Abstract:
An input buffer is discussed that inhibits semiconductor breakdown of thin gate-oxide transistors in low-voltage integrated circuits. One aspect of the input buffer includes an input stage having a gate, a drain, and a source. The gate of the input stage is receptive to an inhibiting signal, and the drain is receptive to an input signal. The input stage inhibits the input signal from being presented at the source of the input stage when the inhibiting signal is at a predetermined level. The input buffer further includes an output stage having an inverter that includes a first connection and a second connection. The first connection couples to the source of the input stage, and the second connection presents the input signal to a low-voltage flash memory device.
Abstract:
A memory system has a memory controller (101) and memories (104). The memories (104) are connected to an end of a bus (106) connected to the memory controller (101) through a switch (103). The switch (103) is for controlling the memories (104). The reflection and load on the bus (106) is suppressed, thereby increasing the data transmission rate.
Abstract:
A memory subsystem manages memory I/O impedance compensation by the memory device monitoring a need for impedance compensation. Instead of a memory controller regularly sending a signal to have the memory device update the impedance compensation when a change is not needed, the memory device can indicate when it is ready to perform an impedance compensation change. The memory controller can send an impedance compensation signal to the memory device in response to a compensation flag set by the memory or in response to determining that a sensor value has changed in excess of a threshold.
Abstract:
Systems and methods are disclosed for reducing memory I/O power. One embodiment is a system comprising a system on chip (SoC), a DRAM memory device, and a data masking power reduction module. The SoC comprises a memory controller. The DRAM memory device is coupled to the memory controller via a plurality of DQ pins. The data masking power reduction module comprises logic configured to drive the DQ pins to a power saving state during a data masking operation.
Abstract:
In one embodiment, a memory interface comprises a cleanup phase-locked loop (PLL) configured to receive a reference clock signal, and to generate a clean clock signal based on the reference clock signal. The memory interface also comprises a synchronization circuit configured to receive data, a data clock signal, and the clean clock signal, wherein the synchronization circuit is further configured to sample the data using the data clock signal, and to synchronize the sampled data with the clean clock signal.
Abstract:
Techniques and mechanisms for providing termination for a plurality of chips of a memory device. In an embodiment, a memory device is an integrated circuit (IC) package which includes a command and address bus and a plurality of memory chips each coupled thereto. Of the plurality of memory chips, only a first memory chip is operable to selectively provide termination to the command and address bus. Of the respective on-die termination control circuits of the plurality of memory chips, only the on-die termination control circuit of the first memory chip is coupled via any termination control signal line to any input/output (I/O) contact of the IC package. In another embodiment, the plurality of memory chips are configured in a series with one another, and wherein the first memory chip is located at an end of the series
Abstract:
A memory system or flash card may include a controller interface for communicating with a host. The interface utilizes multiple pre-driver logic blocks that are tolerant to different voltages. For example, one block may use gate oxide devices tolerant to IO low voltage that speed up the delay path during low voltage operation, while a second block may use gate oxide devices tolerant to IO higher voltage for backwards compatibility with devices that operate at a high IO voltage. This allows the interface to take advantage of the IO low voltage device speed for multi-purpose IO use, while still being used for both low voltage and higher voltage protocols.
Abstract:
This document generally describes systems, devices, methods, and techniques for variably controlling impedance for a memory device where multiple NVM units (e.g., NVM dies) are accessible over a shared bus. Impedance can be varied using switches that are configured to switch between a NVM unit and an impedance terminal. Switches can be adjusted during operation of a memory device so that a memory controller is connected over a shared bus to a selected single NVM unit and one or more impedance terminals. Impedance terminals can be configured to provide a relatively small load (a smaller load than an NVM unit) that is impedance matched (alone or in combination with other impedance terminals and/or a NVM unit) with a source impedance on a shared bus that is provided by a memory controller.