公开(公告)号：WO00018542A1

公开(公告)日：2000-04-06

申请号：PCT/US1999/022037

申请日：1999-09-22

IPC: B24B41/04 ,  B24B53/007 ,  B24B53/017 ,  H01L21/304 ,  B24B37/04

CPC classification number: B24B53/017 ,  B24B41/04

Abstract: A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid, such as water or reactive solvents.

Abstract translation: 调节头使用流体吹扫系统来防止碎片进入调节器头部的开口并导致调节器头部中的轴承和其它运动部件的劣化。 流体可以是气体，例如氮气，或液体，如水或反应性溶剂。

公开(公告)号：WO99050023A1

公开(公告)日：1999-10-07

申请号：PCT/FR1999/000739

申请日：1999-03-30

IPC: B23Q39/04 ,  B24B37/34 ,  B24B41/02 ,  B24B53/007 ,  B24B53/017 ,  H01L21/304 ,  B24B37/04

CPC classification number: B24B37/345 ,  B24B41/02 ,  B24B53/017

Abstract: The invention concerns a polishing machine comprising at least a base unit (10) in the form of a parallelepiped cell (12), with a first loading and unloading surface (14), a second opposite parallel surface (16) for access to the working zone located in an intermediate section (24), and third and fourth surfaces (18, 20). The loading pallet board (48) and unloading pallet board (56) are respectively borne by a loading arm (50) and an unloading arm (58) operating independently of each other, said pallet boards being both accessible on the first surface (14) side. The mechanism (28, 30) is located in the lower section beneath the cell (12) intermediate section (24), while the automaton is arranged in the top section, the mechanism and the automaton being accessible on the second surface (16) side.

Abstract translation: 本发明涉及一种抛光机，其至少包括平行六面体电池（12）形式的基本单元（10），具有第一加载和卸载表面（14），第二相对的平行表面（16），用于接近工作 区域，以及第三和第四表面（18,20）。 装载托板（48）和卸载托板（56）分别由彼此独立地操作的装载臂（50）和卸载臂（58）承载，所述托板在所述第一表面（14）上均可接近， 侧。 机构（28,30）位于电池（12）中间部分（24）下方的下部分中，而自动机被布置在顶部部分中，机构和自动机在第二表面（16）侧可接近 。

公开(公告)号：WO99028084A1

公开(公告)日：1999-06-10

申请号：PCT/US1998/024960

申请日：1998-11-20

IPC: B24B53/12 ,  B24B53/007 ,  B24B53/017 ,  B24D18/00 ,  H01L21/304 ,  B24B37/04

CPC classification number: B24B53/017 ,  B24B53/12 ,  B24D18/00 ,  Y10S228/903 ,  Y10T29/4981 ,  Y10T29/49888 ,  Y10T29/49982

Abstract: A method and apparatus for polishing and planarizing workpieces such as semiconductor wafers is presented. Conditioning rings, which are used to condition polishing pads used in the planarization or polishing of semiconductor wafers, are shown which utilize brazed diamond technology in association with a coating of a titanium nitride containing composition or a thin film diamond deposition in order to reduce the fracturing and loss of cutting elements bonded to the conditioning ring.

Abstract translation: 提出了用于抛光和平坦化诸如半导体晶片的工件的方法和装置。 用于调节在半导体晶片的平面化或抛光中使用的抛光垫的调节环被示出为利用钎焊金刚石技术与含氮化钛的组合物或薄膜金刚石沉积的涂层相结合以减少压裂 以及与调节环结合的切割元件的损失。

公开(公告)号：WO99024218A1

公开(公告)日：1999-05-20

申请号：PCT/US1998/023575

申请日：1998-11-05

IPC: B24B37/26 ,  B24B41/047 ,  B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  B24D3/28 ,  B24D3/32 ,  B24D3/34 ,  B24D13/10 ,  B24D13/14 ,  B29C70/58 ,  B29C70/66 ,  C08J5/14 ,  G11B23/00 ,  H01L21/304 ,  H01L21/306 ,  H01L21/3105 ,  B24B1/00

CPC classification number: H01L21/02024 ,  B24B37/26 ,  B24B41/047 ,  B24B53/00 ,  B24B53/017 ,  B24D3/28 ,  B24D3/32 ,  B24D3/34 ,  B24D13/10 ,  B29C70/58 ,  B29C70/66 ,  B29L2031/736 ,  G11B23/0021 ,  H01L21/30604 ,  H01L21/30625 ,  H01L21/31053

Abstract: Method of manufacturing a memory disk or a semiconductor device using a polishing apparatus (100) having a substrate and a fixed abrasive pad (6), the fixed abrasive pad (6) having a three-dimensional fixed abrasive polishing layer having a plurality of protrusions (16) and recesses (14) between the protrusions (16) and a plurality of nanoasperities, the abrasive polishing layer comprising a plurality of particles (18), the average particle size multiplied by the particle's valley abrasion number is less than 300, the polishing layer further comprising a polishing surface.

