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1.发明授权公开(公告)号：US11363726B2
公开(公告)日：2022-06-14
申请号：US17027927
申请日：2020-09-22
发明人： Lin-Jie Gao , Yong-Chao Wei
摘要： A circuit board includes a multilayer wiring board including a first wiring board and a second wiring board. A receiving cavity penetrates the second wiring board and corresponds to at least one connecting pad of the first wiring board. The receiving cavity includes a receiving portion penetrating the second wiring board and a plurality of recessed portions. Each recessed portion penetrates the second wiring board and is recessed from an inner wall defining the receiving portion. A width of each recessed portion gradually increases from a surface of the second wiring board facing the first wiring board toward a surface of the second wiring board facing away from the first wiring board. An electronic component is received in the receiving cavity and electrically connected to the at least one connecting pad. An adhesive fills in a gap between the electronic component and the second wiring board.
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2.发明授权公开(公告)号：US11589463B2
公开(公告)日：2023-02-21
申请号：US17330972
申请日：2021-05-26
申请人： Avary Holding (Shenzhen) Co., Limited. , QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD , GARUDA TECHNOLOGY CO., LTD.
发明人： Jia-He Li , Yong-Chao Wei
摘要： A method for manufacturing a circuit board including the following steps: providing a flexible double-sided metal-clad laminate including a first metal foil, a flexible dielectric layer, and a second metal foil. A carrier is attached to the second metal foil. A first wiring layer including a first wiring region and a second wiring region is formed by the first metal foil. The first wiring region includes a first connecting pad, and the second wiring region includes a connecting pad. A plurality of rigid dielectric blocks surrounded to form an interval and a first groove exposing the first connecting pad is pressed on the flexible dielectric layer to form a rigid dielectric layer. An electronic component is fixed the first groove. The carrier is removed. The intermediate structure is bent along the interval and pressed. A second wiring layer is formed by the second metal foil.
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公开(公告)号：US11257773B1
公开(公告)日：2022-02-22
申请号：US17000660
申请日：2020-08-24
发明人： Yong-Chao Wei , Lin-Jie Gao , Wei-Liang Wu
IPC分类号： H01L23/66 , H01L23/552 , H01L23/367 , H01L23/498 , H01L21/48 , H01Q1/22
摘要： A package circuit structure includes a metal board including a first surface and a second surface, a plurality of embedded components, an insulating layer, and two antenna circuit boards. At least one first groove is recessed from the first surface. At least one second groove is recessed from the second surface. The first groove and the second groove are spaced with each other along a first direction perpendicular to a thickness direction of the metal board. Each embedded component is mounted in the first groove or the second groove. The insulating layer covers the first surface and the second surface and fills the first groove and the second groove. The antenna circuit boards are respectively stacked on two opposite sides of the insulating layer. Each antenna circuit board includes at least one antenna and at least one ground wiring. The metal board is electrically connected to each ground wiring.
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公开(公告)号：US11699671B2
公开(公告)日：2023-07-11
申请号：US17711252
申请日：2022-04-01
发明人： Yong-Chao Wei , Jia-He Li
IPC分类号： H01L23/552 , H01L23/66 , H01L23/00 , H01L21/48
CPC分类号： H01L23/66 , H01L21/4882 , H01L23/552 , H01L24/29 , H01L24/83 , H01L2223/6677
摘要： A packaged antenna circuit structure suitable for 5G use includes a shielding layer, an electronic component, conductive pillars, a first insulation layer, a first stacked structure, an antenna structure, and a second stacked structure. The shielding layer defines a groove to receive the electronic component. The conductive pillars on the shielding layer surround the groove. The first insulation layer covers the shielding layer, the electronic component, and the conductive pillars. The first stacked structure is stacked on a side of the first insulation layer and includes a ground line connecting to the conductive pillars. The antenna structure is stacked on a side of the first stacked structure away from the first insulation layer and connected to the electronic component by the first stacked structure. The second stacked structure is stacked on a side of the first insulation layer away from the first stacked structure.
