公开(公告)号：WO03040338A3

公开(公告)日：2003-10-02

申请号：PCT/US0235988

申请日：2002-11-08

Applicant: COVENTOR INC ,  TURNSTONE SYSTEMS INC ,  SETT SUBHAM ,  CUNNINGHAM SHAWN J

Inventor： SETT SUBHAM ,  CUNNINGHAM SHAWN J

IPC: B81B3/00 ,  B81B7/00 ,  H01H1/04 ,  H01H1/50 ,  H01H59/00 ,  H01H61/04 ,  H01L21/302 ,  H01L23/373 ,  H01L23/522 ,  H01L27/12 ,  H01L29/86 ,  H02N1/00 ,  H02N10/00 ,  H01L21/46

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A micro-scale interconnect device with internal heat spreader and method for fabricating same. The device includes first and second arrays of generally coplanar electrical communication lines. The first array is disposed generally along a first plane, and the second array is disposed generally along a second plane spaced from the first plane. The arrays are electrically isolated from each other. Embedded within the interconnect device is a heat spreader element. The heat spreader element comprises a dielectric material disposed in thermal contact with at least one of the arrays and a layer of thermally conductive material embedded in the dielectric material. The device is fabricated by forming layers of electrically conductive, dielectric, and thermally conductive materials on a substrate. The layers are arranged to enable heat energy given off by current-carrying communciation lines to be transferred away from the communciation lines.

Abstract translation: 一种具有内部散热器的微型互连装置及其制造方法。 该装置包括大致共面的电通信线路的第一和第二阵列。 第一阵列大致沿着第一平面布置，并且第二阵列大体沿着与第一平面间隔开的第二平面布置。 阵列彼此电隔离。 嵌入在互连装置内的是散热器元件。 散热器元件包括设置成与至少一个阵列热接触的介电材料和嵌入介电材料中的导热材料层。 该器件通过在衬底上形成导电，电介质和导热材料层来制造。 这些层被布置成使得由载流通信线发出的热能能够从通信线路传递出去。

公开(公告)号：WO2003040338A2

公开(公告)日：2003-05-15

申请号：PCT/US2002/035988

申请日：2002-11-08

Applicant: COVENTOR, INCORPORATED ,  SETT, Subham ,  CUNNINGHAM, Shawn, J.

Inventor： SETT, Subham ,  CUNNINGHAM, Shawn, J.

IPC: C12N

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A micro-scale interconnect device with internal heat spreader and method for fabricating same. The device includes first and second arrays of generally coplanar electrical communication lines. The first array is disposed generally along a first plane, and the second array is disposed generally along a second plane spaced from the first plane. The arrays are electrically isolated from each other. Embedded within the interconnect device is a heat spreader element. The heat spreader element comprises a dielectric material disposed in thermal contact with at least one of the arrays and a layer of thermally conductive material embedded in the dielectric material. The device is fabricated by forming layers of electrically conductive, dielectric, and thermally conductive materials on a substrate. The layers are arranged to enable heat energy given off by current-carrying communciation lines to be transferred away from the communciation lines.

Abstract translation: 具有内部散热器的微尺寸互连装置及其制造方法。 该装置包括大致共面电通信线路的第一和第二阵列。 第一阵列大致沿着第一平面布置，并且第二阵列通常沿着与第一平面间隔开的第二平面设置。 阵列彼此电隔离。 嵌入在互连装置内的是散热器元件。 散热器元件包括设置成与阵列中的至少一个热交换的介电材料和嵌入电介质材料中的导热材料层。 该器件通过在衬底上形成导电的，介电的和导热的材料层来制造。 这些层被布置成使得由载流通信线发出的热能被转移离开通信线。

公开(公告)号：WO2003043044A1

公开(公告)日：2003-05-22

申请号：PCT/US2002/035925

申请日：2002-11-08

Applicant: CONVENTOR, INCORPORATED ,  CUNNINGHAM, Shawn, J. ,  DEREUS, Dana, R. ,  SETT, Subham ,  TATIC-LUCIC, Svetlana

Inventor： CUNNINGHAM, Shawn, J. ,  DEREUS, Dana, R. ,  SETT, Subham ,  TATIC-LUCIC, Svetlana

IPC: H01H57/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A movable, trilayered microcomponent (108) suspended over a substrate (102) is provided and includes a first electrically conductive layer (116) patterned to define a movable electrode (114). The first metal layer (116) is separated from the substrate (102) by a gap. The microcomponent (108) further includes a dielectric layer formed (112) on the first metal layer (116) and having an end fixed with respect to the substrate (102). Furthermore, the microcomponent (102) includes a second electrically conductive layer (120) formed on the dielectric layer (112) and patterned to define an electrode interconnect (124) for electrically communicating with the movable electrode (114).

Abstract translation: 提供悬挂在衬底102上的可移动的三层微元件108，并且包括图案化以限定可移动电极114的第一导电层116.第一金属层116与衬底102间隔开。 微组件108还包括在第一金属层116上形成的112并且具有相对于衬底102固定的端部的电介质层。此外，微组件102包括形成在电介质层112上的第二导电层120，并被图案化以限定 用于与可动电极114电连通的电极互连124。

公开(公告)号：WO2003043042A1

公开(公告)日：2003-05-22

申请号：PCT/US2002/035923

申请日：2002-11-08

Applicant: COVENTOR, INCORPORATED ,  CUNNINGHAM, Shawn, J. ,  DEREUS, Dana, R. ,  SETT, Subham ,  GILBERT, John, R.

Inventor： CUNNINGHAM, Shawn, J. ,  DEREUS, Dana, R. ,  SETT, Subham ,  GILBERT, John, R.

IPC: H01H37/52

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: MEMS device (100) having an electrothermal actuator (126) and release and a method for fabrication. According to one embodiment, a microscale switch (100) is provided and can include a substrate (102) and a stationary electrode (106) and stationary contact (104) formed on the substrate (102). The switch (100) can further include a movable microcomponent (108) suspended above the substrate (102). The microcomponent (108) can include a structural layer (112) including at least one end fixed with respect to the substrate (102). The microcomponent (108) can further include a movable electrode (118) spaced from the stationary electrode (106). The microcomponent (108) can include an electrothermal component (126) attached to the structural layer (112) and operable to produce heating for generating force for moving the structural layer (112).

Abstract translation: 具有电热致动器126和释放的MEMS装置100和制造方法。 根据一个实施例，提供微型开关100，并且可以包括衬底102和形成在衬底102上的固定电极106和固定触点104.开关100还可以包括悬浮在衬底102上方的可移动的微元件108.微组件 108可以包括包括相对于衬底102固定的至少一个端部的结构层112.微组件108还可以包括与固定电极106间隔开的可移动电极118.微组件108可以包括附接到结构的电热部件126 层112并且可操作以产生用于产生用于移动结构层112的力的加热。