公开(公告)号：US06539624B1

公开(公告)日：2003-04-01

申请号：US09277797

申请日：1999-03-27

申请人： Ling-Chen Kung ,  Kuo-Chuan Chen ,  Ruoh-Huey Uang ,  Szu-Wei Lu

发明人： Ling-Chen Kung ,  Kuo-Chuan Chen ,  Ruoh-Huey Uang ,  Szu-Wei Lu

IPC分类号： H01K900

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/1147 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49208 ,  Y10T29/49213 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/013

摘要： A method for forming a wafer level package that is equipped with solder balls on a top surface and encapsulated by a stress buffer layer of an elastomeric material is disclosed. The method can be carried by first forming a plurality of solder balls on bond pads provided on a top surface of a wafer and then forming an elastomeric material layer, or any other flexible, compliant material layer to encapsulate the solder balls. The tip portions of the solder balls is then substantially exposed by an etching process of either dry etching or wet etching such that the solder balls can be connected electrically to a circuit board. The present invention further provides a wafer level package that is formed with solder balls on a top surface encapsulated in an elastomeric material layer. The elastomeric material layer serves both as a stress buffer and a thermal expansion buffer such that the integrity and reliability of IC devices severed from the wafer can be maintained.

摘要翻译： 公开了一种用于形成在顶表面上装有焊球并由弹性材料的应力缓冲层封装的晶片级封装的方法。 该方法可以通过首先在设置在晶片的顶表面上的接合焊盘上形成多个焊球，然后形成弹性体材料层或任何其它柔性柔顺材料层以包封焊球。 然后通过干蚀刻或湿蚀刻的蚀刻工艺基本上暴露焊球的尖端部分，使得焊球可以电连接到电路板。 本发明还提供一种晶片级封装，其在封装在弹性体材料层中的顶表面上形成有焊球。 弹性体材料层既用作应力缓冲器又用作热膨胀缓冲器，从而可以保持从晶片切断的IC器件的完整性和可靠性。

公开(公告)号：US06440836B1

公开(公告)日：2002-08-27

申请号：US09268785

申请日：1999-03-16

申请人： Szu-Wei Lu ,  Ling-Chen Kung ,  Ruoh-Huey Uang ,  Hsu-Tien Hu

发明人： Szu-Wei Lu ,  Ling-Chen Kung ,  Ruoh-Huey Uang ,  Hsu-Tien Hu

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/1147 ,  H01L2224/13111 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00014

摘要： The present invention discloses a dual-photoresist method for forming fine-pitched solder bumps on flip chips by utilizing two separate layers of photoresist, i.e., a first thin photoresist layer for patterning the BLM layers on top of the aluminum bonding pads and a second thick photoresist layer for patterning the via openings on top of the BLM layers to supply the necessary thickness required for the solder bumps. The first, thin photoresist layer permits an accurate imaging process to be conducted without focusing problems which are normally associated with thick photoresist layers. As an optional step, the present invention may further utilize a thin layer of non-leachable metal such as Cu or Ni for coating on top of the BLM layer and thus further improving the electrical characteristics of the solder bumps subsequently formed thereon. A majority of the BLM layer is removed with the first, thin photoresist layer and thus, in the final BLM removal process, only a very thin adhesion sublayer of the BLM layer needs to be removed and as a result, ensures a clean removal process without damaging the solder bumps already formed with a fine-pitch.

摘要翻译： 本发明公开了一种双光致抗蚀剂方法，用于通过利用两个单独的光致抗蚀剂层（即，用于在铝接合焊盘的顶部上构图BLM层的第一薄光致抗蚀剂层）和倒装芯片上的第二厚度 光刻胶层，用于图案化BLM层顶部的通孔，以提供焊料凸块所需的必要厚度。 第一个薄的光致抗蚀剂层允许进行精确的成像处理，而不需要通常与厚的光致抗蚀剂层相关的聚焦问题。 作为可选步骤，本发明可以进一步利用薄层的不可浸出金属如Cu或Ni涂覆在BLM层的顶部上，从而进一步改善随后在其上形成的焊料凸块的电特性。 BLM层的大部分用第一个薄的光致抗蚀剂层去除，因此在最终的BLM去除过程中，仅需要除去BLM层的非常薄的粘合子层，结果确保清洁的去除过程而不需要 损坏已经形成有微细间距的焊料凸块。

