公开(公告)号：WO2008098832A1

公开(公告)日：2008-08-21

申请号：PCT/EP2008/051020

申请日：2008-01-29

申请人： HYMITE A/S ,  GREISEN, Christoffer Graae ,  HESCHEL, Matthias ,  SHIV, Lior ,  WEICHEL, Steen

发明人： GREISEN, Christoffer Graae ,  HESCHEL, Matthias ,  SHIV, Lior ,  WEICHEL, Steen

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method of fabricating a package with a light emitting device includes depositing a first metallization to form a conductive pad on which the light emitting device is to be mounted and to form one or more feed-through interconnections extending through a semiconductor material that supports the conductive pad. Subsequently, a second metallization is deposited to form a reflective surface for reflecting light, emitted by the light emitting device, through a lid of the package. Deposition of the second metallization is de-coupled from deposition of the first metallization.

摘要翻译： 制造具有发光器件的封装的方法包括沉积第一金属化以形成其上将要安装发光器件的导电焊盘，并且形成延伸穿过支撑导电的半导体材料的一个或多个馈通互连 垫。 随后，沉积第二金属化以形成用于通过封装的盖反射由发光器件发射的光的反射表面。 第二金属化的沉积与第一金属化的沉积脱耦合。

公开(公告)号：WO2010081795A1

公开(公告)日：2010-07-22

申请号：PCT/EP2010/050265

申请日：2010-01-12

申请人： HYMITE A/S ,  SHIV, Lior ,  SHEPHERD, John, Nicholas

发明人： SHIV, Lior ,  SHEPHERD, John, Nicholas

IPC分类号： H01L23/13 ,  H01L23/14 ,  H01L23/498

CPC分类号： H01L23/13 ,  B81B7/007 ,  B81B2207/096 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/48 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A submount for a micro-component includes a semiconductor substrate having a cavity defined in a front-side of the substrate in which to mount the micro-component. The submount also includes a thin silicon membrane portion at a bottom of the cavity and thicker frame portions adjacent to sidewalls of the cavity. The substrate includes an electrically conductive feed-through connection extending from a back-side of the substrate at least partially through the thicker silicon frame portion. Electrical contact between the feed- through connection and a conductive layer on a surface of the cavity is made at least partially through a sidewall of the cavity.

摘要翻译： 用于微分量的基座包括半导体衬底，该半导体衬底具有限定在衬底前侧中的空腔，用于安装微组件。 底座还包括在空腔的底部的薄硅膜部分和与腔的侧壁相邻的较厚的框架部分。 衬底包括从衬底的背面至少部分地穿过较厚的硅框架部分延伸的导电馈通连接。 通过连接件和空腔表面上的导电层之间的电接触至少部分地通过空腔的侧壁进行。

公开(公告)号：WO2008083905A1

公开(公告)日：2008-07-17

申请号：PCT/EP2007/064251

申请日：2007-12-19

申请人： HYMITE A/S ,  GREISEN, Christoffer Graae ,  SHIV, Lior ,  EGGINTON, Paul N.

发明人： GREISEN, Christoffer Graae ,  SHIV, Lior ,  EGGINTON, Paul N.

IPC分类号： H01L21/50 ,  H01L23/10

CPC分类号： H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

摘要： A deformable spacer for wafer bonding applications is disclosed. The spacer may be used to keep wafers separated until desired conditions are achieved.

摘要翻译： 公开了一种用于晶片接合应用的可变形间隔物。 间隔物可用于将晶片分离直到达到所需条件。

公开(公告)号：WO2004086519A1

公开(公告)日：2004-10-07

申请号：PCT/IB2004/001306

申请日：2004-03-23

申请人： HYMITE A/S ,  KILIAN, Arnd

发明人： KILIAN, Arnd

IPC分类号： H01L33/00

CPC分类号： G02B6/4214 ,  G02B6/4206

摘要： A package includes a cap (22) with a solid-state light emitting device (30) mounted within a recess (28) in the cap. A plate (24) is attached to the cap to define a hermetically sealed region in which the light emitting device is housed, and a base (26) is attached to the plate. The plate and base are transparent to a wavelength of light emitted by the light emitting device. An optical wavelength selective element (52) is disposed between the plate and the base to select the wavelength of light to exit the package through the base.

摘要翻译： 封装包括具有安装在盖中的凹部（28）内的固态发光器件（30）的盖（22）。 板（24）附接到盖以限定容纳发光装置的气密密封区域，并且基板（26）附接到板。 板和底座对于由发光器件发射的光的波长是透明的。 光学波长选择元件（52）设置在板和基座之间以选择通过基底离开封装的光的波长。

公开(公告)号：WO2007017757A2

公开(公告)日：2007-02-15

申请号：PCT/IB2006/002555

申请日：2006-08-10

申请人： HYMITE A/S ,  KUHMANN, Jochen ,  HESCHEL, Matthias

发明人： KUHMANN, Jochen ,  HESCHEL, Matthias

IPC分类号： B81C1/00

CPC分类号： B81C1/0023 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A package includes a sensor die with a micro component, such as a MEMS device, coupled to an integrated circuit which may include, for example., CMOS circuitry, and one or more electrically conductive bond pads near the periphery of the sensor die. A semiconductor cap structure is attached to the sensor die. The front side of the cap structure is attached to the sensor die by a seal ring to hermetically encapsulate an area of the sensor die where the micro component is located. The bond pads on the sensor die are located outside the area encapsulated by the seal ring. Electrical leads, which extend along outer side edges of the semiconductor cap structure from its front side to its back side, are coupled to the micro component via the bond pads.

