Abstract:
A susceptor composition that can bond two or more layers or substrates to one another and that can be used to coat or cut a substrate. The susceptor composition is activated in the presence of radio frequency (RF) energy. In one embodiment, the susceptor composition of the present invention comprises at least one ionomer and a polar carrier. The ionomer and polar carrier are blended with one another and form a mixture, preferably a uniform mixture. The ionomer and polar carrier are present in an amount effective to allow the susceptor composition to be heated by RF energy. Also disclosed are RF induction heating systems.
Abstract:
A method of gluing pieces of substrate together, by using an expandable gluing system comprising a resin component and a hardener component, wherein the hardener component is acidic, and the resin component comprises one or more gas generating substances capable of forming a gas when contacted with the hardener component, whereby the resin and the hardener components are separately applied onto the substrate. The invention also relates to a device suitable for carrying out the method.
Abstract:
A method of separate application of resin and hardener components of an amino resin gluing system onto a substrate, characterized in that the hardener comprises a volatile acid, and optionally a filler in an amount of less than 20 % by weight, wherein the components of the gluing system are applied in the form of strands or by means of spraying, or any combination thereof, in optional order of application. The invention also relates to a hardener composition for use in the method and to a device suitable for carrying out the method.
Abstract:
A non-environmentally hazardous, non-volatile adhesive promoter composition useful in promoting the cure and/or enhancing adhesion of adhesives and for use in combination with adhesive bond polymerization. The promoter composition is a combination of a fluid carrier that remains substantially present during the curing of an adhesive composition and an active component capable of promoting the cure and/or enhancing adhesion of the adhesive and being miscible in the fluid carrier.
Abstract:
Polymer-in-monomer adhesives containing peroxides which are curable by contact with an activator catalyst are used to adhere protective polymer sheeting to heat-absorbing substrates, especially metal pipelines. Heat-recoverable sheeting, preferably 10 to 50% recoverable, carrying curable mixtures of acrylic polymer in acrylic monomer plus peroxide, is preferred, with metal salt and/or amine activator catalysts being preapplied to the pipeline or other substrate.
Abstract:
Curable adhesive films, primers for adhesion of curable adhesive films, and adhesive systems comprising adhesive films and primers are provided. In some embodiments, an adhesive system comprises: I) a curable adhesive free-standing film comprising a blend of: a) a first film-forming polymer or oligomer; b) a first species comprising first unsaturated free-radically polymerizable groups, which may be a) or a species other than a); and c) a first transition metal cation; and II) a primer for adhesion of a curable adhesive free-standing film to a first substrate comprising an oxidizing agent. In some embodiments, an adhesive system comprises: I) a curable adhesive free-standing film comprising an outer surface bearing embossed air bleed channels capable of aiding in escape of air during application of the outer surface to a primed substrate; and II) a primer comprising components that initiate cure of the curable adhesive free-standing film.
Abstract:
Techniques are described for mounting a display and/or display cover to a housing of a display device, such as a mobile phone. In an embodiment, the housing and display cover include chamfered edges at complementary angles to allow for an "edge-to-edge" display. The display cover and housing are affixed to each other at the chamfered edges using curable liquid adhesive.
Abstract:
Die Erfindung betrifft ein Verfahren zum Verkleben zweier Oberflächen mittels eines reaktiven Klebstofffilm-Systems umfassend zumindest zwei Klebstoff-Filme (F1 und F2), wobei die Klebstoff-Filme jeweils zumindest eine Reaktivkomponente (R1 und R2) umfassen, wobei die Verklebung durch eine Reaktion bewirkt wird, die die Anwesenheit beider Reaktivkomponenten (R1 und R2) erfordert, wobei vor der Verklebung zwischen den zur Reaktion miteinander in Kontakt zu bringenden Klebstoff-Filme (F1 und F2) eine für die Reaktivkomponenten (R1 und R2) undurchlässige Trennschicht (T) vorgesehen ist, und die Trennschicht (T) zur Bewirkung der Verklebung zumindest teilflächig mittels eines Lasersentfernt wird, so dass die Klebstoff-Filme (F1 und F2) miteinander in unmittelbaren Kontakt kommen und die Reaktion unter Anwesenheit der beiden Reaktivkomponenten (R1 und R2) einsetzt, sowie ein reaktives Klebstofffilm-System zur Verwendung in diesem Verfahren.
Abstract:
An adhesive bonding process can include: - treating at least one region of the surface of a silicone part so as to increase the surface energy of the region treated to a value greater than 30 m J/m 2 , - providing a double-sided adhesive tape comprising a support tape, a first layer of a pressure-sensitive adhesive (PSA) on a first face of the support tape and a second layer of a PSA on the second face of the support tape, - applying a non-silicone-based structural adhesive to the treated region of the surface of the silicone part and/or to the first PSA layer, - bringing the treated region of the surface of the silicone part into contact with the first PSA layer, and - curing the non-silicone-based structural adhesive. An assemblage can be obtained by such a process.
Abstract:
Die vorliegende Erfindung betrifft ein Verfahren zum Verkleben von Substraten, umfassend folgende Schritte: • I) Zwischen wenigstens zwei Substraten wird (a) wenigstens eine Klebstoff-Komponente (a) und wenigstens eine Isocyanat Komponente (b) aufgebracht; • II) die Substrate werden gegeneinander gepresst; dadurch gekennzeichnet, dass im Schritt I) die Klebstoff-Komponente und die Isocyanat-Komponente separat auf das Substrat appliziert werden. Weiterhin betrifft die Erfindung einen nach diesem Verfahren erhaltlichen Verbund. In einer bevorzugten Ausfuhrungsform wird eine wassrige Polyurethandispersion oder eine Polyurethanlösung in organischen Losungsmittel als Klebstoffkomponente verwendet.