公开(公告)号：WO2008130541A2

公开(公告)日：2008-10-30

申请号：PCT/US2008/004849

申请日：2008-04-15

Applicant: CREE, INC. ,  LOH, Ban P. ,  CANNON, Nathaniel O. ,  HILLER, Norbert ,  EDMOND, John ,  JACKSON, Mitch ,  MENDENDORP, JR., Nicholas W.

Inventor： LOH, Ban P. ,  CANNON, Nathaniel O. ,  HILLER, Norbert ,  EDMOND, John ,  JACKSON, Mitch ,  MENDENDORP, JR., Nicholas W.

IPC: H01L33/00

CPC classification number: H01L33/52 ,  H01L24/97 ,  H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.

Abstract translation: 用于发光器件封装的子基座包括矩形基板。 第一接合焊盘和第二接合焊盘位于基板的第一表面上。 第一接合焊盘包括朝向衬底的第一端偏移并且被配置为在其上接收发光二极管的管芯附接区域。 第二接合焊盘包括第一接合焊盘和基板的第二端之间的接合区域和第二接合焊盘延伸部，该第二接合焊盘延伸部沿着基板的一侧从接合区域朝向基板的第一端处的角部延伸 基质。 第一和第二焊盘是基板的第二表面。 第一焊盘邻近衬底的第一端并接触第二焊盘。 第二焊盘邻近衬底的第二端并接触第一接合焊盘。 公开了相关的LED封装和形成LED封装的方法。

公开(公告)号：WO2008130541A3

公开(公告)日：2008-12-18

申请号：PCT/US2008004849

申请日：2008-04-15

Applicant: CREE INC ,  LOH BAN P ,  CANNON NATHANIEL O ,  HILLER NORBERT ,  EDMOND JOHN ,  JACKSON MITCH ,  MENDENDORP JR NICHOLAS W

Inventor： LOH BAN P ,  CANNON NATHANIEL O ,  HILLER NORBERT ,  EDMOND JOHN ,  JACKSON MITCH ,  MENDENDORP NICHOLAS W

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L33/52 ,  H01L24/97 ,  H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.

Abstract translation: 用于发光器件封装的基座包括矩形基板。 第一接合焊盘和第二接合焊盘位于衬底的第一表面上。 第一接合焊盘包括朝向衬底的第一端偏移并且被配置为在其上接收发光二极管的管芯附着区域。 第二接合焊盘包括在第一接合焊盘和基板的第二端之间的接合区域以及第二接合焊盘延伸部，其在接合区域沿着基板的侧面朝向基板的角部在第一端部处延伸 基质。 第一和第二焊盘是基板的第二表面。 第一焊盘与衬底的第一端相邻并接触第二焊盘。 第二焊盘邻近衬底的第二端并接触第一接合焊盘。 公开了相关的LED封装和形成LED封装的方法。