公开(公告)号：US06268114B1

公开(公告)日：2001-07-31

申请号：US09156353

申请日：1998-09-18

申请人： Ying-Nan Wen ,  Ling-Chen Kung ,  Szu-Wei Lu ,  Ruoh-Huey Uang

发明人： Ying-Nan Wen ,  Ling-Chen Kung ,  Szu-Wei Lu ,  Ruoh-Huey Uang

IPC分类号： G03C500

CPC分类号： H01L24/03 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/1147 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014

摘要： A method for forming solder balls that have larger spacings between them and electronic devices containing such solder balls are disclosed. In the method, an additional layer of a leachable metal such as gold or silver is used between an under bump metallurgy layer and a solder bump subsequently formed. This allows the formation of the under bump metallurgy layer prior to the deposition of the solder material into a window formed in a photoresist layer. The present invention allows the underfill of a solder window, instead of an overfill which is normally required in a conventional method.

摘要翻译： 公开了一种用于形成它们之间具有较大间距的焊球和包含这种焊球的电子器件的方法。 在该方法中，在下凸块冶金层和随后形成的焊料凸块之间使用附加的可浸出金属如金或银的层。 这允许在将焊料材料沉积到形成在光致抗蚀剂层中的窗口之前形成凸块下金属层。 本发明允许焊接窗口的底部填充物，而不是常规方法通常需要的过度填充。

公开(公告)号：US06179200B2

公开(公告)日：2001-01-30

申请号：US09243031

申请日：1999-02-03

申请人： Ling-Chen Kung ,  Hsu-Tien Hu ,  Ruoh-Huey Uang ,  Szu-Wei Lu ,  Chun-Yi Kuo

发明人： Ling-Chen Kung ,  Hsu-Tien Hu ,  Ruoh-Huey Uang ,  Szu-Wei Lu ,  Chun-Yi Kuo

IPC分类号： B23K3512

CPC分类号： B23K3/06 ,  B23K2101/40 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30107 ,  H05K3/3457 ,  H05K2203/043 ,  H05K2203/159

摘要： A method for forming solder balls that have improved height on an electronic substrate such as a silicon wafer and devices formed are disclosed. In the method, after solder bumps are deposited by a conventional method such as evaporation, electroplating, electroless plating or solder paste screen printing, the solder bumps are reflown on the substrate in an upside down position such that the gravity of the solder material pulls down the solder ball and thereby increasing its height after the reflow process is completed. It has been found that a minimum of 5%, and preferably about 10% height increase has been achieved. Another benefit achieved by the present invention novel method which is associated with the increase in the solder ball height is a corresponding increase in the pitch distance between the solder balls by at least 5%.

摘要翻译： 公开了一种用于形成在诸如硅晶片的电子衬底和形成的器件上具有改进的高度的焊球的方法。 在该方法中，在通过诸如蒸发，电镀，无电镀或焊膏丝网印刷的常规方法沉积焊锡凸块之后，焊料凸块在上下颠倒的位置在衬底上被反冲，使得焊料材料的重力下拉 焊球，从而在回流处理完成之后增加其高度。 已经发现，已经实现了至少5％，优选地大约10％的高度增加。 通过与焊球高度增加相关的本发明新颖方法实现的另一个优点是焊球之间的间距距离相应增加至少5％。

公开(公告)号：US08323553B2

公开(公告)日：2012-12-04

申请号：US12362080

申请日：2009-01-29

申请人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

发明人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

IPC分类号： B05D3/06 ,  B29C35/08 ,  B29C59/16

CPC分类号： H05K3/102 ,  B82Y10/00 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/128

摘要： A method for manufacturing a substrate with surface substrates by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with plural pores is thus formed.

摘要翻译： 描述了通过使用光热效应制造具有表面基板的基板的方法。 由光束激发的衬底表面上的纳米颗粒将光能转换成热能。 通过激发的纳米粒子产生的热能形成衬底上的表面结构。 由此形成具有多个孔的基板。

公开(公告)号：US20090197011A1

公开(公告)日：2009-08-06

申请号：US12362080

申请日：2009-01-29

申请人： Tzong-Ming LEE ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

发明人： Tzong-Ming LEE ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

IPC分类号： B05D3/06

CPC分类号： H05K3/102 ,  B82Y10/00 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/128

摘要： A method for manufacturing a substrate with surface substrates by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with plural pores is thus formed.

