述接合工具，并且使所述线材从所述第二引线延伸 沿着从第二衬垫到第二引线的第二直线的方向的通孔; 以及尾部切割单元，其在使所述线尾延伸之后，通过在所述夹持器关闭的同时沿着连接所述第二焊盘和所述第二引线的所述第二直线的方向移动所述焊接工具来切割所述线尾。
-
公开(公告)号：US20140138426A1
公开(公告)日：2014-05-22
申请号：US14081104
申请日：2013-11-15
申请人： Shinkawa Ltd.
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0655 , H01L25/0657 , H01L2224/04042 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2224/49173 , H01L2224/49175 , H01L2224/73265 , H01L2224/78301 , H01L2224/7855 , H01L2224/78621 , H01L2224/78802 , H01L2224/78804 , H01L2224/85047 , H01L2224/851 , H01L2224/85181 , H01L2224/85186 , H01L2224/85205 , H01L2224/95 , H01L2225/06506 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01082 , H01L2924/12041 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： Provided is a wire bonding apparatus capable of performing high-speed wedge wire bonding, the apparatus including: a bonding tool having a through hole and a pressing surface for pressing a wire; a clamper for holding the wire; and a control unit. The control unit includes: wire tail extension unit that moves the bonding tool, after wedge bonding of the wire to a first lead, upward and along a second straight line connecting a second pad and a second lead, and causes the wire to extend from the through hole in a direction along the second straight line from the second pad to the second lead; and tail cut unit that, after causing the wire tail to extend, cuts the wire tail by moving the bonding tool in the direction along the second straight line connecting the second pad and the second lead while the clamper is closed.
摘要翻译： 提供一种能够进行高速楔形丝接合的引线接合装置，该装置包括：具有通孔和用于按压线的按压面的接合工具; 夹持电线的夹持器; 和控制单元。 所述控制单元包括：线尾延伸单元，其在将所述线材楔形接合到第一引线之后向上并沿着连接第二焊盘和第二引线的第二直线移动所述接合工具，并且使所述线材从所述第二引线延伸 沿着从第二衬垫到第二引线的第二直线的方向的通孔; 以及尾部切割单元，其在使所述线尾延伸之后，在所述夹持器关闭的同时沿着连接所述第二焊盘和所述第二引线的所述第二直线的方向移动所述焊接工具来切割所述线尾。
-
公开(公告)号：US20100230809A1
公开(公告)日：2010-09-16
申请号：US12375238
申请日：2008-01-30
CPC分类号： H01L24/85 , H01L21/6835 , H01L23/4952 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/32225 , H01L2224/4809 , H01L2224/48095 , H01L2224/48247 , H01L2224/48455 , H01L2224/4846 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48511 , H01L2224/49171 , H01L2224/73265 , H01L2224/78302 , H01L2224/78901 , H01L2224/85001 , H01L2224/85045 , H01L2224/85047 , H01L2224/85051 , H01L2224/85181 , H01L2224/85186 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85399 , H01L2224/85947 , H01L2224/85986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2224/45099 , H01L2224/48227 , H01L2924/00 , H01L2224/4554
摘要： A method of forming a wire loop is provided. The method includes: (1) forming a first fold of wire; (2) bonding the first fold of wire to a first bonding location to form a first bond; (3) extending a length of wire, continuous with the first bond, between (a) the first bond and (b) a second bonding location; and (4) bonding a portion of the wire to the second bonding location to form a second bond.
摘要翻译： 提供一种形成线环的方法。 该方法包括：（1）形成线的第一折叠; （2）将所述第一折叠线接合到第一接合位置以形成第一接合; （3）在（a）第一键和（b）第二结合位置之间延伸一段与第一键连续的线的长度; 和（4）将所述导线的一部分接合到所述第二接合位置以形成第二接合。
-
公开(公告)号：US20240363583A1
公开(公告)日：2024-10-31
申请号：US18765653
申请日：2024-07-08
发明人： Basil Milton , Romeo Olida , Jonathan Geller , Tomer Levinson
IPC分类号： H01L23/00
CPC分类号： H01L24/85 , H01L24/43 , H01L24/78 , H01L2224/4383 , H01L2224/43985 , H01L2224/7825 , H01L2224/78343 , H01L2224/7855 , H01L2224/85035 , H01L2224/85047 , H01L2224/85205
摘要： A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to a position above the wire bond; (c) moving the wire bonding tool to contact the length of wire, at a position along the length of wire, to partially sever the length of wire at the position along the length of wire; and (d) separating the length of wire from a wire supply at the position along the length of wire, thereby providing a wire interconnect structure bonded to the bonding location.
-
-
-
-
-
-
-
-
-
搜索结果
23 条记录 (耗时 0.014 秒)
