公开(公告)号：US07163841B2

公开(公告)日：2007-01-16

申请号：US11179431

申请日：2005-07-11

申请人： Sadamichi Takakusaki ,  Yusuke Igarashi ,  Motoichi Nezu ,  Takaya Kusabe

发明人： Sadamichi Takakusaki ,  Yusuke Igarashi ,  Motoichi Nezu ,  Takaya Kusabe

IPC分类号： H01L21/49

CPC分类号： H05K3/4647 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0265 ,  H05K1/185 ,  H05K1/187 ,  H05K3/06 ,  H05K3/20 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4658 ,  H05K3/4682 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09736 ,  H05K2203/0152 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： To provide a method of manufacturing a highly reliable circuit device realizing a smaller, thinner and lighter configuration. In the method of manufacturing a circuit device according to the invention, a resin sealed body is separated from a supporting substrate, after the resin sealed body containing a circuit device is formed on a top surface of the supporting substrate. Therefore, manufacture of a circuit device having no substrate becomes possible and it realizes a thinner and lighter circuit device with improved heat dissipation. Moreover, since sealing with a sealing resin can be performed on the supporting substrate, warps, caused by the differences in thermal expansion coefficients between the sealing resin and conductive patterns and between the sealing resin and circuit components, can be prevented. Hence, it becomes possible to prevent flaking of conductive patterns from the substrate and a poor contact between the conductive patterns and a metal thin wire, and consequently to manufacture a highly reliable circuit device.

摘要翻译： 提供一种制造高可靠性电路装置的方法，其实现更小，更薄和更轻的构造。 在根据本发明的电路装置的制造方法中，在支撑基板的顶表面上形成包含电路装置的树脂密封体之后，树脂密封体与支撑基板分离。 因此，可以制造没有基板的电路装置，并且实现了具有改善的散热的更薄更轻的电路装置。 此外，由于可以在支撑基板上进行密封树脂的密封，所以可以防止由密封树脂和导电图案之间以及密封树脂和电路部件之间的热膨胀系数的差异引起的翘曲。 因此，可以防止导电图案从基板剥落，并且导电图案与金属细线之间的接触不良，从而制造高可靠性的电路装置。