公开(公告)号：WO2010148398A2

公开(公告)日：2010-12-23

申请号：PCT/US2010/039359

申请日：2010-06-21

Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN ,  NAJAFI, Khalil ,  AKTAKKA, Ethem, Erkan ,  KIM, Hanseup

Inventor： NAJAFI, Khalil ,  AKTAKKA, Ethem, Erkan ,  KIM, Hanseup

IPC: B81C1/00 ,  B81B7/00 ,  H01L21/60

CPC classification number: B81C1/0019 ,  B81C2201/019 ,  H01L24/82 ,  H01L2224/24051 ,  H01L2224/76155 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T156/10 ,  H01L2924/00

Abstract: A thin-film device and a method of fabricating the thin-film device are provided herein. The thin-film device comprises a bond layer, a film layer that has bulk material properties, and a substrate that has a heat- sensitive component disposed thereon. The method of fabricating the thin-film device comprises the step of providing an active material that has bulk material properties. The active material is bonded to the substrate through the bond layer. After bonding the active material to the substrate, the active material that is bonded to the substrate is thinned to produce the film layer of the thin-film device. The substrate is provided with the heat- sensitive component disposed thereon prior to bonding the active material to the substrate.

Abstract translation: 本文提供薄膜器件和制造薄膜器件的方法。 薄膜器件包括接合层，具有散装材料性质的膜层和设置有热敏元件的衬底。 制造薄膜器件的方法包括提供具有散装材料性质的活性材料的步骤。 活性材料通过接合层与基底结合。 在将活性材料粘合到基板上之后，将与基板结合的活性材料变薄以制造薄膜器件的薄膜层。 在将活性材料粘合到基底之前，在基底上设置有热敏元件。

公开(公告)号：WO2010148398A3

公开(公告)日：2011-04-28

申请号：PCT/US2010039359

申请日：2010-06-21

Applicant: UNIV MICHIGAN ,  NAJAFI KHALIL ,  AKTAKKA ETHEM ERKAN ,  KIM HANSEUP

Inventor： NAJAFI KHALIL ,  AKTAKKA ETHEM ERKAN ,  KIM HANSEUP

IPC: B81C1/00 ,  B81B7/00 ,  H01L21/60

CPC classification number: B81C1/0019 ,  B81C2201/019 ,  H01L24/82 ,  H01L2224/24051 ,  H01L2224/76155 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T156/10 ,  H01L2924/00

Abstract: A thin-film device and a method of fabricating the thin-film device are provided herein. The thin-film device comprises a bond layer, a film layer that has bulk material properties, and a substrate that has a heat- sensitive component disposed thereon. The method of fabricating the thin-film device comprises the step of providing an active material that has bulk material properties. The active material is bonded to the substrate through the bond layer. After bonding the active material to the substrate, the active material that is bonded to the substrate is thinned to produce the film layer of the thin-film device. The substrate is provided with the heat- sensitive component disposed thereon prior to bonding the active material to the substrate.

Abstract translation: 本文提供薄膜器件和薄膜器件的制造方法。 薄膜器件包括接合层，具有散装材料性质的膜层以及设置有热敏元件的衬底。 制造薄膜器件的方法包括提供具有散装材料性质的活性材料的步骤。 活性物质通过接合层与基材结合。 在将活性材料粘合到基板上之后，将与基板结合的活性材料变薄以制造薄膜器件的薄膜层。 在将活性材料粘合到基底之前，在衬底上设置有设置在其上的热敏部件。