摘要:
A new method and apparatus for detecting and measuring the level of metal present on the surface of a substrate is achieved. Energy, in the form of rf or light or microwave energy, is directed at the surface of a wafer, the reflected energy or the energy that passes through the semiconductor substrate is captured and analyzed for energy level and/or frequency content. Based on this analysis conclusions can be drawn regarding presence and type of metal on the surface of the wafer. Furthermore, by inclusion of metal within the resonating circuit of an rf generator changes the frequency of the vibration and therefore detects the presence of metal.
摘要:
Disclosed are methods and apparatus for automatically filtering out physical defects from electrical defects that are found during a voltage contrast inspection of a test structure on a semiconductor device.
摘要:
A new method is provided for identifying Voltage Contrast that is applied for the evaluation of characteristics of deposition of thin layers of semiconductor material. The voltage contrast is enhanced by applying increased electron beam current, provided by either E-beam or ion-beam current, to the point under investigation.
摘要:
A plurality of measuring positions on a sample are sequentially irradiated with electron beams having identical cross sectional shapes, currents produced in the sample when the individual measuring positions are irradiated with electron beams are measured and the measured currents or physical amounts derived from the measured currents are displayed on a two-dimensional plane as a function of measuring position.
摘要:
One embodiment disclosed relates to a method for electron beam inspection of a semiconductor circuit to identify a defect path using a hyper-extracting field. The method includes scanning the semiconductor circuit with a primary electron beam, applying a hyper-extracting field sufficient to achieve a junction breakdown, detecting intensities of electrons hyper-extracted from the semiconductor circuit during the scanning, and identifying a defect path from the hyper-extracted intensities. Another embodiment disclosed relates to a method that includes identifying both a normally extracting voltage contrast defect and a normally retarding voltage contrast defect by using the hyper-extracting field. Another embodiment disclosed relates to an apparatus for electron beam inspection of a semiconductor circuit to identify a defect path using a hyper-extracting field. Another embodiment disclosed relates to an apparatus for identifying both a normally extracting voltage contrast defect and a normally retarding voltage contrast defect by using the hyper-extracting field.
摘要:
In order to obtain optimum irradiation conditions of an electron beam according to the material and structure of a circuit pattern to be inspected and the kind of a failure to be detected and inspect under the optimum conditions without delay of the inspection time, an inspection device for irradiating the electron beam 19 to the sample board 9 which is a sample, detecting generated secondary electrons by the detector 7, storing obtained signals sequentially in the storage, comparing the same pattern stored in the storage by the comparison calculation unit, and extracting a failure by comparing the predetermined threshold value with the comparison signal by the failure decision unit is provided, wherein the optimum value of the irradiation energy is stored in the data base inside the device beforehand according to the structure of a sample and a recommended value of the irradiation energy suited to inspection can be searched for by inputting or selecting the irradiation energy by a user or inputting information regarding the structure of an article to be inspected.
摘要:
Defects in a patterned substrate are detected by inspection with a charged particle beam inspection tool which generates an image of a portion of the patterned substrate and compares the image with a reference in order to identify any defects in the patterned substrate. Parameters of the tool are optimized to improve image uniformity and contrast, particularly voltage contrast. Prior to imaging an area of the substrate, the tool charges an area surrounding the image area to eliminate or reduce the effects caused by asymmetrical charging in the surrounding area. The tool alternates between charging the surrounding area and imaging the image area to produce a plurality of images of the image area, which are then averaged. The result is a highly uniform image with improved contrast for accurate defect detection.
摘要:
A testing system comprising an electron beam probe, a photon beam probe, and a device under test (DUT) card holder which is positioned between the electron beam probe and the photon beam probe. A first valve is positioned between the electron beam probe and the DUT. A second valve, located on an opposite side of the DUT from the first valve, is positioned between the photon beam probe and the DUT. The first and second valve operate in cooperation to control the pressure surrounding the DUT card. One embodiment of the invention includes a first test chamber and a second test chamber. The first test chamber includes the area between the first side of the DUT card and the first valve. The second test chamber includes the area between the second side of the DUT card and the second valve. The present invention includes a method for using the test system of the present invention to test both the top and bottom surfaces of a semiconductor device. The method for using the test system manipulates the first valve and the second valve to selectively contain a vacuum pressure throughout the first test chamber and the area surrounding the DUT. The present invention includes a method for preparing an integrated circuit (IC) for testing by the testing system of the present invention. The present invention also includes a DUT card which secures and positions the DUT for testing within the testing system.
摘要:
An E-beam generator and detector arrangement sends an electron beam through a series of differentially evacuated vacuum chambers of small size to detect faulty circuitry in individual semiconductor devices. The vacuum chambers are open to one end and are sealed by the semiconductor device without contacting the vacuum chambers. A laser generator is operated by a control system with the E-beam generator and detector arrangement to provide a laser beam in a known physical relationship to the electron beam to correct detected faulty circuitry in the semiconductor devices. The E-beam generator and detector arrangement confirms the correction without further handling of the semiconductor device.
摘要:
A method and associated apparatus for creating a defect knowledge library containing case study information of wafer defects on semiconductor wafers. The method comprises creating a database entry that contains a case study of a specific defect including defect information that comprises one or more defect images and storing the database entry for subsequent access. The database entries are stored on a server and are accessible by a plurality of clients.