公开(公告)号：WO2008140508A1

公开(公告)日：2008-11-20

申请号：PCT/US2007/026289

申请日：2007-12-20

Applicant: LV SENSORS, INC. ,  RAY, Curtis, A. ,  MALAGA, Michael

Inventor： RAY, Curtis, A. ,  MALAGA, Michael

IPC: B60C23/02

CPC classification number: B60C23/0408 ,  B60C23/0494 ,  Y10T137/0491 ,  Y10T137/3662

Abstract: Tire sensor packaging capable of being installed on a standard snap-in tire valve stem is provided. The sensor package includes an attachment member capable of being disposed in the flexible bore of a snap-in tire valve stem, and of securely engaging with the inner wall of the flexible bore. The attachment member can be an integral part of the sensor package, or it can be a separate part that acts as an expansion device when engaged with the sensor package. Preferably, the attachment member includes features, such as barbs, to provide more secure engagement with the tire valve stem. Packages according to embodiments of the invention include a package passage to permit the flow of air past the sensor, so that the tire can be inflated or deflated. Sensors can be attached to the tire valve stem before or after the tire valve stem is installed in the wheel.

Abstract translation: 提供能够安装在标准卡入式轮胎阀杆上的轮胎传感器包装。 传感器组件包括能够设置在卡入轮胎气门杆的柔性孔中并且与柔性孔的内壁牢固接合的附接构件。 附接构件可以是传感器组件的整体部分，或者可以是与传感器组件接合时用作膨胀装置的单独部件。 优选地，附接构件包括诸如倒钩的特征，以提供与轮胎气门杆更牢固的接合。 根据本发明的实施例的包装包括允许空气流过传感器的包装通道，使得轮胎可以膨胀或放气。 在轮胎阀杆安装在车轮之前或之后，传感器可以连接到轮胎阀杆上。

公开(公告)号：WO2007149492A3

公开(公告)日：2008-05-15

申请号：PCT/US2007014390

申请日：2007-06-19

Applicant: LV SENSORS INC ,  LOGAN ELIZABETH A ,  RAY CURTIS A

Inventor： LOGAN ELIZABETH A ,  RAY CURTIS A

IPC: H01L23/31

CPC classification number: G01L19/148 ,  B81C1/0023 ,  G01L19/141 ,  H01L23/3107 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/1815 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Improved sensor packaging is provided with a hybrid integration approach. In one example, an application specific integrated circuit (ASIC) for sensor signal conditioning is packaged. The ASIC package has an aperture in it that exposes a chip to chip bonding interface of the ASIC chip. The rest of the ASIC chip is surrounded by the package, including the connections between the external package leads and the ASIC chip. A sensor^ chip, also having a chip to chip bonding interface, is disposed in the package aperture and bonded to the ASIC chip. such that the two chip to chip bonding interfaces are connected. Flip chip bonding of the sensor chip to the ASIC chip is a preferred approach for chip to chip bonding. The vertical gap between the two chips can be filled in by an underfill process. The lateral gap between the sensor chip and the package can also be filled.

Abstract translation: 改进的传感器封装提供了混合集成方法。 在一个示例中，封装了用于传感器信号调理的专用集成电路（ASIC）。 ASIC封装在其中具有露出ASIC芯片的芯片到芯片接合界面的孔径。 ASIC芯片的其余部分被封装包围，包括外部封装引线和ASIC芯片之间的连接。 也具有芯片到芯片接合界面的传感器芯片被布置在封装孔中并结合到ASIC芯片。 使得两个芯片到芯片接合界面被连接。 将传感器芯片的倒装芯片接合到ASIC芯片是芯片到芯片接合的优选方法。 两个芯片之间的垂直间隙可以通过底部填充处理来填充。 传感器芯片和封装之间的横向间隙也可以被填充。

公开(公告)号：WO2007149492A2

公开(公告)日：2007-12-27

申请号：PCT/US2007/014390

申请日：2007-06-19

Applicant: LV SENSORS, INC ,  LOGAN, Elizabeth, A. ,  RAY, Curtis, A.

