CMP formulations
    2.
    发明授权
    CMP formulations 有权
    CMP配方

    公开(公告)号:US06364920B1

    公开(公告)日:2002-04-02

    申请号:US09553664

    申请日:2000-04-21

    IPC分类号: C09K314

    CPC分类号: C09K3/1463 C09G1/02

    摘要: CMP formulations comprising alumina particles and an iodate oxidizer can be stabilized against pH drift during use by acidification using an organic acid. Formulation pH stability can be further enhanced by treating the formulation at an elevated temperature before it is used.

    摘要翻译: 包含氧化铝颗粒和碘酸盐氧化剂的CMP配方可以在使用期间通过使用有机酸的酸化来稳定,防止pH漂移。 制剂pH稳定性可以在使用前在高温下处理制剂进一步增强。

    Ceria powder
    3.
    发明授权
    Ceria powder 失效
    二氧化铈粉

    公开(公告)号:US06238450B1

    公开(公告)日:2001-05-29

    申请号:US09553968

    申请日:2000-04-21

    IPC分类号: C04B3550

    摘要: A polishing slurry, useful in optical or CMP applications, comprises a ceria with a BET surface area of at least 10 m2/gm. The slurry may be made by subjecting a commercial ceria slurry comprising agglomerates to a mechano-chemical treatment at a pH of from 9 to 11 using media that are low purity alpha alumina or zirconia. Preferred slurries maintain a positive surface charge at all pH values. CMP slurries preferably comprise in addition an anionic surfactant to aid in removal of surface residues.

    摘要翻译: 可用于光学或CMP应用的抛光浆料包含BET表面积至少为10m 2 / gm的二氧化铈。 可以通过使用低纯度α氧化铝或氧化锆的介质,使包含附聚物的商业二氧化铈浆料在pH为9至11的机械化学处理下进行制备浆料。 优选的浆料在所有pH值下保持正表面电荷。 CMP浆料优选还包含阴离子表面活性剂以帮助除去表面残留物。