公开(公告)号：WO2004094702A3

公开(公告)日：2006-11-30

申请号：PCT/US2004012012

申请日：2004-04-16

Applicant: APPLIED MATERIALS INC ,  YANG MICHAEL X ,  XI MING ,  ELLWANGER RUSSELL C ,  BRITCHER ERIC B ,  DONOSO BERNARDO ,  PANG LILY L ,  SHERMAN SVETLANA ,  HO HENRY ,  NGUYEN ANH N ,  LERNER ALEXANDER N ,  D AMBRA ALLEN L ,  SHANMUGASUNDRAM ARULKUMAR ,  ISHIKAWA TETSUYA ,  RABINOVICH YEVGENIY ,  LUBOMIRSKY DMITRY ,  MOK YEUK-FAI EDWIN ,  NGUYEN SON T

Inventor： YANG MICHAEL X ,  XI MING ,  ELLWANGER RUSSELL C ,  BRITCHER ERIC B ,  DONOSO BERNARDO ,  PANG LILY L ,  SHERMAN SVETLANA ,  HO HENRY ,  NGUYEN ANH N ,  LERNER ALEXANDER N ,  D AMBRA ALLEN L ,  SHANMUGASUNDRAM ARULKUMAR ,  ISHIKAWA TETSUYA ,  RABINOVICH YEVGENIY ,  LUBOMIRSKY DMITRY ,  MOK YEUK-FAI EDWIN ,  NGUYEN SON T

IPC: C25D7/12 ,  B08B3/02 ,  C25D5/00 ,  C25D17/00 ,  C25D17/02 ,  C25D19/00 ,  C25D21/00 ,  C25D21/08 ,  H01L21/00 ,  H01L21/68 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01L21/67167 ,  B08B3/02 ,  C25D5/003 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/02 ,  C25D21/08 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/68 ,  H01L21/6838 ,  H01L21/68707

Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.

Abstract translation: 本发明的实施方案通常提供电化学电镀系统。 电镀系统包括位于与主机处理平台连通的基板装载站，位于主框架上的至少一个基板镀覆单元，位于主机上的至少一个基板斜面清洁单元，以及与 主机和加载站中的至少一个，层叠基板退火站中的每个室具有加热板，冷却板和基板传送机器人。

公开(公告)号：WO2004094702A8

公开(公告)日：2005-12-29

申请号：PCT/US2004012012

申请日：2004-04-16

Applicant: APPLIED MATERIALS INC ,  YANG MICHAEL X ,  XI MING ,  BRITCHER ERIC B ,  DONOSO BERNARDO ,  PANG LILY L ,  SHERMAN SVETLANA ,  HO HENRY ,  NGUYEN ANH N ,  LERNER ALEXANDER N ,  D AMBRA ALLEN L ,  SHANMUGASUNDRAM ARULKUMAR ,  ISHIKAWA TETSUYA ,  RABINOVICH YEVGENIY ,  LUBOMIRSKY DMITRY ,  MOK YEUK-FAI EDWIN ,  NGUYEN SON T

Inventor： YANG MICHAEL X ,  XI MING ,  ELLWANGER RUSSELL C ,  BRITCHER ERIC B ,  DONOSO BERNARDO ,  PANG LILY L ,  SHERMAN SVETLANA ,  HO HENRY ,  NGUYEN ANH N ,  LERNER ALEXANDER N ,  D AMBRA ALLEN L ,  SHANMUGASUNDRAM ARULKUMAR ,  ISHIKAWA TETSUYA ,  RABINOVICH YEVGENIY ,  LUBOMIRSKY DMITRY ,  MOK YEUK-FAI EDWIN ,  NGUYEN SON T

IPC: B08B3/02 ,  C25D5/00 ,  C25D7/12 ,  C25D17/00 ,  C25D21/00 ,  C25D21/08 ,  H01L21/00 ,  H01L21/68 ,  H01L21/683 ,  H01L21/687 ,  C25D

CPC classification number: H01L21/67167 ,  B08B3/02 ,  C25D5/003 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/02 ,  C25D21/08 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/68 ,  H01L21/6838 ,  H01L21/68707

Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.