Inventor： LOGAN, Elizabeth, A. ,  RAY, Curtis, A.

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: G01L19/148 ,  B81C1/0023 ,  G01L19/141 ,  H01L23/3107 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/1815 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Improved sensor packaging is provided with a hybrid integration approach. In one example, an application specific integrated circuit (ASIC) for sensor signal conditioning is packaged. The ASIC package has an aperture in it that exposes a chip to chip bonding interface of the ASIC chip. The rest of the ASIC chip is surrounded by the package, including the connections between the external package leads and the ASIC chip. A sensor^ chip, also having a chip to chip bonding interface, is disposed in the package aperture and bonded to the ASIC chip. such that the two chip to chip bonding interfaces are connected. Flip chip bonding of the sensor chip to the ASIC chip is a preferred approach for chip to chip bonding. The vertical gap between the two chips can be filled in by an underfill process. The lateral gap between the sensor chip and the package can also be filled.

Abstract translation: 改进的传感器封装提供了混合集成方法。 在一个示例中，封装了用于传感器信号调理的专用集成电路（ASIC）。 ASIC封装在其中具有露出ASIC芯片的芯片到芯片接合界面的孔径。 ASIC芯片的其余部分被封装包围，包括外部封装引线和ASIC芯片之间的连接。 也具有芯片到芯片接合界面的传感器芯片被布置在封装孔中并结合到ASIC芯片。 使得两个芯片到芯片接合界面被连接。 将传感器芯片的倒装芯片接合到ASIC芯片是芯片到芯片接合的优选方法。 两个芯片之间的垂直间隙可以通过底部填充处理来填充。 传感器芯片和封装之间的横向间隙也可以被填充。

公开(公告)号：WO2008008403A2

公开(公告)日：2008-01-17

申请号：PCT/US2007015834

申请日：2007-07-10

Applicant: LV SENSORS INC ,  SKURNIK DAVID

Inventor： SKURNIK DAVID

IPC: B60C23/02

CPC classification number: B60C23/0408 ,  G01L9/12

Abstract: A tire pressure monitoring system is provided that includes a switched capacitor circuit having a clock with two non-overlapping clock phases that control a state of analog switches of the switched capacitor circuit. The system uses tire pressure sensor MEMS capacitors that are measured differentially. A capacitance-to-voltage converter is connected to the MEMS sense capacitor, and a sigma-delta converter having a comparator with a first digital output state and a second digital output state is used. The first output state is a sum of reference voltages and the second output state is a difference of the reference voltages. An average value of the capacitance-to-voltage converter output is driven to a zero value and a digital output is provided of the average output states that is equal to a difference between the MEMS capacitors divided by their sum multiplied by a ratio of the reference voltages.

Abstract translation: 提供了一种轮胎压力监测系统，其包括开关电容器电路，该开关电容器电路具有控制开关电容器电路的模拟开关的状态的具有两个非重叠时钟相位的时钟。 该系统使用差动测量的胎压传感器MEMS电容器。 电容到电压转换器连接到MEMS感测电容器，并且使用具有第一数字输出状态和第二数字输出状态的比较器的西格玛 - 德尔塔转换器。 第一输出状态是参考电压的总和，第二输出状态是参考电压的差。 将电容 - 电压转换器输出的平均值驱动为零值，并且提供平均输出状态的数字输出，其等于MEMS电容器之间的差异除以它们的总和乘以参考比率 电压。

公开(公告)号：WO2008005113A2

公开(公告)日：2008-01-10

申请号：PCT/US2007/011927

申请日：2007-05-16

Applicant: LV SENSORS, INC. ,  ROUNDY, Shadrach, J. ,  TOLA, Jeffry ,  TOLA, Jeffrey, F.

Inventor： ROUNDY, Shadrach, J. ,  TOLA, Jeffry ,  TOLA, Jeffrey, F.