摘要翻译： 描述了通过使用光热效应制造具有表面基板的基板的方法。 由光束激发的衬底表面上的纳米颗粒将光能转换成热能。 通过激发的纳米粒子产生的热能形成衬底上的表面结构。 由此形成具有多个孔的基板。

公开(公告)号：US20090269505A1

公开(公告)日：2009-10-29

申请号：US12362131

申请日：2009-01-29

申请人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

发明人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

IPC分类号： B05D3/06

CPC分类号： H05K3/102 ,  B82Y10/00 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/128

摘要： A method for manufacturing a substrate with a surface substrate by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with a layer of the predetermined pattern is thus formed.

摘要翻译： 描述了通过采用光热效应制造具有表面基板的基板的方法。 由光束激发的衬底表面上的纳米颗粒将光能转换成热能。 通过激发的纳米粒子产生的热能形成衬底上的表面结构。 由此形成具有预定图案的层的衬底。

公开(公告)号：US20060243972A1

公开(公告)日：2006-11-02

申请号：US11477412

申请日：2006-06-30

申请人： Ruoh-Huey Uang ,  Yu-Chih Chen ,  Ren-Jan Lin ,  Syh-Yuh Cheng

发明人： Ruoh-Huey Uang ,  Yu-Chih Chen ,  Ren-Jan Lin ,  Syh-Yuh Cheng

IPC分类号： H01L29/08

CPC分类号： H01L23/49827 ,  B82Y10/00 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01R4/04 ,  H01R13/2414 ,  H05K3/323 ,  H05K2201/026 ,  H05K2201/083 ,  H05K2201/10378 ,  H05K2203/0726 ,  H05K2203/104 ,  Y10S977/761 ,  Y10S977/762 ,  Y10S977/766 ,  Y10S977/77 ,  Y10S977/778 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.

公开(公告)号：US20120009353A1

公开(公告)日：2012-01-12

申请号：US13234344

申请日：2011-09-16

申请人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yi-Ting Cheng

发明人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yi-Ting Cheng

IPC分类号： B05D3/06

CPC分类号： H05K3/102 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/128

摘要： A manufacturing method for manufacturing a substrate with a surface substrate by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with a layer of the predetermined pattern is thus formed.

摘要翻译： 描述了通过使用光热效应制造具有表面基板的基板的制造方法。 由光束激发的衬底表面上的纳米颗粒将光能转换成热能。 通过激发的纳米粒子产生的热能形成衬底上的表面结构。 由此形成具有预定图案的层的衬底。

公开(公告)号：US07163885B2

公开(公告)日：2007-01-16

申请号：US10862515

申请日：2004-06-05

申请人： Yu-Chih Chen ,  Ruoh-Huey Uang ,  Yu-Hua Chen

发明人： Yu-Chih Chen ,  Ruoh-Huey Uang ,  Yu-Hua Chen

IPC分类号： H01L21/00

CPC分类号： H01L21/4853 ,  H01L21/2885 ,  H01L24/11 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/19042 ,  H01L2924/00

摘要： A method for dispersing and fixing particles on the bumps of a chip using an electrophoresis technology is provided. The particles and chip bumps are processed to carry charges by applying chemical bonding between metal and thiol with electric charges. The chip is placed in a reactor with a solution along with the conductive particles. The conductive particles are then migrated and fixed to the bonding locations on the bumps of a chip through an electrophoresis procedure. For conductive particles not carrying charges, they can sink naturally to the surface of chip bumps due to their higher density than water in the solution. An electroplating procedure is then applied to fix the conductive particles onto the bump.

摘要翻译： 提供了使用电泳技术将颗粒分散并固定在芯片的凸块上的方法。 通过在金属和硫醇之间进行电荷的化学键合来处理颗粒和芯片凸块以携带电荷。 将芯片与导电颗粒一起放置在具有溶液的反应器中。 然后通过电泳方法将导电颗粒迁移并固定到芯片的凸块上的结合位置。 对于不携带电荷的导电颗粒，由于它们比溶液中的密度高，它们可以自然地沉积到芯片凸块的表面。 然后施加电镀程序以将导电颗粒固定到凸块上。