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公开(公告)号：US11322463B2
公开(公告)日：2022-05-03
申请号：US17030528
申请日：2020-09-24
发明人： Yong-Chao Wei , Jia-He Li
IPC分类号： H01L23/552 , H01L23/66 , H01L23/00 , H01L21/48
摘要： A packaged antenna circuit structure suitable for 5G use includes a shielding layer, an electronic component, conductive pillars, a first insulation layer, a first stacked structure, an antenna structure, and a second stacked structure. The shielding layer defines a groove to receive the electronic component. The conductive pillars on the shielding layer surround the groove. The first insulation layer covers the shielding layer, the electronic component, and the conductive pillars. The first stacked structure is stacked on a side of the first insulation layer and includes a ground line connecting to the conductive pillars. The antenna structure is stacked on a side of the first stacked structure away from the first insulation layer and connected to the electronic component by the first stacked structure. The second stacked structure is stacked on a side of the first insulation layer away from the first stacked structure.
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公开(公告)号：US11212922B2
公开(公告)日：2021-12-28
申请号：US16767870
申请日：2019-04-23
发明人： Ming-Jaan Ho , Xian-Qin Hu , Fu-Yun Shen , Hsiao-Ting Hsu , Yong-Chao Wei
摘要： The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.
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7.发明授权公开(公告)号：US11178777B2
公开(公告)日：2021-11-16
申请号：US16550601
申请日：2019-08-26
发明人： Yong-Chao Wei , Yong-Quan Yang
摘要： A component embedded circuit board includes a printed circuit board, a dielectric layer, and an antenna structure laminated in that order. The printed circuit board includes a first opening and a first circuit layer, and the first circuit layer includes at least one first connecting pad. A second opening is defined in the dielectric layer. A conductive structure is embedded in the dielectric layer. The second opening penetrates the dielectric layer. The antenna structure includes a first ground layer. A component is embedded in the first opening. One end of the conductive structure is connected to the first ground layer, and the other end of the conductive structure is connected to the first connecting pad. The second opening corresponds to the first opening. A gap is generated by the second opening and the component. A method for manufacturing the package circuit structure is also disclosed.
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公开(公告)号：US11665833B2
公开(公告)日：2023-05-30
申请号：US17527320
申请日：2021-11-16
发明人： Ming-Jaan Ho , Xian-Qin Hu , Fu-Yun Shen , Hsiao-Ting Hsu , Yong-Chao Wei
CPC分类号： H05K3/4644 , H05K1/111 , H05K3/04 , H05K3/107 , H05K3/4614 , H05K2201/0394 , H05K2201/09563
摘要： A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.
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公开(公告)号：US10764992B1
公开(公告)日：2020-09-01
申请号：US16522829
申请日：2019-07-26
发明人： Yong-Chao Wei , Lin-Jie Gao , Han-Pei Huang
摘要： A circuit board with anti-EMI proofing for each component on the board includes a first outer wiring layer, electronic components mounted on the first outer wiring layer, and at least one electromagnetic shielding unit. Each electromagnetic shielding unit has a shielding layer and conductive posts formed on the shielding layer, the shielding layer and conductive posts defining a receiving space to house and shield one electronic component. An adhesive layer formed on the first outer wiring layer bonds each electromagnetic shielding unit to the first outer wiring layer.
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10.发明授权公开(公告)号：US11324115B1
公开(公告)日：2022-05-03
申请号：US17106363
申请日：2020-11-30
申请人： QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD , Avary Holding (Shenzhen) Co., Limited. , GARUDA TECHNOLOGY CO., LTD
发明人： Yong-Chao Wei
摘要： A circuit board includes a wiring board. The wiring board includes a first wiring layer, a dielectric layer and a second wiring layer stacked, and a plurality of spaced conductive pillars. Each conductive pillar connects the first wiring layer and the second wiring layer. A groove is recessed from a side of the dielectric layer facing away from the second wiring layer, and includes first recessed portion and at least two spaced second recessed portions recessed from a sidewall of the first recessed portion. An end surface of each conductive pillar is exposed from the at least two spaced second recessed portions, and a sidewall of each pillar close to the first recessed portion is exposed from the second recessed portion. At least one electronic component is received in the first recessed portion, and is connected to the conductive pillars through electrical connecting portions received in the second recessed portions.
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