公开(公告)号：US06693246B1

公开(公告)日：2004-02-17

申请号：US10088956

申请日：2002-03-22

申请人： Gerd Rudolph ,  Holger Besier

发明人： Gerd Rudolph ,  Holger Besier

IPC分类号： H01K900

CPC分类号： H01H23/003 ,  H01H2300/01

摘要： A rocker switch for one two-stage actuating stroke, especially in the form of a window control switch for a motor vehicle. The rocker switch includes a rocker button which is mounted in a housing. An actuating plate for acting on switching contacts that are connected to terminal contacts is associated with said rocker button. A switching contact is allocated to the actuating stroke of the first stage in each direction, respectively and a common switching contact is allocated to the actuating stroke of the second stage in each direction, respectively.

摘要翻译： 用于一个两级致动行程的摇臂开关，特别是用于机动车辆的窗口控制开关的形式。 摇臂开关包括安装在壳体中的摇杆按钮。 用于作用于连接到端子触点的开关触头上的致动板与所述摇臂按钮相关联。 分别将开关触点分配给第一级的致动行程，并且在每个方向上分别将公共开关触点分配给第二级的启动行程。

公开(公告)号：US06253451B1

公开(公告)日：2001-07-03

申请号：US09266061

申请日：1999-03-10

申请人： Ralph A. E. M. Semmeling ,  Andrew G. Meller

发明人： Ralph A. E. M. Semmeling ,  Andrew G. Meller

IPC分类号： H01K900

CPC分类号： H01R13/24 ,  H01R12/7076 ,  H01R12/714 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49208 ,  Y10T29/49217 ,  Y10T29/49222

摘要： An electrical connector which includes an insulative body which has a leg portion and a top portion which extends generally perpendicularly from the leg second portion. A conductive contact which includes a retention section and a resilient section is also included in the electrical connector. The contact is fixed to the top section and the resilient section extends along the leg section. The connector may be interposed between a electrical device and a printed circuit board.

摘要翻译： 一种电连接器，包括具有腿部的绝缘体和从腿部第二部分大致垂直延伸的顶部。 包括保持部分和弹性部分的导电触点也包括在电连接器中。 触头固定在顶部，弹性部分沿腿部延伸。 连接器可以插入在电气设备和印刷电路板之间。

公开(公告)号：US06765807B1

公开(公告)日：2004-07-20

申请号：US10135553

申请日：2002-04-30

申请人： Kenneth J. Neeld ,  Terry W. Louth

发明人： Kenneth J. Neeld ,  Terry W. Louth

IPC分类号： H01K900

CPC分类号： H05K9/0062

摘要： An apparatus is provided for reducing or eliminating a gap defined between adjacent components of an electronic system, thereby reducing electromagnetic interference generated by the electronic system. The apparatus includes a cam having a cam surface positionable adjacent a component of the electronic system. The cam is moveable to an actuated position in which the cam surface applies a force to the component. The apparatus further includes a support mountable to the electronic system. The support engages the cam and facilitates the movement of the cam. The movement of the cam with respect to the support and into the actuated position causes the cam surface to apply the force to the component, thereby reducing or eliminating a gap between the component and an adjacent component of the electronic system.

摘要翻译： 提供了一种用于减少或消除在电子系统的相邻部件之间限定的间隙的装置，从而减少由电子系统产生的电磁干扰。 该装置包括具有可邻近电子系统的部件定位的凸轮表面的凸轮。 凸轮可移动到致动位置，在该致动位置，凸轮表面向部件施加力。 该装置还包括可安装到电子系统的支撑件。 支撑件接合凸轮并促进凸轮的移动。 凸轮相对于支撑件和致动位置的运动导致凸轮表面将力施加到部件上，从而减少或消除部件和电子系统的相邻部件之间的间隙。

公开(公告)号：US06539624B1

公开(公告)日：2003-04-01

申请号：US09277797

申请日：1999-03-27

申请人： Ling-Chen Kung ,  Kuo-Chuan Chen ,  Ruoh-Huey Uang ,  Szu-Wei Lu

发明人： Ling-Chen Kung ,  Kuo-Chuan Chen ,  Ruoh-Huey Uang ,  Szu-Wei Lu

IPC分类号： H01K900

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/1147 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49208 ,  Y10T29/49213 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/013

摘要： A method for forming a wafer level package that is equipped with solder balls on a top surface and encapsulated by a stress buffer layer of an elastomeric material is disclosed. The method can be carried by first forming a plurality of solder balls on bond pads provided on a top surface of a wafer and then forming an elastomeric material layer, or any other flexible, compliant material layer to encapsulate the solder balls. The tip portions of the solder balls is then substantially exposed by an etching process of either dry etching or wet etching such that the solder balls can be connected electrically to a circuit board. The present invention further provides a wafer level package that is formed with solder balls on a top surface encapsulated in an elastomeric material layer. The elastomeric material layer serves both as a stress buffer and a thermal expansion buffer such that the integrity and reliability of IC devices severed from the wafer can be maintained.

摘要翻译： 公开了一种用于形成在顶表面上装有焊球并由弹性材料的应力缓冲层封装的晶片级封装的方法。 该方法可以通过首先在设置在晶片的顶表面上的接合焊盘上形成多个焊球，然后形成弹性体材料层或任何其它柔性柔顺材料层以包封焊球。 然后通过干蚀刻或湿蚀刻的蚀刻工艺基本上暴露焊球的尖端部分，使得焊球可以电连接到电路板。 本发明还提供一种晶片级封装，其在封装在弹性体材料层中的顶表面上形成有焊球。 弹性体材料层既用作应力缓冲器又用作热膨胀缓冲器，从而可以保持从晶片切断的IC器件的完整性和可靠性。

公开(公告)号：US06201182B1

公开(公告)日：2001-03-13

申请号：US09139654

申请日：1998-08-25

申请人： Anthony Michael Sosnowski

发明人： Anthony Michael Sosnowski

IPC分类号： H01K900

CPC分类号： H05K9/0015 ,  F16B5/0664 ,  F16B21/086 ,  F16B21/088

摘要： A mounting system includes a wall having at least one hole formed therein, and a track having at least one barb extending from a first surface of the track, the track having a second surface on an opposite side of the track from the first surface. The at least one barb is wider than the at least one hole and is sufficiently resiliently compressible to be passed through the at least one hole in one direction and expand to prevent removal of the barb in a second direction, thereby securing the track relative to the wall.

摘要翻译： 安装系统包括具有形成在其中的至少一个孔的壁，以及具有从轨道的第一表面延伸的至少一个倒钩的轨道，轨道具有与轨道相对的第一表面与第一表面相对的第二表面。 所述至少一个倒钩比所述至少一个孔宽，并且具有足够的弹性可压缩性，以在一个方向上穿过所述至少一个孔并膨胀以防止在第二方向上移除所述倒钩，从而将所述轨道相对于 壁。