Abstract translation: 使用具有基板和固定研磨垫（6）的抛光装置（100）制造存储盘或半导体装置的方法，所述固定研磨垫（6）具有三维固定研磨抛光层，所述三维固定研磨抛光层具有多个突起 （16）和所述突起（16）之间的凹部（14）和多个纳米级别，所述研磨抛光层包括多个颗粒（18），所述平均粒度乘以所述颗粒的谷磨耗数小于300， 抛光层还包括抛光表面。

公开(公告)号：WO98057779A1

公开(公告)日：1998-12-23

申请号：PCT/EP1998/003552

申请日：1998-06-12

IPC: B24B53/007

CPC classification number: B24B53/007

Abstract: The invention relates to a method for cleaning abrasive disks, wherein blunt or loaded abrasive disks are blasted with a powder from a high-pressure cleaning device.

Abstract translation: 它提出了一种用于砂轮的纯化方法，是在钝照射或添加从粉末高压清洗磨削粉末轮。

公开(公告)号：WO9624839A2

公开(公告)日：1996-08-15

申请号：PCT/US9601027

申请日：1996-01-30

Applicant: MICRON TECHNOLOGY INC

Inventor： MEIKLE SCOTT G ,  HUDSON GUY F

IPC: G01N21/64 ,  B24B37/24 ,  B24B49/12 ,  B24B53/007 ,  B24B53/017 ,  B24D18/00 ,  H01L21/304

CPC classification number: B24B37/24 ,  B24B49/12 ,  B24B53/017 ,  B24D18/00

Abstract: A measurement of polyurethane pad characteristics is used to predict performance characteristics of polyurethane pads used for chemical mechanical planarization (CMP) of semiconductor wafers, and to adjust process parameters for manufacturing polyurethane pads. In-situ fluorescence measurements of a pad that has been exposed to a high pH and high temperature environment are performed. The fluorescence characteristics of the pad are used to predict the rate of planarization of a wafer. A portion of one pad from a manufacturing lot is soaked in an organic solvent which causes the portion to swell. The relative increase in size is indicative of the performance characteristics of pads within the manufacturing lot. Statistical Process Control methods are used to optimize the CMP pad manufacturing process. Predicted pad characteristics are available for each pad.

Abstract translation: 使用聚氨酯垫特性的测量来预测用于半导体晶片的化学机械平面化（CMP）的聚氨酯垫的性能特征，并且调整制造聚氨酯垫的工艺参数。 进行暴露于高pH和高温环境的垫的原位荧光测量。 垫的荧光特性用于预测晶片的平坦化速率。 来自制造批次的一个垫的一部分被浸泡在有机溶剂中，这导致该部分膨胀。 尺寸的相对增加表示制造批次内的焊盘的性能特征。 统计过程控制方法用于优化CMP垫制造过程。 每个垫可预测垫特性。

公开(公告)号：WO2018189155A1

公开(公告)日：2018-10-18

申请号：PCT/EP2018/059118

申请日：2018-04-10

Applicant: HOMAG BOHRSYSTEME GMBH

Inventor： BETTERMANN, Thomas

IPC: B24B21/12 ,  B24B21/18 ,  B24B53/02 ,  B24B53/007 ,  B24B49/10 ,  B24B49/18

Abstract: Die vorliegende Erfindung betrifft eine Schleifvorrichtung zur Bearbeitung eines, insbesondere plattenförmigen, Werkstücks (W). Die Schleifvorrichtung umfasst einen Emitter (31) zum Emittieren elektromagnetischer Wellen in Richtung des Schleifbands (10) und einen Detektor (32) zum Detektieren elektromagnetischer Wellen, die vom Schleifband (10) reflektiert werden.

公开(公告)号：WO2017210755A1

公开(公告)日：2017-12-14

申请号：PCT/BR2016/000058

申请日：2016-06-09

Applicant: EMBRAER S.A.

