公开(公告)号：WO2003041133A2

公开(公告)日：2003-05-15

申请号：PCT/US2002/036009

申请日：2002-11-08

Applicant: CONVENTOR, INCORPORATED ,  CUNNINGHAM, Shawn,J.

Inventor： CUNNINGHAM, Shawn,J.

IPC: H01L21/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Electrothermal Self-Latching MEMS Switch and Method. According to one embodiment, a microscale switch having a movable microcomponent is provided and includes a substrate having a stationary contact. The switch can also include a structural layer having a movable contact positioned for contacting the stationary contact when the structural layer moves toward the substrate. An electrothermal latch attached to the structural layer and having electrical communication with the movable contact to provide current flow between the electrothermal latch and the stationary contact when the movable contact contacts the stationary contact for maintaining' the movable contact in contact with the stationary contact.

Abstract translation: 电热自锁式MEMS开关及方法。 根据一个实施例，提供具有可移动微组件的微型开关，并且包括具有固定触点的基板。 开关还可以包括具有可移动触点的结构层，该结构层定位成当结构层向基板移动时接触固定触点。 电动闩锁附接到结构层，并且当可动触头接触固定触点以保持“可动触头与固定触点接触”时，与可动触点电连通以提供电热闩和固定触点之间的电流。

公开(公告)号：WO2003043044A1

公开(公告)日：2003-05-22

申请号：PCT/US2002/035925

申请日：2002-11-08

Applicant: CONVENTOR, INCORPORATED ,  CUNNINGHAM, Shawn, J. ,  DEREUS, Dana, R. ,  SETT, Subham ,  TATIC-LUCIC, Svetlana

Inventor： CUNNINGHAM, Shawn, J. ,  DEREUS, Dana, R. ,  SETT, Subham ,  TATIC-LUCIC, Svetlana

IPC: H01H57/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A movable, trilayered microcomponent (108) suspended over a substrate (102) is provided and includes a first electrically conductive layer (116) patterned to define a movable electrode (114). The first metal layer (116) is separated from the substrate (102) by a gap. The microcomponent (108) further includes a dielectric layer formed (112) on the first metal layer (116) and having an end fixed with respect to the substrate (102). Furthermore, the microcomponent (102) includes a second electrically conductive layer (120) formed on the dielectric layer (112) and patterned to define an electrode interconnect (124) for electrically communicating with the movable electrode (114).

Abstract translation: 提供悬挂在衬底102上的可移动的三层微元件108，并且包括图案化以限定可移动电极114的第一导电层116.第一金属层116与衬底102间隔开。 微组件108还包括在第一金属层116上形成的112并且具有相对于衬底102固定的端部的电介质层。此外，微组件102包括形成在电介质层112上的第二导电层120，并被图案化以限定 用于与可动电极114电连通的电极互连124。

公开(公告)号：WO2002097767A2

公开(公告)日：2002-12-05

申请号：PCT/US2002/000679

申请日：2002-01-08

Applicant: CONVENTOR, INCORPORATED ,  DEREUS, Dana, R. ,  CUNNINGHAM, Shawn, J. ,  MORRIS, Arthur, S., III

Inventor： DEREUS, Dana, R. ,  CUNNINGHAM, Shawn, J. ,  MORRIS, Arthur, S., III

IPC: G09C

CPC classification number: G02B26/0866 ,  B81B2201/038 ,  B81B2201/047 ,  B81C3/002 ,  B81C3/008 ,  G02B6/353 ,  G02B6/3552 ,  G02B6/356 ,  G02B6/3582 ,  G02B6/3584 ,  G02B26/0841 ,  G02B26/085 ,  G02B26/0858

Abstract: Fabrication Integration of Micro-Components. A method for manufacturing a first and second micro-component on a surface of a substrate, including fabricating a first and second constraint structure. The first and second constraint structures are subtantially formed to fit a surface of the first and second micro-component, respectively, for positioning the first and second micro-components with respect to each other. The method includes fabricating the first and second micro-components in separate processes. The first and second micro-components have a surface substantially formed to fit the first and second constraint structures, respectively.

Abstract translation: 微元件的制造集成。 一种在基板的表面上制造第一和第二微型部件的方法，包括制造第一和第二约束结构。 第一和第二约束结构被分别形成以分别适合第一和第二微分量的表面，用于相对于彼此定位第一和第二微分量。 该方法包括在单独的工艺中制造第一和第二微组件。 第一和第二微元件分别具有基本上形成为适合第一和第二约束结构的表面。