Abstract:
The disclosure relates to encapsulated optical fiber end-coupled devices. An optical assembly (20) may include a fiber holder (22, 24) and a cap (26) with an optical component (90) mounted to its underside. The optical component may be aligned with a fiber (30) passing between a substrate (22) and a second section (24) of the fiber holder to allow optical signals to be coupled between the optical component and the fiber. Techniques for assembling the fiber holder and the cap may facilitate the formation of hermetic seals to provide a protective environment for the optical component.
Abstract:
ABSTRACTA system for achieving fixation of one or more moveable micro machined platforms for passively aligned optical components, comprising - a support structure containing structures for passive alignment of optical components- platform(s) containing structures for passive alignment of optical components- actuators for actively aligning the already passively aligned components on the platform(s) and the support structure to each other, where the actuators are strong enough while actuating to keep the platform(s) steady during fixation and weak enough while not actuating so as not to impede the fixation- a fixation mechanism to fixate the moveable platform(s) to the support structure.
Abstract:
An optical device (10) is provided which includes a plurality of optical modules (12A, B). Each optical module (12A, B) includes an optical component (14A, B) fixedly coupled to a relative reference mount (18A, B). The relative reference mount (18A, B) is configured to attach to a substrate (20). A plurality of optical modules (12A, B) mount on the substrate (20) to form the optical device (10).
Abstract:
An optical fibre is secured to an electronic package (10) by, firstly, providing in a wall (14) of the package (10) an electrically conductive tube (12), an inductance arrangement (16-22) in magnetically co-operational relation to the tube (12) and a securing agent inside the tube, then secondly inserting the fibre into the tube (12) and passing an RF current through the inductance arrangement (16). The current is such as to melt the securing agent and, when the securing agent is allowed to cool, a bond is formed between the fibre and the tube (12). The package (10) is preferably an LTCC multilayer package with the inductance (16) being formed in adjacent layers and the tube (12) is preferably composed of a metallic ink which is supplied to a stepwise-circular cylindrical cavity likewise formed in adjacent layers.
Abstract:
In accordance with the present invention a fiber optic array 100 is provided. The array includes a substrate 10 having a fiber support surface. The array 100 further includes an optical fiber having a fiber portion that includes an un-jacketed, un-buffered optical core segment. The un-jacketed, un-buffered optical core segment is placed in contact with the fiber support surface 12 to orient the optical core segment at a selected position relative to the support surface 12. In addition, the array 100 includes a solder glass chemically bonded to the optical core segment and the fiber support surface so that the optical core segment is secured at a predetermined location relative to the support surface 12 of the substrate 10. A method for fabricating such a fiber optic array 100 is also provided.
Abstract:
An electrode assembly for electroplating portions of nonconductors comprises an insulating frame having a first projection opposite a second projection. A metal filament provides a negative pole connected from the first projection to the second projection. A first conductive plate is attached to the insulating frame at a first distance from the metal filament. A second conductive plate is attached to the insulating frame at a first distance from the metal filament. A second conductive plate is located at a second distance from the metal filament. The first plate and the second plate are included in the positive pole of the electrode assembly used to provide a conductive composite coating on the surface of a nonconductor, preferably an optical fiber.
Abstract:
An optical fiber module capable of distributing an external force to reduce a load on the optical fiber itself, and a semiconductor laser module attached with the optical fiber module. The optical fiber module (M) includes (the end of) an optical fiber (F) comprising covered unit (1) covered with a coating material, and a metallized unit (2) closer to the end than the covered unit (1). This optical fiber (F) is inserted into a metal pipe (3), the metallized unit (2) is fixed to the metal pipe (3) by solder (4), and the covered unit (1) is fixed to the metal pipe (3) by adhesive (5).
Abstract:
A magnetically-assisted fixturing process for optical components (20) on a bench (100) utilizes precision placement of an optical component (20) on a bench (100). This placement can be done either entirely passively, actively, or using a combination of active and passive alignment. The optical component (20) is then held on the bench (100) using a magnetic field. Thus, the optical component (20) is maintained in a stable relationship with respect to the bench (100), especially after it has been aligned. The optical component (20) is then affixed to the bench (100), typically by a solder bonding process. Alternatively, other bonding processes can be used, such as epoxy bonding or laser welding. In one implementation, the magnetic fixturing is maintained during the process of affixing or bonding the optical component (20). Thus, in one example, the optical bench (100) can be transported to a solder reflow oven while the optical component (20) is held on the bench (100) via the magnetic fixturing.
Abstract:
A single-transverse-mode laser has a resonance cavity with an output end. A gain medium portion is disposed within the resonance cavity. The gain medium portion includes an active portion. A mode expander taper is disposed within the resonance cavity between and operationally coupled to the gain medium portion and the output end of the resonance cavity. A single-mode waveguide portion is disposed with the resonance cavity between and operationally coupled to the mode expander portion and the output end of the resonance cavity. The single-mode waveguide portion is a passive portion. The gain medium portion, the mode expander portion and the single-mode waveguide portion are integrally formed. A grating disposed at a facet of the laser provides wavelength stabilization through feedback over a narrow spectrum.