Abstract:
High-output coherent light is prevented from being emitted into the space from a semiconductor laser device to ensure the safety of the eyes and to improve the reliability. All or part of the surface of a molded resin (4) is roughened. The roughened portion diffuses light. Alternatively, a cap and a cap glass having a light-diffusing function are integrally molded. Further alternatively, a resin part mixed with a material of different refractive index or a resin part made of a birefringent resin is provided out of contact with the laser chip so that the resin part diffuses light. Still further alternatively, having a resin part mixed with a material of different refractive index or a region of a birefringent resin material is provided out of the laser chip so that the region diffuses light.
Abstract:
A new type of transmitter optical subassembly (TOSA) especially suitable for fiber optic communication. The TOSA has a light source such as a laser diode (4), preferably of the surface-emitting type, with an inherent mode-field diameter matched without a lens to that of the optical fiber (13), resulting in enhanced light coupling, more relaxed tolerances, and less sensitivity to laser misalignment. The TOSA can be in a receptacle form, with an annulus(6) having a light conductor (5) matched to the light source and the fiber, or can be in "pigtail" (41) form with a permanently attached buffered (45) optical fiber. Only one active alignment is required, and can be eliminated, if the laser diode (4) is aligned passively using lands (20, 23) on the annulus (6) or the end of the fiber cladding, and matching lands (21, 25) on a mounting substrate (29), with molten solder (22, 24) alignment used to draw the two into alignment. To reduce reflections back into the laser (4) the laser sides of the annulus (6) and the light conductor (5) can be machined at an angle with respect to the optic axis, or the diode (4) can be placed at an angle relative to the fiber. This design not only reduces back reflections into the laser diode, but the reflected light can be used to monitor and control the laser diode output.
Abstract:
Beleuchtungsvorrichtung (1) für ein Visualisierungssystem, insbesondere für einen optischer Sensor, eines Kraftfahrzeugs, wobei das Visualisierungssystem zum Erfassen einer vor dem Kraftfahrzeug, vorzugsweise durch einen Benutzer, entstehenden Szene ausgebildet ist.
Abstract:
Die Erfindung betrifft ein Lasermodul (100) umfassend -ein Gehäuse (110) mit einer Kavität (111) und einer Fensteröffnung (112), -eine in der Kavität (111) angeordnete seitenemittierende Halbleiterlaserdiode (120) zum Emittieren einer Lichtstrahlung in Form eines Laserstrahls (123), -eine optische Umlenkstruktur (130) zum Umlenken des von der Halbleiterlaserdiode (120) emittierten Laserstrahls (123) in Richtung der Fensteröffnung (112), und -eine im Bereich der Fensteröffnung (112) angeordnete optische Auskopplungsstruktur (140, 157) zum Auskoppeln des Laserstrahls (125) in einer definierten Richtung und/oder mit einem definierten Abstrahlprofil, wobei die optische Umlenkstruktur (130) und die optische Auskopplungsstruktur (140, 157) einstückig in Form eines gemeinsamen optischen Bauteils(150) ausgebildet sind.
Abstract:
Ein optoelektronisches Bauelement (10) umfasst einen ersten optoelektronischen Halbleiterchip (100) zur Emission von Nutzlicht (105), das in dem optoelektronischen Bauelement (10) entlang eines ersten Lichtwegs (110) verläuft, ein optisches Element (300), das in dem ersten Lichtweg (110) angeordnet ist, einen zweiten optoelektronischen Halbleiterchip (200) zur Emission von Prüflicht (205), das in dem optoelektronischen Bauelement (10) entlang eines zweiten Lichtwegs (210) verläuft, wobei das optische Element (300) einen Teil des zweiten Lichtwegs (210) bildet, und einen Lichtdetektor (400) zur Detektion von Prüflicht (205), das den zweiten Lichtweg (210) durchlaufen hat.
Abstract:
This disclosure relates to illumination modules operable to increase the area over which an illumination source, such as a vertical-cavity surface-emitting laser or light-emitting diode, illuminates. Such illumination modules include a substrate having electrical contacts, an illumination source electrically connected to the substrate, a collimation assembly operable to collimate the light generated from the illumination source, a translation assembly operable to translate light over an area, and a mask assembly. In various implementations the illumination source may be rather small in area, thereby reducing the cost of the illumination module. Some implementations of the illumination module can be used for the acquisition of three-dimensional data in some cases, while in other cases some implementations of the illumination module can be used for other applications requiring projected light.
Abstract:
The present invention relates to a first container (1) with an internal space (3) for accommodating a vertical external cavity surface emitting laser device (50). Said first container (1) hermetically seals said internal space (3) from an external space (4), wherein said first container (1) has at least one wall with at least one first through-opening (23). Said at least one first through-opening (23) is adapted for passage of an optical pump beam (7) from the external space (4) into the internal space (3), and/or for passage of a laser emission beam (8) from the internal space (3) into the external space (4). Moreover, said at least one first through-opening (23) is hermetically sealed by a sealing mirror (21), wherein said sealing mirror (21) is adapted to form an external cavity (2) of the vertical external cavity surface emitting laser device (50) with a second mirror (22) in the internal space (3). Furthermore, the present invention relates to laser device with such a first container and to an assembly method of the laser device.
Abstract:
An embodiment of the invention provides a low inductance light source module (20), which may have a small footprint and comprise a printed circuit board (PCB) mount (40) having first and second conducting traces (44, 45) formed on a side of the PCB mount (40) and a semiconducting light source (30) having a first electrical contacts for receiving power that is bonded to the first conducting trace (44) with a conducting bonding material and a second electrical contact (32) for receiving power that is connected by at least one bondwire (62) to the second conducting trace (45).