Abstract:
Examples may include techniques to use chip select signals for a dual in-line memory module (DIMM). In some examples, the chip select signals are used with either a first encoding scheme for clock enable (CKE) functionality or a second encoding scheme for on-die termination (ODT) functionality to enable memory devices on the DIMM to be accessed or controlled according to commands received with the chip select signals.
Abstract:
Techniques for adjusting swing voltage for an I/O interface signal are described herein. In one embodiment, a device (201) comprises an input/output (I/O) interface (210), and an I/O voltage controller (205). The I/O voltage controller (205) is configured to determine a frequency or temperature of the I/O interface (210), and to adjust a swing voltage of the I/O interface based at least in part upon the determined frequency or temperature.
Abstract:
A three-dimensional NOR flash memory system is disclosed. The system optionally comprises configurable standard pins, a configurable output buffer, and a configurable input buffer.
Abstract:
A transmission line interface circuit includes a voltage regulator to control a voltage swing of the transmission line interface circuit for signal transmission. The transmission line interface circuit includes complementary driver elements, including a p-type driver element to pull up the transmission line in response to a logic high, and an n-type driver element to pull down the transmission line in response to a logic low. The voltage regulator is coupled between one of the driver elements and a respective voltage reference to reduce a voltage swing of the transmission line interface circuit.
Abstract:
An integrated circuit comprising an input/output "I/O" cell (34; 36; 38; 40) arranged to drive an output signal and an activity analysis unit (24a; 24b; 24c) arranged to generate an activity factor based on the output signal. The activity factor represents a switching activity intensity of the I/O cell, the switching activity intensity is associated with an ageing effect of the I/O cell. The circuit further comprises a calibration unit (22) arranged to generate a switching pattern signal based on the generated activity factor and an I/O calibration cell (28; 30) arranged to be driven by the switching pattern signal, wherein the switching pattern signal emulates the ageing effect of the I/O cell.
Abstract:
To suppress power consumption and enhance signal quality as compared with the case where first and second semiconductor elements are terminated only by on-chip input termination resistor circuits. A first semiconductor element with a switching function and a second semiconductor element with a switching function are connected to each other with a substrate interconnection, and a resistor element is connected in parallel with the substrate interconnection. The resistor element is placed at an arbitrary position or a branch point on the signal interconnection.
Abstract:
A semiconductor device comprising (i) internal circuitry for outputting at least one internal clock signal and at least one internal data/control signal for transmission to a next device in a chain of semiconductor devices; (ii) data/control output circuitry for outputting at least one output data/control signal from the at least one internal data/control signal and for releasing the at least one output data/control signal towards the next device via at least one output data/control signal line, the at least one output data/control signal having a first dynamic range; and (iii) clock output circuitry for generating at least one output clock signal from the at least one internal clock signal and for releasing the at least one output clock signal towards the next device via at least one output clock signal line, the at least one output clock signal having a dynamic range different than the first dynamic range.
Abstract:
It is proposed a DRAM memory interface (40) for transmitting signals between a memory controller device (50) and a DRAM memory device (52). The DRAM memory interface comprises: data lines (44) for transmitting data signals; one or more control line(s) for transmitting control signals; one or more address line(s) for transmitting address signals; for each line, a transmitter device (41) connected to a first end of the line and a receiver device (42) connected to a second end of the line; wherein: each line is a single ended line wherein a signal transmitted on the line is referenced to a first reference voltage line (46); and - each line has an termination (Z 1 , Z 2 ) on both the first and second ends of the line by connecting a first impedance (Z 1 ) to the first end of the line and a second impedance (Z 2 ) to the second end of the line.
Abstract:
The semiconductor module includes a plurality of memory die on a first side of a substrate and a plurality of buffer die on a second side of the substrate. Each of the memory die is disposed opposite and electrically coupled to one of the buffer die.
Abstract:
An interconnect structure (200) includes a signal wire (210) and an' active shield line (220) adjacent to, but removed from, signal wire (210). Interconnect structure (200) also includes another active shield line (230) adjacent to, but removed from, signal wire (210). A signal driver (205) is connected to signal wire (210). Signal driver (205) drives a pulse on signal wire (210). A shield driver (225) is connected to active shield line (220). Shield driver (220) asserts a signal on active shield line (220) substantially simultaneous with the pulse. Another shield driver (235) is connected to another active shield line (230). Another shield driver (235) asserts a signal on another active shield line (230) substantially simultaneous with the pulse. The effect of the simultaneous signals on signal wire (210) and active shield lines (220, 230) is to effectively cancel the lateral capacitances between these lines.