Abstract:
An electroless nickel plating bath comprising: i) a source of nickel ions; ii) an effective amount of thiourea; iii) an effective amount of saccharin; iv) a source of hypophosphite ions; v) one or more chelating agents; and vi) optionally, other additives and a method of using the same to provide a high phosphorus electroless nickel plating deposit on a substrate. The high phosphorus electroless nickel deposit is capable of passing an RCA nitric acid test, whereby the substrate with the high phosphorus nickel deposit thereon is immersed into concentrated nickel acid for 30 seconds and a deposit that does not turn black or grey is deemed to have passed the RCA nitric acid test.
Abstract:
A method of treating a substrate, wherein the substrate comprises a layer deposited from a trivalent chromium electrolyte, is described. The method includes the steps of providing an anode and the chromium (III) plated substrate as a cathode in an electrolyte comprising (i) a trivalent chromium salt; and (ii) a complexant; and passing an electrical current between the anode and the cathode to passivate the chromium (III) plated substrate. The substrate may be first plated with a plated nickel layer so that the chromium (III) plated layer is deposited over the nickel plated layer.
Abstract:
A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the ekctroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications and in manufacturing light emitting diodes (LEDs).
Abstract:
An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.
Abstract:
A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound, The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
Abstract:
A method of preparing an aluminum or aluminum alloy substrate to accept an adherent coating thereon is provided. The method includes the steps of degreasing the substrate, deoxidizing the substrate, and providing a prepaint conversion coating on the degreased and deoxidized substrate. The prepaint conversion coating composition comprises i) a source of fluoride ions; ii) a source of zirconium ions; iii) an acrylic resin; and iv) an optical brightener and forms a colorless, chromium-free conversion coating on the aluminum substrate that can be observed by exposing the treated substrate to UV light.
Abstract:
The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing agent is sodium persulfate, the one or more additives generally comprise an aliphatic saturated dicarboxylic acid. When the oxidizing agent is hydrogen peroxide, the one or more additives generally comprise a stabilizer and amino tris(methylene phosphonic acid).
Abstract:
The invention relates to a protective U.V. curable or photoimageable cover layer for an optical disk substrate and a method of applying the protective cover layer to an optical substrate. The U.V. curable or photoimageable layer is applied as a dry film and has high clarity and cures to a flexible, scratch resistant, non-shrinking film, which has good adhesion to the underlying substrate.
Abstract:
A method of preparing a plastic substrate to accept metal plating thereon is described. The method includes the steps of pretreating the plastic substrate by contacting the plastic substrate with an aqueous electrolyte comprising an organic salt to raise the surface energy of the plastic substrate. Thereafter, the plastic substrate can be etched and metal plated.
Abstract:
a method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive having the structure: Formula (I) wherein R, R', R" and R'" are either the same or are independently selected from the group consisting of benzyl, substituted benzyl, phenyl or substituted phenyl; or :Formula (II) wherein R, R', R" and R'" are either the same or are independently selected from C I - CI O alkyl (either straight or branched chain), benzyl, substituted benzyl, phenyl, or substituted phenyl and M is a divalent metal cation, preferably selected from the group consisting of nickel, copper and zinc; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non- conductive substrates for subsequent metallization steps.