Abstract translation: 本发明的实施方案通常提供电化学电镀系统。 所述电镀系统包括基板装载站，所述基板装载站定位成与主机处理平台连通，至少一个位于所述主机上的基板电镀单元，位于所述主机上的至少一个基板斜面清洁单元，以及与 主机和加载站中的至少一个，层叠基板退火站中的每个室具有加热板，冷却板和基板传送机器人。

公开(公告)号：WO2010068597A1

公开(公告)日：2010-06-17

申请号：PCT/US2009/067038

申请日：2009-12-07

Applicant: SOKUDO CO., LTD. ,  BRITCHER, Eric B. ,  RABINOVICH, Yevgeniy ,  SHERMAN, Svetlana ,  OTANI, Masami

Inventor： BRITCHER, Eric B. ,  RABINOVICH, Yevgeniy ,  SHERMAN, Svetlana ,  OTANI, Masami

IPC: H01L21/66 ,  B05C11/00

CPC classification number: H01L21/6719 ,  G03F7/162 ,  H01L21/67051 ,  H01L21/68771 ,  Y10T29/41

Abstract: An apparatus for dispensing fluid during semiconductor substrate processing operations comprises an enclosure having a first side and a second side. The enclosure comprises a first processing station and a second processing station. The second processing station is positioned adjacent to the first processing station. In addition, the substrate processing apparatus includes a first dispense arm configured to deliver a fluid to the first processing station wherein the first dispense arm is positioned between the first side and the first processing station and a second dispense arm configured to deliver the fluid to the second processing station wherein the second dispense arm is positioned between the second side and the second processing station. The substrate processing apparatus also comprises a first rinse arm configured to deliver a rinsing fluid to the first processing station and a second rinse arm configured to deliver the rinsing fluid to the second processing station.

Abstract translation: 在半导体衬底处理操作期间用于分配流体的设备包括具有第一侧和第二侧的外壳。 外壳包括第一处理站和第二处理站。 第二处理站位于第一处理站附近。 此外，基板处理装置包括：第一分配臂，被配置为将流体输送到第一处理站，其中第一分配臂位于第一侧和第一处理站之间，第二分配臂被配置为将流体输送到 第二处理站，其中第二分配臂位于第二侧和第二处理站之间。 衬底处理设备还包括构造成将冲洗流体输送到第一处理站的第一冲洗臂和被构造成将冲洗流体输送到第二处理站的第二冲洗臂。

公开(公告)号：WO2004094702A2

公开(公告)日：2004-11-04

申请号：PCT/US2004/012012

申请日：2004-04-16

Applicant: APPLIED MATERIALS, INC. ,  ELLWANGER, Russell, C. ,  YANG, Michael, X. ,  XI, Ming ,  BRITCHER, Eric, B. ,  DONOSO, Bernardo ,  PANG, Lily, L. ,  SHERMAN, Svetlana ,  HO, Henry ,  NGUYEN, Anh, N. ,  LERNER, Alexander, N. ,  D'AMBRA, Allen, L. ,  SHANMUGASUNDRAM, Arulkumar ,  ISHIKAWA, Tetsuya ,  RABINOVICH, Yevgeniy ,  LUBOMIRSKY, Dmitry ,  MOK, Yeuk-Fai, Edwin ,  NGUYEN, Son, T.

Inventor： YANG, Michael, X. ,  XI, Ming ,  BRITCHER, Eric, B. ,  DONOSO, Bernardo ,  PANG, Lily, L. ,  SHERMAN, Svetlana ,  HO, Henry ,  NGUYEN, Anh, N. ,  LERNER, Alexander, N. ,  D'AMBRA, Allen, L. ,  SHANMUGASUNDRAM, Arulkumar ,  ISHIKAWA, Tetsuya ,  RABINOVICH, Yevgeniy ,  LUBOMIRSKY, Dmitry ,  MOK, Yeuk-Fai, Edwin ,  NGUYEN, Son, T.

IPC: C25D

CPC classification number: H01L21/67167 ,  B08B3/02 ,  C25D5/003 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/02 ,  C25D21/08 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/68 ,  H01L21/6838 ,  H01L21/68707

Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.

Abstract translation: 本发明的实施方案通常提供电化学电镀系统。 电镀系统包括位于与主机处理平台连通的基板装载站，位于主机上的至少一个基板镀覆单元，位于主机上的至少一个基板斜面清洁单元，以及与 主机和加载站中的至少一个，层叠基板退火站中的每个室具有加热板，冷却板和基板传送机器人。