公开(公告)号：US11584045B2

公开(公告)日：2023-02-21

申请号：US17890480

申请日：2022-08-18

申请人： Midori Anzen Co., Ltd.

发明人： Norihide Enomoto ,  Taichi Ogawa ,  Kaname Shibata ,  Junji Shibasaki

IPC分类号： B29C41/14 ,  A41D19/00 ,  B29C41/00 ,  C08F20/44 ,  C08G59/32 ,  C08J5/02 ,  C08F236/12 ,  B29K33/20 ,  B29L31/48 ,  C08K5/1515

摘要： A glove including a cured film of an elastomer containing a (meth)acrylonitrile-derived structural unit, an unsaturated carboxylic acid-derived structural unit and a butadiene-derived structural unit in a polymer main chain, wherein the elastomer contains 20 to 40% by weight of a (meth)acrylonitrile-derived structural unit, 1 to 10% by weight of an unsaturated carboxylic acid-derived structural unit and 50 to 75% by weight of a butadiene-derived structural unit, and has a crosslinked structure of a carboxyl group in the unsaturated carboxylic acid-derived structural unit with an epoxy crosslinker containing an epoxy compound having three or more epoxy groups in one molecule.

公开(公告)号：US11530323B2

公开(公告)日：2022-12-20

申请号：US17251956

申请日：2019-06-18

申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

发明人： Yusaku Kohinata

IPC分类号： C08L63/00 ,  C08J5/24 ,  C08G59/24 ,  C08G59/32 ,  C08G59/38 ,  C08G59/50 ,  C08K5/42 ,  C08L81/06

摘要： An epoxy resin composition including components (A), (B), (C) and (D); wherein a content of the component (A) is 60 to 90 parts by mass, and a content of the component (B) is 10 to 40 parts by mass, with respect to epoxy resins; the epoxy resin composition has a characteristic that, when cured and formed into a cured product, the cured product has a glass transition temperature of 200° C. or higher; and a viscosity at 100° C. of the resin composition is 5 to 35 Pa·s, wherein Component (A) is an aromatic epoxy resin having at least 3 glycidyl groups in one molecule, Component (B) is an aromatic epoxy resin having two glycidyl groups in one molecule, Component (C) is an aromatic polysulfone resin having a reduced viscosity of 0.18 to 0.30 dl/g; and Component (D) is an aromatic amine compound.

公开(公告)号：US11505641B2

公开(公告)日：2022-11-22

申请号：US16980988

申请日：2019-02-27

申请人： Toray Industries, Inc.

发明人： Koji Furukawa ,  Junko Kawasaki ,  Soichi Yoshizaki ,  Kentaro Sano ,  Toshiya Kamae

IPC分类号： C08G59/32 ,  C08J5/24 ,  C08G59/40 ,  C08K5/06 ,  C08L63/00

摘要： A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.

公开(公告)号：US11499002B2

公开(公告)日：2022-11-15

申请号：US16762012

申请日：2018-11-07

申请人： ARIANEGROUP SAS ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE

发明人： Etienne Savonnet ,  Brigitte Defoort ,  Henri Cramail ,  Stéphane Grelier ,  Etienne Grau

IPC分类号： C08G59/38 ,  C07D301/28 ,  C07D303/28 ,  C08G59/24 ,  C08G59/32

摘要： A multi-epoxidized biphenyl compound has the formula (I) below wherein R, R1, R2 and R3 are as defined in the description, as well as mixtures of at least two of the compounds. These multi-epoxidized biphenyl compounds are fully suitable as main constituents of thermosetting epoxy resins, i.e. as polyepoxides precursors. They are beneficial substitutes for bisphenol A diglycidyl ether.

公开(公告)号：US11441027B2

公开(公告)日：2022-09-13

申请号：US16755945

申请日：2018-09-28

申请人： Toray Industries, Inc.

发明人： Akihiko Ito ,  Hiroaki Sakata

IPC分类号： C08G59/50 ,  C08G59/38 ,  C08L63/00 ,  C08J5/24 ,  C08G59/24 ,  C08G59/28 ,  C08G59/32 ,  C08G59/40 ,  C08J5/04 ,  C08K5/5397 ,  C08L81/06

摘要： The purpose of the present invention is to provide an epoxy resin composition which has excellent viscosity stability, and when cured, can provide a resin cured product which has high flame retardancy and excellent mechanical properties, and a prepreg and fiber-reinforced composite material using the epoxy resin composition. An embodiment of the epoxy resin composition according to the present invention which achieves the purpose contains all components [A]-[C]. [A]: A reactive diluent having a specific structure and a viscosity of 2 Pa·s or less at 25° C. [B]: An epoxy resin having three of more functional groups. [C]: An amine-based curing agent having a specific structure.