IPC: G06F19/00

CPC classification number: H01L41/1136 ,  H02N2/186

Abstract: The present invention provides an inertial energy scavenger that includes at least one piezoelectric element held by a housing, a proof mass that is movable within the housing in a direction parallel to the piezoelectric element, and a mechanical assembly disposed between the proof mass and the piezoelectric element. The mechanical assembly transfers work from the proof mass to the piezoelectric element, where the work from the proof mass is a first force along a first distance and the work to the piezoelectric element is a second force along a second distance. The first distance is greater than the second distance and the first force is smaller than the second force. Force amplification is determined by the geometry of the mechanical transfer assembly and can range anywhere from just above 1 to at least 10, where some embodiments include a bi-lever configuration, a tube-shaped configuration and a reverse actuation configuration.

Abstract translation: 本发明提供了一种惯性能量清除剂，其包括由壳体保持的至少一个压电元件，在壳体内沿平行于压电元件的方向可移动的检测质量块，以及设置在检测质量块和压电元件之间的机械组件 元件。 机械组件将工件从检验质量传递到压电元件，其中来自检验质量块的工件是沿着第一距离的第一力，并且工件到压电元件是第二距离的第二力。 第一距离大于第二距离，第一力小于第二力。 力放大由机械传递组件的几何形状确定，并且范围可以在刚刚高于1至至少10的范围内，其中一些实施例包括双杠杆配置，管状构型和反向致动构造。

公开(公告)号：WO2007064961A2

公开(公告)日：2007-06-07

申请号：PCT/US2006/046132

申请日：2006-11-30

Applicant: LV SENSORS, INC. ,  BRYZEK, Janusz ,  RAY, Curtis, A. ,  BIRCUMSHAW, Brian, L. ,  LOGAN, Elizabeth, A.

Inventor： BRYZEK, Janusz ,  RAY, Curtis, A. ,  BIRCUMSHAW, Brian, L. ,  LOGAN, Elizabeth, A.

IPC: B60C23/02

CPC classification number: B60C23/0408 ,  B81B3/0086 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2207/015 ,  B81C2203/0118

Abstract: The present invention provides a tire pressure sensor system that has multiple functions and is integrated into a small package. The system includes one or more Micro Electro Mechanical System (MEMS)-based sensors, including a MEMS-based pressure sensor; a MEMS-oscillator-based wireless signal transmitter; and a microcontroller, where the microcontroller processes the data generated by at least one of the MEMS-based sensors, controls at least one of the MEMS-based sensors, and controls the encoding and timing of transmission of data from the wireless signal transmitter. Preferably, the MEMS-based sensors, MEMS-oscillator-based wireless signal transmitter, and microcontroller are integrated onto one or more chips in one or more packages. The system also preferably includes a MEMS-based motion sensor, a low frequency (LF) receiver, an IC-based voltage sensor, a voltage regulator, a temperature sensor and a polarization voltage generator. Thus, the disclosed tire pressure sensor system is high in functionality, yet small in size.

Abstract translation: 本发明提供一种轮胎压力传感器系统，其具有多种功能并被集成到小包装中。 该系统包括一个或多个基于微机电系统（MEMS）的传感器，包括基于MEMS的压力传感器; 基于MEMS振荡器的无线信号发射机; 以及微控制器，其中微处理器由至少一个基于MEMS的传感器产生的数据控制至少一个基于MEMS的传感器，并且控制来自无线信号发射器的数据传输的编码和定时。 优选地，基于MEMS的传感器，基于MEMS振荡器的无线信号发射器和微控制器集成到一个或多个封装中的一个或多个芯片上。 该系统还优选地包括基于MEMS的运动传感器，低频（LF）接收器，基于IC的电压传感器，电压调节器，温度传感器和极化电压发生器。 因此，所公开的轮胎压力传感器系统的功能性高，但体积小。

