Abstract:
A random access memory (RAM) including a deserializer is disclosed. The RAM further comprises a continuous-time linear equalizer (CTLE) including a first input terminal that receives an input signal for the RAM and a first output terminal communicatively connected to the deserializer, the CTLE configured to perform a channel gain compensation on the input signal received by the first input terminal and to transmit the compensated input signal to the deserializer. The RAM may further comprise a decision feedback equalizer (DFE) including a second input terminal communicatively connected to the CTLE and a second output terminal communicatively connected to the deserializer, the DFE configured to reduce an inter-symbol interference (ISI) of the input signal.
Abstract:
A biasing circuit includes cascoded transistors including a first transistor and a second transistor. A first gate of the first transistor is coupled to a second gate of the second transistor at a first node. The circuit also includes a voltage control circuit coupled to at least one of the first transistor or the second transistor. The voltage control circuit is configured to change a voltage level of at least one of the first transistor or the second transistor to allow voltage domain transition of an output signal in view of a change in state of an input signal without ramping a supply signal of the biasing circuit.
Abstract:
An apparatuses and methods for buffering a voltage from a circuit without current drive ability are described. An example apparatus includes a voltage buffer that includes two identical stages. The first stage is configured to receive an input voltage and produce an intermediate voltage as an output. The second stage is configured to receive the intermediate voltage and provide an output voltage that is equal to the input voltage. The voltage buffer may be coupled to a current source. The second stage of the voltage buffer may have current drive ability.
Abstract:
A source-synchronous system is provided in which a non-uniform interface may exist in a data source endpoint as well as in a data sink endpoint.
Abstract:
An integrated circuit for generating a negative bitline voltage comprises a bitline connectable to a memory cell and a multitude of capacitors arranged in groups thereof connected to the bitline. A step signal generator can generate a consecutive sequence of step signals to be applied to a group of capacitors. The circuit may be part of an integrated memory circuit device to drive the bitline to a negative voltage to implement a write assist scheme.
Abstract:
Memories and methods for providing and receiving non-data signals at a signal node are disclosed. One such memory includes first and second signal nodes, and first and second signal buffer. The first signal buffer is configured to be operative responsive to a first data strobe signal and further configured to be operative responsive to a non-data signal. The second signal buffer is configured to be operative responsive to a second data strobe signal. An example first data strobe signal is a read data strobe signal provided by the memory. In another example, the first data strobe signal is a write data strobe signal received by the memory. Examples of non-data signals include a data mask signal, data valid signal, error correction signal, as well as other signals.
Abstract:
A system and method of performing off chip drive (OCD) and on-die termination (ODT) are provided A common pull-up network composed of transistors and a common pull-down network composed of transistors are employed to implement both of these functions. In drive mode, the pull-up network is configured to produce a calibrated drive impedance when an "on" output is to be generated, and the pull-down network is configured to produce a calibrated drive impedance when an "off" output is to be generated. In termination mode, the pull- up network and the pull-down network are configured to produce a calibrated pull-up resistance and pull-down resistance, respectively, such that together they form a split termination.
Abstract:
The present invention provides a semiconductor device and a method of controlling the semiconductor device, the semiconductor device comprising: a memory cell array; a terminal that inputs or outputs storage data stored in the memory cell array, and inputs address data indicating an address in the memory cell array at which the storage data is input or output, the terminal comprising: a first terminal that inputs a first part of the address data; and a second terminal that inputs a second part of the address data, wherein the second part of the address data is comprised of the entire remaining portion of the address data not comprising the first part of the address data; a first internal address line and a second internal address line to which the address data is supplied; and a switch that couples the first part of the address data to one of the first internal address line or the second internal address line in accordance with predetermined switch information, while coupling the second part of the address data to the other one of the first internal address line or the second internal address line, when the address data is input to the terminal.
Abstract:
An apparatus and method for manufacturing metal-oxide semiconductor (MOS) transistors that are operable at voltages below 1.5V, which MOS transistors are area efficient, and where the drive strength and leakage current of the MOS transistors is improved. The invention uses a dynamic threshold voltage control scheme that does not require a change to existing MOS technology processes. The invention provides a technique that controls the threshold voltage of the transistor. In the OFF state, the threshold voltage of the transistor is set high, keeping the transistor leakage to a small value. In the ON state, the threshold voltage is set to a low value, resulting in increased drive strength. The invention is particularly useful in MOS technology for both bulk and silicon on insulator (SOI) CMOS. The invention is further useful for SRAM, DRAM, NVM devices and other memory cells.
Abstract:
An apparatus and method for manufacturing metal-oxide semiconductor (MOS) transistors that are operable at voltages below 1.5V, which MOS transistors are area efficient, and where the drive strength and leakage current of the MOS transistors is improved. The invention uses a dynamic threshold voltage control scheme that does not require a change to existing MOS technology processes. The invention provides a technique that controls the threshold voltage of the transistor. In the OFF state, the threshold voltage of the transistor is set high, keeping the transistor leakage to a small value. In the ON state, the threshold voltage is set to a low value, resulting in increased drive strength. The invention is particularly useful in MOS technology for both bulk and silicon on insulator (SOI) CMOS. The invention is further useful for SRAM, DRAM, NVM devices and other memory cells.