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    Synchronized XY laser scanner
    5.
    发明授权
    Synchronized XY laser scanner 失效
    同步XY激光扫描仪

    公开(公告)号：US5504612A

    公开(公告)日：1996-04-02

    申请号：US443634

    申请日：1995-05-18

    申请人： Joshua M. Cobb ,  James H. Covell, II ,  Franz X. Topolovec ,  Uldis A. Ziemins

    发明人： Joshua M. Cobb ,  James H. Covell, II ,  Franz X. Topolovec ,  Uldis A. Ziemins

    IPC分类号： B41J2/44 ,  B23K26/08 ,  G02B26/10 ,  H01L21/027 ,  H01L21/268 ,  G02B26/08

    CPC分类号： G02B26/101 ,  Y10S359/90

    摘要： An apparatus and method are disclosed for laser raster scanning a substrate in an XY plane wherein a single motor is used to provide synchronized X-Y scanning by two mirrors positioned orthogonally and which move linearly in an XY plane relative to each other by the rotation of the motor shaft. A preferred embodiment uses a specially designed cam to provide back and forth laser scanning motion and an intermittent gear to provide indexing of the laser. The apparatus and method may be configured for various scan speeds, spot sizes, Y-axis indexing and X-axis scan at the object plane. Over scanning of the active XY area of the object plane is preferred to provide constant velocity and energy density over the active XY area.

    摘要翻译： 公开了用于在XY平面中激光光栅扫描基板的装置和方法，其中使用单个电机来提供通过正交定位的两个反射镜同步的XY扫描，并且通过电动机的旋转在XY平面中相对于彼此线性移动 轴。 优选实施例使用专门设计的凸轮来提供来回激光扫描运动和间歇齿轮以提供激光的分度。 该装置和方法可以被配置用于在物平面处的各种扫描速度，光斑尺寸，Y轴分度和X轴扫描。 在对象平面的主动XY区域的扫描是优选的，以在主动XY区域上提供恒定的速度和能量密度。

    Apparatus and method for continuous casting solder onto discrete parts
    6.
    发明授权
    Apparatus and method for continuous casting solder onto discrete parts 失效
    将焊料连续铸造到分立零件上的装置和方法

    公开(公告)号：US5971058A

    公开(公告)日：1999-10-26

    申请号：US876140

    申请日：1997-06-13

    申请人： Lannie R. Bolde ,  James H. Covell, II

    发明人： Lannie R. Bolde ,  James H. Covell, II

    IPC分类号： B23K3/06 ,  H05K3/34 ,  B22D33/04

    CPC分类号： B23K3/0607 ,  H05K3/3457 ,  B23K2201/40 ,  H05K2203/0113 ,  H05K2203/1545

    摘要： An apparatus and method are provided for continuously injecting molten solder into a plurality of molds for transfer of the formed solder mounds to electronic devices such as multilayer ceramic packages. A conventional injection molding apparatus is employed with a specially designed apparatus for forming the molds and preferably with a specially designed mold to provide a continuous molding process. The apparatus is preferably of a U-shaped configuration whereby molds are advanced under the molten solder reservoir and injection head by a preceding mold in the apparatus. The urging action of the preceding mold on the succeeding mold and, preferably in conjunction with the preferred mold design, enables a continuous method and apparatus for injecting molten solder into a plurality of molds. The preferred mold design utilizes an upper plate having mold opening, and a lower substrate or backing plate, with the length and width of the upper plate being slightly longer than the length and width of the lower substrate or late.

    摘要翻译： 提供了一种装置和方法，用于将熔融焊料连续地注入多个模具中，以将形成的焊料块转移到电子器件如多层陶瓷封装。 常规的注射成型装置采用专门设计的用于形成模具的装置，优选地具有专门设计的模具以提供连续的模制工艺。 该装置优选为U形构造，由此模具在熔融的焊料储存器和注射头的前方通过前述的模具在装置中前进。 前一模具在后续模具上的推动作用，优选结合优选的模具设计，能够实现将熔融焊料注入多个模具中的连续方法和设备。 优选的模具设计利用具有模具开口的上板和下基板或背板，上板的长度和宽度比下基板的长度和宽度稍长，或较晚。