公开(公告)号：WO2007044443A2

公开(公告)日：2007-04-19

申请号：PCT/US2006038924

申请日：2006-10-03

Applicant: LV SENSORS INC ,  ROUNDY SHAD ,  BRYZEK JANUSZ ,  RAY CURTIS A ,  MALAGA MICHAEL ,  BROWN DAVID L

Inventor： ROUNDY SHAD ,  BRYZEK JANUSZ ,  RAY CURTIS A ,  MALAGA MICHAEL ,  BROWN DAVID L

IPC: G01M17/02

CPC classification number: B60C23/0411

Abstract: A method of powering one or more electronic devices in a tire monitoring system using a tire pressure based energy scavenger is provided. With this method, a tire is rotated on a surface to generate pressure changes within the tire. These pressure changes are then converted into electrical energy with a transducer and the energy is stored. The electrical energy or stored electrical energy can then be used to power one or more electronic devices in a tire monitoring system, such as a tire pressure sensor, temperature sensor, acceleration profile sensor, and/or a tire wear monitor. A tire monitoring system with a tire pressure based energy scavenger is also provided.

Abstract translation: 提供一种使用轮胎压力能量清除剂在轮胎监测系统中为一个或多个电子设备供电的方法。 利用该方法，轮胎在表面上旋转以在轮胎内产生压力变化。 然后，这些压力变化用换能器转换成电能并储存能量。 然后可以使用电能或存储的电能为轮胎监测系统（例如轮胎压力传感器，温度传感器，加速度曲线传感器和/或轮胎磨损监测器）中的一个或多个电子设备供电。 还提供了一种具有基于轮胎压力的能量清除剂的轮胎监测系统。

公开(公告)号：WO2007120576A3

公开(公告)日：2008-10-30

申请号：PCT/US2007008599

申请日：2007-04-04

Applicant: LV SENSORS INC ,  RAY CURTIS A ,  BRYZEK JANUSZ

Inventor： RAY CURTIS A ,  BRYZEK JANUSZ

IPC: H01G5/00

CPC classification number: G01L9/0073 ,  B81B3/0021 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0831 ,  G01P2015/084 ,  H01L28/40

Abstract: The devices presented herein are capacitive sensors with single crysta silicon on all key stress points. Isolating trenches are formed by trench and refill forning dielectrically isolated conductive silicon electrodes for drive, sense and guards, For pressure sensing devices according to the invention, the pressure port is opposed to the e ectrical wire bond pads for ease of packaging. Dual-axis accelerometers measuring in plane acceleration and out of plane acceleration are also described. A third axis in plane is i easy to achieve by duplicating and rotating the accelerometer 90 degrees about its out of plane axis Creating resonant structures, angular rate sensors, bolometers, and many other structures are possible with this process technology. Key advantages are hermeti ity, vertical vias, vertical and horizontal gap capability, single crystal materials, wafejr level packaging, small size, high performance and low cost.

Abstract translation: 本文中提出的器件是在所有关键应力点上具有单晶硅的电容式传感器。 隔离沟槽由沟槽和再填充形成，用于驱动，感测和保护的介电隔离的导电硅电极。对于根据本发明的压力感测装置，压力端口与电极引线接合焊盘相对以便于包装。 还描述了在平面加速度和平面外加速度测量的双轴加速度计。 通过将加速度计90度绕其平面轴重复和旋转，可以容易地实现平面中的第三轴。通过该工艺技术，创建共振结构，角速率传感器，测辐射热计和许多其他结构是可能的。 主要优点是感性，垂直通孔，垂直和水平间隙能力，单晶材料，水平包装，体积小，性能高，成本低。

公开(公告)号：WO2007120576A2

公开(公告)日：2007-10-25

申请号：PCT/US2007/008599

申请日：2007-04-04

Applicant: LV SENSORS, INC ,  RAY, Curtis, A. ,  BRYZEK, Janusz

Inventor： RAY, Curtis, A. ,  BRYZEK, Janusz

IPC: B60C23/00

CPC classification number: G01L9/0073 ,  B81B3/0021 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0831 ,  G01P2015/084 ,  H01L28/40

