Abstract:
Apparatuses and method are described to create a reduced stiffness microstructure (RSM). A RSM is made by forming a first buckled membrane along a first buckling direction and forming a second buckled membrane along a second buckling direction. The second buckling direction is opposite to the first buckling direction and the first buckled membrane is in contact with the second buckled membrane over a contact area. Within an operating zone, a stiffness of the reduced stiffness microstructure spring is less than an absolute value of a stiffness of either the first buckled membrane or the second buckled membrane when the contact area translates along either one of the buckling directions. In the operating zone the stiffness can approach or equal zero.
Abstract:
Dispositif de type microsystème électromécanique (MEMS) ô film mince piézoélectrique 18 comportant un commutateur RF-MEMS 14 et un résonateur RF ô film mince piézoélectrique 10 ô ondes acoustiques de volume monté sur un substrat 12 pourvu d'un miroir acoustique 28. le résonateur comporte une portion 16 du film mince disposée entre les deux électrodes métalliques 20 et 24. Le commutateur 14 comporte une poutre bi-couche présentant une couche d'isolant 38 associée ô une autre portion 36 du film piézoélectrique 18 et portant un contact métalliques mobile 50 destiné ô venir en appui sur des contacts métalliques fixes 46, 48 par déformation de la poutre sous l'action d'une tension sur les électrodes de commande 40, 42.
Abstract:
A micro-scale interconnect device with internal heat spreader and method for fabricating same. The device includes first and second arrays of generally coplanar electrical communication lines. The first array is disposed generally along a first plane, and the second array is disposed generally along a second plane spaced from the first plane. The arrays are electrically isolated from each other. Embedded within the interconnect device is a heat spreader element. The heat spreader element comprises a dielectric material disposed in thermal contact with at least one of the arrays and a layer of thermally conductive material embedded in the dielectric material. The device is fabricated by forming layers of electrically conductive, dielectric, and thermally conductive materials on a substrate. The layers are arranged to enable heat energy given off by current-carrying communciation lines to be transferred away from the communciation lines.
Abstract:
Electrothermal Self-Latching MEMS Switch and Method. According to one embodiment, a microscale switch (100) having a movable microcomponent (108) is provided and includes a substrate (102) having a stationary contact (104). The switch (100) can also include a structural layer (112) having a movable contact (108) positioned for contacting the stationary contact (104) when the structural layer (112) moves toward the substrate (102). Electrothermal latch (126) attached to the structural layer (112) and having electrical communication (114, 116) with the movable contact (108) to provide current flow between the electrothermal latch (126) and the stationary contact (104) when the movable contact (108) contacts the stationary contact (104) for maintaining the movable contact (108) in contact with the stationary contact (104).
Abstract:
Microelectromechanical structures (MEMS) are provided that are adapted to controllably move mirrors in response to selective thermal actuation. In one embodiment, the MEMS moveable mirror structure includes a thermally actuated microactuator adapted to controllably move along a predetermined path substantially parallel to the first major surface of an underlying microelectronic substrate. A mirror (20) is adapted to move accordingly with the microactuator (30) between a non-actuated and an actuated position. In all positions, the mirror has a mirrored surface disposed out of plane relative to the first major surface of the microelectronic substrate. The microactuator provided herein can include various thermal arched beam actuators (35), thermally actuated composite beam actuators, arrayed actuators, and combinations thereof. The MEMS moveable mirror structure can also include a mechanical latch (70) and/or an electrostatic latch for controllably clamping the mirror in position. A MEMS moveable mirror array is also provided which permits individualized control of each individual MEMS moveable mirror structure within the array.
Abstract:
A contactor (5) includes a contact portion (501-504) and an actuation portion (505-508). The contactor further includes a keeping portion. The keeping portion includes a capacitor structure and uses an electrostatic force between opposite plates (509,510) of the capacitor structure to keep the contact portion in a contact state or a disconnection state. The electrostatic force generated by an electrostatic latch is used to keep the contactor in a switched-to static state. The contactor has reduced energy consumption in the static state, is convenient to manufacture, and has a low cost.
Abstract:
A thermal microactuator is provided that can be deflected in multiple positions. The actuator has a hot arm and a cold arm coupled together at their distal ends suspended above a reference plane of a substrate. A potential difference is applied across the hot arm so that a current circulates through the hot arm but not the cold arm.
Abstract:
Resistor Networks, digital potentiometers and microelectromechanical structures that include a plurality of resistors selectable by a plurality of microelectromechanical acquators are provided. More particularly, a thermal relay type of actuator is provided as a switch which may selectively control which of the plurality of resistors is connected. In one particularly advantageous embodiment, the heater for the thermal relay and the plurality of resistors are formed from a common layer of the integrated circuit structure, such as a doped polysilicon layer, which may simplify the manufacturing process. Preferably, a thermal arched beam acuator is utilized in combination with film resistors to provide an integrated circuit device suitable for applicaitons such as digital potentiometers.
Abstract:
The invention refers to a micromechanical switching device including at least two contact elements (11, 12, 31, 32), which are provided at least partly movable relative each other and via thermal actuation can be closed and opened, whereby the contact elements (11, 12, 31, 32) at least partly are comprised of at least two materials (14, 15, 16, 17, 34-37) with essentially different thermal expansion coefficients. The contact elements (11, 12, 31, 32) at excitation are arranged to displace essentially in same level and in different directions.
Abstract:
A cantilever microstructure includes a cantilever arm with a proximal end connected to a substrate and a freely movable distal end. The cantilever arm comprises first and second sections and includes a continuous layer which exhibits a first thermal co-efficient of expansion (TCE). In one embodiment, an electrical contact is positioned at the distal end of the cantilever arm. A first layer is positioned on a surface of the continuous layer and along the first section thereof. The first layer exhibits a second TCE which is different from the first TCE of the continuous layer. A second layer is positioned on a surface of the continuous layer and along the second section thereof. The second layer exhibits a third TCE which is different from the first TCE of the continuous layer. Electrical control circuitry selectively applies signals to the first and second layers to cause a heating thereof and a flexure of the cantilever arm so as to bring the distal end thereof into contact with a conductive substrate.