Abstract:
Procédé de traitement thermique avec enrichissement en élément VI d'un matériau (1 ) en couche mince, le procédé comprenant une ou plusieurs étapes d'enrichissement pendant lesquelles le matériau (1 ) est mis en contact avec un gaz réactif (5a) comprenant de l'élément VI à une pression partielle contrôlée, le procédé étant caractérisé en ce que, pour chaque étape d'enrichissement, le matériau (1 ) est placé dans un réacteur (3, 4, 5, 6, 7) où est injecté le gaz réactif de l'étape d'enrichissement, le gaz réactif étant obtenu en faisant barboter un gaz vecteur (16b) dans une charge (16a) comprenant de l'élément VI placée dans un conteneur (16) et en maintenant dans le conteneur des conditions de température et de pression choisies pour que le gaz réactif (5a) comprenne de l'élément VI dans une fraction massique prédéterminée (Xs) pour l'étape d'enrichissement.
Abstract:
A technique to form metallic nanodots in a two-step process involving: (1) reacting a silicon-containing gas precursor (101) (e.g., silane) to form silicon nuclei (117) over a dielectric film layer (103B); and (2) using a metal precursor to form metal nanodots where the metal nanodots use the silicon nuclei (117) from step (1) as nucleation points. Thus, the original silicon nuclei (117) are a core material for a later metallic encapsulation step. Metallic nanodots have applications in devices such as flash memory transistors.
Abstract:
A method of forming a device includes forming protective shells about metallic nanocrystals supported by a substrate. The metallic nanocrystals having protective shells are encapsulated with a layer formed with process parameters that are not compatible with the integrity of unprotected metallic nanocrystals. The nanocrystals can be out Ni, Pt, Ag, or W with a shell of SiO2.
Abstract:
A method of forming a device includes forming protective shells about metallic nanocrystals supported bya substrate. The metallic nanocrystals having protective shells are encapsulated with a layer formed with process parameters that are not compatible with the integrity of unprotected metallic nanocrystals.
Abstract:
A technique to form metallic nanodots in a two-step process involving: (1) reacting a silicon-containing gas precursor (101) (e.g., silane) to form silicon nuclei (117) over a dielectric film layer (103B); and (2) using a metal precursor to form metal nanodots where the metal nanodots use the silicon nuclei (117) from step (1) as nucleation points. Thus, the original silicon nuclei (117) are a core material for a later metallic encapsulation step. Metallic nanodots have applications in devices such as flash memory transistors.
Abstract:
A device and method include forming a mask on a substrate supporting a plurality of metallic nanocrystals such that a portion of the metallic nanocrystals is exposed. Protective shells are formed about the exposed metallic nanocrystals. Unprotected metallic nanocrystals are removed.