Abstract: The devices presented herein are capacitive sensors with single crysta silicon on all key stress points. Isolating trenches are formed by trench and refill forning dielectrically isolated conductive silicon electrodes for drive, sense and guards, For pressure sensing devices according to the invention, the pressure port is opposed to the e ectrical wire bond pads for ease of packaging. Dual-axis accelerometers measuring in plane acceleration and out of plane acceleration are also described. A third axis in plane is i easy to achieve by duplicating and rotating the accelerometer 90 degrees about its out of plane axis Creating resonant structures, angular rate sensors, bolometers, and many other structures are possible with this process technology. Key advantages are hermeti ity, vertical vias, vertical and horizontal gap capability, single crystal materials, wafejr level packaging, small size, high performance and low cost.

Abstract translation: 本文中提出的器件是在所有关键应力点上具有单晶硅的电容式传感器。 隔离沟槽由沟槽形成，并且用于用于驱动，感测和保护的介电隔离的导电硅电极。对于根据本发明的压力感测装置，压力端口与电极引线接合焊盘相对以便于包装。 还描述了在平面加速度和平面外加速度测量的双轴加速度计。 平面上的第三轴是通过使加速度传感器围绕其平面外轴线90度重复和旋转来实现的。通过该工艺技术，可以创建谐振结构，角速率传感器，测辐射热计和许多其他结构。 主要优点是感性，垂直通孔，垂直和水平间隙能力，单晶材料，水平包装，体积小，性能高，成本低。

公开(公告)号：WO2007064961A3

公开(公告)日：2009-04-30

申请号：PCT/US2006046132

申请日：2006-11-30

Applicant: LV SENSORS INC ,  BRYZEK JANUSZ ,  RAY CURTIS A ,  BIRCUMSHAW BRIAN L ,  LOGAN ELIZABETH A

Inventor： BRYZEK JANUSZ ,  RAY CURTIS A ,  BIRCUMSHAW BRIAN L ,  LOGAN ELIZABETH A

IPC: G01M17/02 ,  B60C23/02

CPC classification number: B60C23/0408 ,  B81B3/0086 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2207/015 ,  B81C2203/0118

Abstract: The present invention provides a tire pressure sensor system that has multiple functions and is integrated into a small package. The system includes one or more Micro Electro Mechanical System (MEMS)-based sensors, including a MEMS-based pressure sensor; a MEMS-oscillator-based wireless signal transmitter; and a microcontroller, where the microcontroller processes the data generated by at least one of the MEMS-based sensors, controls at least one of the MEMS-based sensors, and controls the encoding and timing of transmission of data from the wireless signal transmitter. Preferably, the MEMS-based sensors, MEMS-oscillator-based wireless signal transmitter, and microcontroller are integrated onto one or more chips in one or more packages. The system also preferably includes a MEMS-based motion sensor, a low frequency (LF) receiver, an IC-based voltage sensor, a voltage regulator, a temperature sensor and a polarization voltage generator. Thus, the disclosed tire pressure sensor system is high in functionality, yet small in size.

Abstract translation: 本发明提供一种轮胎压力传感器系统，其具有多种功能并被集成到小包装中。 该系统包括一个或多个基于微机电系统（MEMS）的传感器，包括基于MEMS的压力传感器; 基于MEMS振荡器的无线信号发射机; 以及微控制器，其中微处理器由至少一个基于MEMS的传感器产生的数据控制至少一个基于MEMS的传感器，并且控制来自无线信号发射器的数据传输的编码和定时。 优选地，基于MEMS的传感器，基于MEMS振荡器的无线信号发射器和微控制器集成到一个或多个封装中的一个或多个芯片上。 该系统还优选地包括基于MEMS的运动传感器，低频（LF）接收器，基于IC的电压传感器，电压调节器，温度传感器和极化电压发生器。 因此，所公开的轮胎压力传感器系统的功能性高，但体积小。