Abstract:
An image sensor package (1100) includes an image sensor (106), a window (122), and a molding (124C), where molding (124C) includes a lens holder extension portion (1102) extending upwards from window (122). Lens holder extension portion (1102) includes a female threaded aperture (1106) extending from window (122) such that window (122) is exposed through aperture (1106). A lens (1210) is supported in a threaded lens support (1112). Lens support (1112) is threaded into aperture (1106) of lens holder extension portion (1102). Lens (1210) is readily adjusted relative to image sensor (106) by rotating lens support (1112).
Abstract:
The invention concerns an optoelectronic device comprising filtering means (3) for transmitting a selected spectral part of light waves and for reflecting a matching spectral part, placed between means (4) for reflecting the selected spectral part towards the filtering means, and converting means (1) for transmitting to the filtering means the light waves to be filtered. The converting means are at a first distance (d1) from the filtering means, selected so that the waves they transmit and the reflected matching spectral part generate a first stationary wave whereof the associated electric field has a node in the conversion means (1), and at a second distance (d2) from the reflecting means selected so that the selected spectral part and the selected and reflected spectral part generate a second stationary wave whereof the associated electric field has an anti-node in the conversion means.
Abstract:
The invention concerns an optoelectronic device comprising filtering means (3) for transmitting a selected spectral part of light waves and for reflecting a matching spectral part, placed between means (4) for reflecting the selected spectral part towards the filtering means, and converting means (1) for transmitting to the filtering means the light waves to be filtered. The converting means are at a first distance (d1) from the filtering means, selected so that the waves they transmit and the reflected matching spectral part generate a first stationary wave whereof the associated electric field has a node in the conversion means (1), and at a second distance (d2) from the reflecting means selected so that the selected spectral part and the selected and reflected spectral part generate a second stationary wave whereof the associated electric field has an anti-node in the conversion means.
Abstract:
The invention relates to a flat image acquisition system which has a lens matrix arrangement (3)containing a plurality of adjacent microlenses (4). The system also comprises a flat photodetector arrangement which is positioned in an image plane (6) in the beam path, behind the microlenses (4). The distance (A) between the front of the lens matrix arrangement (3) and the sensitive surface of the photodetector arrangement is less than 1 cm, especially less than 0.5 cm.
Abstract:
A photosensitive device (46) with a microlens array (44) may be packaged for surface mount packaging (48) and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat steps of increasing time and temperature. In addition, the microlens may be bleached to prevent degradation of its optical transmissivity at temperatures normally associated with surface mount techniques.
Abstract:
A microcollector (10) for photosensitive devices such as imaging arrays for digital cameras, scanners and other devices, may be formed on a semiconductor structure (14) adjacent to a photosensitive element (20). The collector (10) may include wedge-shaped reflectors (12) arranged about the photosensitive element (20) so as to reflect incident light towards the photosensitive element (20). The collector (10) may be used in conjunction with a refractive/diffractive microlens (24) to further focus light onto the photosensitive element. As a result, the fill factor of the photosensitive device may be improved, and the signal to noise ratio may also be enhanced.
Abstract:
A microbridge detector is with an active area that is smaller than a pixel collection area of the microbridge detector. The microbridge detector includes a semiconductor substrate on a first level and a microbridge level disposed above the semiconductor substrate. The microbridge level includes the active area having the pixel collection area greater than a square area of the active area of the microbridge detector. In addition, downwardly extending leg portions are a continuation of the microbridge level and support the microbridge level above the semiconductor substrate so that a thermal isolation gap exists between the microbridge level and the semiconductor substrate. Further, electrically conductive paths are included within the downwardly extending leg portions and connect the active area in the microbridge level to the semiconductor substrate. With this apparatus, the microbridge detector is provided with a pixel collecting area that is larger than a fill factor of the microbridge detector and thus is provided with an enhanced optical collection sensitivity. In addition, with this apparatus, the microbridge detector device can be fabricated with a smaller active area without having to build a smaller microbridge level and thus is not limited by processing techniques.
Abstract:
A resilient, fixed-spacing, fixed-orientation mounting of a lens (450) with respect to a semiconductor die (430) having an array of photosensitive elements is established by forming ''legs'' on the lens and corresponding ''landing pads'' on the die, and further by providing locating pins (463, 469) passing through a flexible substrate (434) mounting the die and into a PCB (480) supporting the substrate-mounted die. In one embodiment, the locating pins are discrete elements. In another embodiment, the pins are formed integrally with the legs of the lens. In either case, the landing pads are preferably formed on the die as ''bumps'' formed in a tape-automated bonding (TAB) process.
Abstract:
A photodetector which comprises a surface-profiled Schottky barrier detector (22) having a peak response which is a function of wavelength and of angle of incidence, and a blazed diffraction grating (20) positioned in front of the barrier detector and having its dispersion selected so that its first order of diffracted light is incident on the barrier detector with an angle of incidence (A1, A2) which so varies as substantially to compensate for the peak response function of the barrier detector, thereby to produce a peak response from the barrier detector throughout a range of wavelengths. In this way, the bandwidth of the photodector can be controlled.
Abstract:
An electrostatic discharge guard structure for photonic platform based photodiode systems is provided. In particular this application provides a photodiode assembly comprising: a photodiode (such as a Si or SiGe photodiode), a waveguide (212) (such as a silicon waveguide); and a guard structure, wherein the guard structure comprises a diode, extends about all or substantially all of the periphery of the Si or SiGe photodiode and allows propagation of light from the silicon waveguide (212) into the Si or SiGe photodiode.
Abstract translation:提供了用于基于光子平台的光电二极管系统的静电放电保护结构。 特别地,本申请提供了一种光电二极管组件,其包括:光电二极管(诸如Si或SiGe光电二极管),波导(212)(诸如硅波导); 以及保护结构,其中保护结构包括二极管,围绕Si或SiGe光电二极管的全部或基本上全部外围延伸,并且允许来自硅波导(212)的光传播到Si或SiGe光电二极管中。 p >