公开(公告)号：US5961032A

公开(公告)日：1999-10-05

申请号：US884977

申请日：1997-06-30

申请人： James H. Covell, II ,  Shaji Farooq ,  Peter A. Gruber ,  Sudipta K. Ray

发明人： James H. Covell, II ,  Shaji Farooq ,  Peter A. Gruber ,  Sudipta K. Ray

IPC分类号： B22C9/22 ,  B23K3/06 ,  B23K35/02 ,  H01L21/60 ,  H01L23/12 ,  H01L23/50 ,  H05K3/34 ,  B23K35/012 ,  B23K31/002 ,  B22C9/020

CPC分类号： H05K3/3468 ,  B22C9/22 ,  B23K3/0607 ,  B23K35/0222 ,  B23K2201/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K2201/0379 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H05K3/3463

摘要： A method is described for forming solder mounds for attachment to electronic devices. The solder mounds are preferably in the form of columns and comprise a first solder portion and a second solder portion with the two solder portions having different melting points. The solder columns are preferably formed using an injection molding device. The method is directed to the use of a single column mold to form the multi-solder column. In one embodiment, deformable material is used to partially block a portion of the through opening of the mold during a first solder injection process. The deformable material is then removed and the remainder of the through openings of the mold filled with a second molten solder. The multi-solder column is then electrically connected to a substrate by reflowing.

摘要翻译： 描述了用于形成用于附接到电子设备的焊接凸块的方法。 焊料块优选为柱状，并且包括第一焊料部分和第二焊料部分，其中两个焊料部分具有不同的熔点。 焊料柱优选使用注射成型装置形成。 该方法涉及使用单柱模具来形成多焊料柱。 在一个实施例中，可变形材料用于在第一次焊接注入过程期间部分地阻挡模具的通孔的一部分。 然后去除可变形材料，并且模具的通孔的其余部分填充有第二熔融焊料。 然后通过回流将多焊料柱电连接到衬底。