Inventor： SCAFUTTO SCOTTON, Rogério ,  GONCALVES POLI, Rodrigo Cesar ,  VALDECIR, Vitor Inacio ,  LEITE FILHO, Jaime ,  GUEVARA WATTS, Luis ,  JOYCE, Jeffrey R. ,  STEWARD, Anthony George

IPC: B24B27/00 ,  B24B19/26 ,  B24B55/02 ,  B23Q11/00 ,  B60S3/00 ,  B25J5/00 ,  B25J11/00 ,  B64F5/00 ,  B24D9/08 ,  B24B53/007

Abstract: Processe and system for preparing a vehicle surface (e.g., an aircraft fuselage) for painting include a preparation booth (100) which is sized and configured to house the vehicle (F). At least one robotic assembly (200a, 200b) is reciprocally movable within the preparation booth (100) relative to a longitudinal axis of the vehicle (F), and is provided with a robotic hand (230) having at least one abrasive disc (242a) attached to an attachment pad (242) of the robotic hand (230), and at least one nozzle (252a, 252b, 252c) for discharging a stream of rinse fluid. Operation of the at least one robotic assembly (230) will cause the at least one abrasive disc (242a) of the robot hand (230) to abrade the surface of the vehicle (F). The robotic hand (230) may thereafter be maneuvered so that the at least one nozzle (252a, 252b, 252c) is directed toward the abraded vehicle surface (F). A stream of rinse fluid may then be discharged through the at least one nozzle (252a, 252b, 252c) and towards the abraded surface of the vehicle (F) so as to rinse the abraded surface of particulate matter.

Abstract translation: 用于制备用于涂漆的车辆表面（例如，飞机机身）的步骤和系统包括尺寸和构造成容纳车辆（F）的制备室（100）。 至少一个机器人组件（200a，200b）相对于所述车辆（F）的纵向轴线在所述制备室（100）内可往复运动，并且设置有机器人手（230），所述机器人手具有至少一个研磨盘（242a ）连接到机器人手（230）的附接垫（242）上，以及至少一个喷嘴（252a，252b，252c），用于排出冲洗流体流。 至少一个机器人组件（230）的操作将使机器人手（230）的至少一个研磨盘（242a）磨蚀车辆（F）的表面。 此后机器人手（230）可被操纵，使得至少一个喷嘴（252a，252b，252c）指向磨损的车辆表面（F）。 然后可通过所述至少一个喷嘴（252a，252b，252c）并朝向车辆（F）的磨蚀表面排出漂洗流体流，以漂洗颗粒物质的研磨表面。

公开(公告)号：WO2009058272A1

公开(公告)日：2009-05-07

申请号：PCT/US2008/012234

申请日：2008-10-29

Applicant: EKC TECHNOLOGY, INC. ,  LEE, Wai, Mun

Inventor： LEE, Wai, Mun

IPC: B24B53/007 ,  C11D3/32 ,  C11D7/32 ,  C11D11/00 ,  H01L21/321 ,  H01L21/02

CPC classification number: B24B53/017 ,  B08B1/007 ,  C11D3/32 ,  C11D7/3263 ,  C11D11/0041

Abstract: The present invention relates to methods of using amidoxime compositions for cleaning polishing pads, particularly after chemical mechanical planarization or polishing is provided. A polishing pad is cleaned of Cu CMP by-products, subsequent to or during planarizing a wafer, to reduce pad-glazing by applying to the polishing pad surface a composition comprising an aqueous amidoxime compound solution in water.

Abstract translation: 本发明涉及使用偕胺肟组合物清洁抛光垫的方法，特别是在提供化学机械平面化或抛光之后。 在平坦化晶片之后或期间，在抛光垫上清洗Cu CMP副产物，通过向抛光垫表面施加包含水中偕胺肟混合溶液的组合物来减少抛光垫。

公开(公告)号：WO2007045267A1

公开(公告)日：2007-04-26

申请号：PCT/EP2005/012343

申请日：2005-10-19

Applicant: FREESCALE SEMICONDUCTOR, INC. ,  STMICROELECTRONICS (CROLLES 2) SAS ,  STMICROELECTRONICS Srl ,  LAFON, Jean-Marc ,  DELMONACO, Silvio ,  PETITDIDIER, Sebastien

Inventor： LAFON, Jean-Marc ,  DELMONACO, Silvio ,  PETITDIDIER, Sebastien

IPC: B24B37/04 ,  B24B53/007 ,  B24B1/04 ,  B24B49/10 ,  B24B49/18

CPC classification number: B24B49/18 ,  B24B1/04 ,  B24B53/017

Abstract: A system for cleaning a conditioning device to improve the efficiency of the conditioning of a polishing pad using the conditioning device as part of a chemical-mechanical polishing process, the system comprising a conditioning device; a fluid dispenser arranged to dispense a fluid on the conditioning device; and an acoustic nozzle arranged to emit a megasonic or ultrasonic signal at the conditioning device while the fluid dispenser is dispensing the fluid on the conditioning device.

Abstract translation: 一种用于清洁调节装置以提高使用调节装置调节抛光垫的效率作为化学机械抛光工艺的一部分的系统，该系统包括调节装置; 流体分配器，布置成在调节装置上分配流体; 以及声喷嘴，其布置成在所述流体分配器在所述调节装置上分配流体时在所述调节装置处发出兆声波或超声波信号。