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公开(公告)号：US20240105672A1
公开(公告)日：2024-03-28
申请号：US17921618
申请日：2021-07-06
申请人： SHINKAWA LTD.
发明人： Shigeru HAYATA , Osamu KAKUTANI
IPC分类号： H01L23/00
CPC分类号： H01L24/78 , H01L24/85 , H01L2224/78001 , H01L2224/78304 , H01L2224/78353 , H01L2224/78702 , H01L2224/78753 , H01L2224/85123 , H01L2224/8518 , H01L2224/859 , H01L2924/40
摘要： A wire bonding apparatus includes: a capillary, performing predetermined processing on a workpiece and movable with respect to the workpiece; an optical mechanism, moving together with the capillary; and a controller. The optical mechanism includes: a first imaging unit, acquiring a first image obtained by imaging a standard point set within an imaging range; and a second imaging unit, acquiring a second image obtained by imaging a reference point formed at a predetermined distance from the capillary. The controller positions the capillary with respect to the workpiece based on the first image, and calculates a positioning correction amount of the capillary based on the second image.
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公开(公告)号：US20180090464A1
公开(公告)日：2018-03-29
申请号：US15716525
申请日：2017-09-27
申请人： SHINKAWA LTD.
发明人： Shigeru HAYATA , Satoshi ENOKIDO
CPC分类号： H01L24/78 , B23K1/06 , B23K3/08 , B23K20/007 , B23K20/26 , B23K35/0261 , B23K2101/40 , B23K2101/42 , H01L2224/78621 , H01L2224/78701 , H01L2224/78702 , H01L2224/78753
摘要： In order to easily and accurately measure an offset for wire bonding and improve precision of wire bonding, a wiring bonding apparatus includes a first imaging unit, a bonding tool, a moving mechanism, a reference member, a second imaging unit arranged on the opposite side to the bonding tool and the first imaging unit with respect to a reference surface, and a control unit. The first imaging unit detects a position of an optical axis of the first image capture unit with respect to a position of the reference member, the second imaging unit detects the position of the reference member when moving the bonding tool above the reference member according to pre-stored offset values, and detects a position of a ball-shaped tip section of a wire, and the control unit measures a change in offset between the bonding tool and the first imaging unit based on each detection result.
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公开(公告)号：US08746537B2
公开(公告)日：2014-06-10
申请号：US14059572
申请日：2013-10-22
CPC分类号： B23K20/004 , B23K20/10 , H01L24/37 , H01L24/45 , H01L24/77 , H01L24/78 , H01L24/84 , H01L24/85 , H01L31/188 , H01L2224/37124 , H01L2224/37139 , H01L2224/37147 , H01L2224/45014 , H01L2224/773 , H01L2224/77313 , H01L2224/77315 , H01L2224/77316 , H01L2224/77321 , H01L2224/77343 , H01L2224/77352 , H01L2224/77611 , H01L2224/77702 , H01L2224/783 , H01L2224/78313 , H01L2224/78315 , H01L2224/78316 , H01L2224/78321 , H01L2224/78343 , H01L2224/78352 , H01L2224/78611 , H01L2224/78702 , H01L2224/8412 , H01L2224/84205 , H01L2224/8512 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , Y02E10/50 , H01L2224/45099 , H01L2924/01026 , H01L2924/04563 , H01L2924/00012
摘要： An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.
摘要翻译： 提供超声波接合系统。 超声波接合系统包括接合头组件和用于将导电接合材料接合到工件的接合工具。 超声波接合系统还包括适于压靠工件的按压构件，该按压构件由接合头组件支撑，并且能够相对于接合头组件可独立于接合工具而移动。 按压构件包括主体部分和在主体部分下方延伸的多个按压元件，按压元件构造成接触工件。
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公开(公告)号：US20140048584A1
公开(公告)日：2014-02-20
申请号：US14059572
申请日：2013-10-22
CPC分类号： B23K20/004 , B23K20/10 , H01L24/37 , H01L24/45 , H01L24/77 , H01L24/78 , H01L24/84 , H01L24/85 , H01L31/188 , H01L2224/37124 , H01L2224/37139 , H01L2224/37147 , H01L2224/45014 , H01L2224/773 , H01L2224/77313 , H01L2224/77315 , H01L2224/77316 , H01L2224/77321 , H01L2224/77343 , H01L2224/77352 , H01L2224/77611 , H01L2224/77702 , H01L2224/783 , H01L2224/78313 , H01L2224/78315 , H01L2224/78316 , H01L2224/78321 , H01L2224/78343 , H01L2224/78352 , H01L2224/78611 , H01L2224/78702 , H01L2224/8412 , H01L2224/84205 , H01L2224/8512 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , Y02E10/50 , H01L2224/45099 , H01L2924/01026 , H01L2924/04563 , H01L2924/00012
摘要： An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.
摘要翻译： 提供超声波接合系统。 超声波接合系统包括接合头组件和用于将导电接合材料接合到工件的接合工具。 超声波接合系统还包括适于压靠工件的按压构件，该按压构件由接合头组件支撑，并且能够相对于接合头组件可独立于接合工具而移动。 按压构件包括主体部分和在主体部分下方延伸的多个按压元件，按压元件构造成接触工件。
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