公开(公告)号：US11377518B2

公开(公告)日：2022-07-05

申请号：US16338353

申请日：2017-09-29

申请人： LG CHEM, LTD.

发明人： So Young Kim ,  Seung Min Lee ,  Se Woo Yang

IPC分类号： H01L51/52 ,  C08G59/24 ,  C08G59/32 ,  C08G59/68 ,  C09J163/00 ,  C08G59/22 ,  C09D163/00 ,  H01L51/56 ,  C09J5/06 ,  C08G59/40 ,  C08G65/18

摘要： Disclosed is related to an adhesive composition for encapsulating an organic electronic element and an organic electronic device comprising the same. The adhesive composition includes a curable compound having no carbon-carbon unsaturated group, a thermal initiator, and a photo-initiator. The adhesive composition can form a structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, can realize a top emitting organic electronic device, and can prevent defects such as dark spots which may occur in the organic electronic device.

公开(公告)号：US11332609B2

公开(公告)日：2022-05-17

申请号：US16612166

申请日：2018-03-22

申请人： Dow Global Technologies LLC

发明人： Adam K. Schmitt ,  David H. Bank ,  Bharati Balijepalli ,  Daniel Schneider

IPC分类号： C08L63/04 ,  C08J5/04 ,  C08L63/00 ,  B32B5/26 ,  C08G59/26 ,  C08G59/32 ,  C08G59/38 ,  C08G59/40 ,  C08G59/68 ,  C08J5/24

摘要： A resin composition is comprised of an epoxy resin comprised of a solid epoxy resin and a liquid polyurethane toughener that is dissolved in the epoxy resin and, upon curing of the liquid epoxy resin, the liquid polyurethane toughener phase separates into particles having a particle size of 50 nm to 2 micrometers, an epoxy hardener; and an epoxy soluble latent catalyst. The resin composition provides a more homogeneous infusion of the resin into a fibrous material for forming a prepreg and ultimately an epoxy fiber reinforced composition with improved toughness without sacrificing speed of impregnation or uniformity of the epoxy matrix within the composite.

公开(公告)号：US20220106435A1

公开(公告)日：2022-04-07

申请号：US17426228

申请日：2020-01-21

申请人： UNITIKA LTD.

发明人： Ayumi YANAKA ,  Yumeto FUKUBAYASHI ,  Takatoshi MURAKAMI

IPC分类号： C08G59/40 ,  C08G59/42 ,  C08G59/22 ,  C08G59/32 ,  C08J5/24 ,  C08J5/04 ,  C08L63/00 ,  C08G59/02

摘要： The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.

公开(公告)号：US11279795B2

公开(公告)日：2022-03-22

申请号：US16492298

申请日：2018-06-26

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Lianzhou Chen ,  Michael S. Newman

IPC分类号： C08G59/32 ,  C08G59/50 ,  C08F110/08 ,  C08L9/02 ,  C08L71/02

摘要： Provided are curable compositions including a base part comprising an amine-reactive curable resin and a curative part comprising a polymeric toughener dissolved in an amine. The polymeric toughener, optionally a rubbery polymer or thermoplastic polymer, is solid at ambient conditions with a weight average molecular weight of at least 5,000 g/mol while the amine is a liquid at ambient conditions. The curable composition is cured by mixing the base and curative parts with each other. Hardened compositions obtained thereof can achieve increased toughener loading, resulting in high peel and shear strength performance over a wide range of temperatures, including at temperatures exceeding 180° F. (82° C.).

公开(公告)号：US11267932B2

公开(公告)日：2022-03-08

申请号：US16047508

申请日：2018-07-27

申请人： TOKYO OHKA KOGYO CO., LTD.

发明人： Kazuya Someya ,  Issei Suzuki ,  Koichi Misumi ,  Dai Shiota

IPC分类号： C08G59/40 ,  C08G59/24 ,  C09D163/00 ,  H01L27/32 ,  H01L51/00 ,  H01L51/56 ,  C08G59/32 ,  C08G59/68 ,  C08G59/30 ,  C08G75/08 ,  H01L51/52

摘要： A curable composition which is capable of forming a cured product having satisfactory heat resistance and adhesion to a base material, and has satisfactory curability, a cured film obtained from a cured product of the curable composition, a display panel or an OLED light provided with the cured film, and a method for producing a cured product using the curable composition. The composition includes a curable compound and a cationic polymerization initiator, and contains a cationic polymerizable compound having, as the main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, and a salt including a gallium-containing anion as the cationic polymerization initiator.