摘要翻译： 封装包括具有耦合到集成电路的诸如MEMS器件的微元件的传感器管芯，该集成电路可以包括例如CMOS电路，以及在传感器管芯的周围附近的一个或多个导电接合焊盘。 半导体盖结构附接到传感器管芯。 盖结构的前侧通过密封环附接到传感器管芯，以密封地封装微组件所在的传感器管芯的区域。 传感器芯片上的接合焊盘位于由密封环封装的区域之外。 沿着半导体盖结构的外侧边缘从其前侧延伸到其后侧的电引线通过接合焊盘耦合到微型部件。

公开(公告)号：WO2006030315A1

公开(公告)日：2006-03-23

申请号：PCT/IB2005/002994

申请日：2005-09-12

申请人： HYMITE A/S ,  WINTER, Marcus ,  HAUFFE, Ralf ,  KILIAN, Arnd

发明人： WINTER, Marcus ,  HAUFFE, Ralf ,  KILIAN, Arnd

IPC分类号： G02B6/42 ,  H01S5/022

CPC分类号： G02B6/4204 ,  G02B6/4214 ,  G02B6/4226 ,  G02B6/423 ,  H01S5/02208 ,  H01S5/02284 ,  H01S5/02292 ,  H01S5/0683

摘要： An optical module comprising an opto-electronic component, a lens and a mirror that is hermetically sealed by a micro housing (702) containing a lid and a base is disclosed. The optical module may be assembled onto a moveable holder (701) for aligning an optical beam into an optical assembly having an optical waveguide.

摘要翻译： 公开了一种光学模块，包括由包含盖和基座的微型壳体（702）气密地密封的光电子部件，透镜和反射镜。 光学模块可以组装到可移动保持器（701）上，用于将光束对准到具有光波导的光学组件中。

公开(公告)号：WO2005118464A1

公开(公告)日：2005-12-15

申请号：PCT/IB2005/002286

申请日：2005-06-03

申请人： HYMITE A/S ,  SHIV, Lior

发明人： SHIV, Lior

IPC分类号： B81B7/00

CPC分类号： B81B7/0041 ,  B81B7/007 ,  B81B2201/018 ,  H01H1/0036

摘要： A package for a MEMS device includes a semiconductor cap structure and a lid substrate that define an encapsulated area within which the MEMS device is located. Feed-through metallization hermetically seals micro-vias in the semiconductor cap structure and extends through the semiconductor cap structure to provide interconnections coupled electrically to the MEMS device and to an exterior of the semiconductor cap structure.

摘要翻译： 用于MEMS器件的封装包括限定MEMS器件所在的封装区域的半导体盖结构和盖基板。 直通金属化气密地密封半导体盖结构中的微通孔并且延伸穿过半导体帽结构以提供电耦合到MEMS器件和半导体帽结构的外部的互连。

公开(公告)号：WO2005078488A1

公开(公告)日：2005-08-25

申请号：PCT/IB2005/000967

申请日：2005-02-10

申请人： HYMITE A/S ,  HAUFFE, Ralf ,  KILIAN, Arnd

发明人： HAUFFE, Ralf ,  KILIAN, Arnd

IPC分类号： G02B6/00

CPC分类号： G02B6/4214 ,  G02B6/4201 ,  G02B6/4206 ,  G02B6/4286 ,  H01L24/73 ,  H01L25/167 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01S5/0264 ,  H01L2924/00012 ,  H01L2924/00

摘要： An optical module, such as a package for a vertical cavity surface emitting laser diode (VCSEL) or other light emitting device, includes monitoring of the emitted optical power by tapping the transmitted beam. The module includes a substrate, which carries the light emitting device and an optical monitor. In addition, the module includes a transparent plate with at least two reflective regions that together redirect part of the light from the light emitting device to the optical monitor.

摘要翻译： 诸如用于垂直腔表面发射激光二极管（VCSEL）或其他发光器件的封装的光学模块包括通过敲击所发射的光束来监测所发射的光功率。 该模块包括承载发光装置的基板和光学监视器。 此外，该模块包括具有至少两个反射区域的透明板，这些反射区域将来自发光器件的光的一部分重新定向到光学监视器。

公开(公告)号：WO2005043602A2

公开(公告)日：2005-05-12

申请号：PCT/IB2004/003582

申请日：2004-11-01

申请人： HYMITE A/S ,  KILIAN, Arnd ,  HAUFFE, Ralf

发明人： KILIAN, Arnd ,  HAUFFE, Ralf

IPC分类号： H01L21/00

CPC分类号： H01F41/046 ,  H01F17/0033 ,  H01F41/045 ,  H01H59/0009 ,  H01L2924/0002 ,  H01L2924/00

摘要： Techniques and structures for three-dimensional inductive micro components are disclosed. The inductive micro components may be used, for example, in micro circuits and may be integrated with other components hermetically sealed in a micro housing. In some implementations, the inductive micro component may be tunable.

摘要翻译： 公开了用于三维感应微元件的技术和结构。 感应微元件可以用于例如微电路中，并且可与密封在微型外壳中的其它部件集成。 在一些实施方式中，感应微分量可以是可调谐的。

公开(公告)号：WO2003034490A2

公开(公告)日：2003-04-24

申请号：PCT/EP2002/011605

申请日：2002-10-15

申请人： HYMITE A/S

发明人： HESCHEL, Matthias

IPC分类号： H01L23/48

CPC分类号： G02B6/4201 ,  G02B6/4245 ,  G02B6/4279 ,  H01L21/76898 ,  H01L23/481 ,  H01L31/0203 ,  H01L2924/0002 ,  Y10T29/49126 ,  H01L2924/00012 ,  H01L2924/00

摘要： Semiconductor structures with one or more through-holes are disclosed. A feed-through metallization process may be used to seal the through-holes hermetically.

摘要翻译： 公开了具有一个或多个通孔的半导体结构。 可以使用馈通金属化工艺来密封密封通孔。