Abstract:
A polarization resistant solar cell using an oxygen-rich interface layer (209) is provided. The oxygen-rich interface layer may be comprised of SiOxNy, which may have a graded profile that varies between oxygen-rich proximate to the solar cell to nitrogen-rich distal to the solar cell. A silicon oxide passivation layer (601) may be interposed between the solar cell and the SiOxNy graded dielectric layer. The graded SiOxNy dielectric layer may be replaced with a non-graded SiOxNy dielectric layer and a SiN AR coating (703).
Abstract translation:提供了使用富氧界面层(209)的耐极化太阳能电池。 富氧界面层可以由SiO x N y组成,其可以具有在太阳能电池附近的富含氧和太阳能电池远端富氮之间变化的分级分布。 氧化硅钝化层(601)可以介于太阳能电池和SiO x N y梯度电介质层之间。 分级的SiO x N y介电层可以用非梯度的SiO x N y介电层和SiN-AR涂层(703)代替。
Abstract:
A polarization resistant solar cell is provided. The solar cell (200) uses a dual layer dielectric stack disposed on the front surface of the cell. The dielectric stack consists of a passivation layer (209) disposed directly on the front cell surface and comprised of either SiO x or SiON, and an outer AR coating (211) comprised of SiCN.
Abstract:
A polarization resistant solar cell using an oxygen-rich interface layer is provided. The oxygen-rich interface layer may be comprised of SiO x N y , which may have a graded profile that varies between oxygen-rich proximate to the solar cell to nitrogen-rich distal to the solar cell. A silicon oxide passivation layer may be interposed between the solar cell and the SiO x N y graded dielectric layer. The graded SiO x N y dielectric layer may be replaced with a non-graded SiO x N y dielectric layer and a SiN AR coating.
Abstract translation:提供了使用富氧界面层的耐极化太阳能电池。 富氧界面层可以由SiO x N y组成,其可以具有在太阳能电池附近的富含氧和太阳能电池远端富氮之间变化的分级分布。 氧化硅钝化层可以介于太阳能电池和SiO x N y梯度电介质层之间。 分级的SiO x N y介电层可以用非梯度的SiO x N y电介质层和SiN-AR涂层代替。
Abstract:
A simplified manufacturing process and the resultant bifacial solar cell (BSC) are provided, the simplified manufacturing process reducing manufacturing costs. The BSC includes an active region (107) located on the front surface of the substrate (101), formed for example by a phosphorous diffusion step. The back surface includes a doped region (103), the doped region having the same conductivity as the substrate but with a higher doping level. Contact grids (111/113) are formed, for example by screen printing. Front junction isolation is accomplished using a laser scribe.
Abstract:
A simplified manufacturing process and the resultant bifacial solar cell (BSC) are provided, the simplified manufacturing process reducing manufacturing costs. The BSC includes a back surface contact grid (113) and an overlaid blanket metal reflector (117). A doped amorphous silicon layer is interposed between the contact grid and the blanket layer.
Abstract:
A simplified manufacturing process and the resultant bifacial solar cell (BSC) are provided, the simplified manufacturing process reducing manufacturing costs. The BSC includes an active region (103) located on the front surface of the substrate (101), formed for example by a phosphorous diffusion step. After removing the PSG, assuming phosphorous diffusion, and isolating the front junction, dielectric layers (105/107) are deposited on the front and back surfaces. Contact grids (109/111) are formed, for example by screen printing. Prior to depositing the back surface dielectric, a metal grid may be applied to the back surface, the back surface contact grid registered to, and alloyed to, the metal grid during contact firing.
Abstract:
Formation of a solar cell device from upgraded metallurgical grade silicon which has received at least one defect engineering process and including a low contact resistance electrical path. An anti- reflective coating is formed on an emitter layer and back contacts are formed on a back surface of the bulk silicon substrate. This photovoltaic device may be fired to form back surface field temperatures sufficiently low to avoid reversal of previous defect engineering processes. The process further forms openings in the anti-reflective coating and a low contact resistance metal layer, such as nickel layer, over the openings in the coating. The process may anneal the low contact resistance metal layer to form n- doped portion and complete an electrically conduct path to the n-doped layer. This low temperature metallization (e.g.,
Abstract:
In one embodiment, a gate of a transistor is formed by performing a first thermal treatment on a silicon layer (112'), forming a metal stack (110') over the silicon layer (112'), and performing a second thermal treatment on the metal stack. The first thermal treatment may be a rapid thermal annealing step, while the second thermal treatment may be a rapid thermal nitridation step. The resulting gate exhibits relatively low interface contact resistance between the silicon layer and the metal stack, and may thus be advantageously employed in high-speed devices.
Abstract:
A polarization resistant solar cell is provided. The solar cell uses a dual layer dielectric stack disposed on the front surface of the cell. The dielectric stack consists of a passivation layer disposed directly on the front cell surface and comprised of either SiOx or SiON, and an outer AR coating comprised of SiCN.
Abstract:
A simplified manufacturing process and the resultant bifacial solar cell (BSC) are provided, the simplified manufacturing process reducing manufacturing costs. The BSC includes a back surface contact grid (113) and an overlaid blanket metal reflector (117). A doped amorphous silicon layer is interposed between the contact grid and the blanket layer.