公开(公告)号：WO2010059724A2

公开(公告)日：2010-05-27

申请号：PCT/US2009/064987

申请日：2009-11-18

Applicant: QUALCOMM INCORPORATED ,  PAN, Yuancheng, Christopher ,  SWEENEY, Fifin ,  PAYNTER, Charlie ,  BOWLES, Kevin, R. ,  GONZALEZ, Jason, R.

Inventor： PAN, Yuancheng, Christopher ,  SWEENEY, Fifin ,  PAYNTER, Charlie ,  BOWLES, Kevin, R. ,  GONZALEZ, Jason, R.

IPC: H01L23/498 ,  H01L23/50

CPC classification number: H01L23/49816 ,  H01L23/50 ,  H01L23/5222 ,  H01L23/5286 ,  H01L23/642 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package has a capacitor die and a packaging substrate. The capacitor die is coupled to circuitry on a front or back side of a die coupled to the packaging substrate for providing decoupling capacitance. In one example, the capacitor die is coupled to a land side of the packaging substrate in an area depopulated of a packaging array and adjacent to the packaging array. In another example, the capacitor die may be stacked on the die and coupled through wire bonds to circuitry on the die. The capacitor die reduces impedance of the integrated circuit allowing operation at higher frequencies.

Abstract translation: 半导体封装具有电容器裸片和封装衬底。 电容器管芯耦合到耦合到封装衬底的管芯的前侧或后侧上的电路，用于提供去耦电容。 在一个示例中，电容器裸片在包装阵列的填充区域中并且与封装阵列相邻的区域耦合到封装衬底的接地侧。 在另一示例中，电容器管芯可以堆叠在管芯上并且通过引线接合耦合到管芯上的电路。 电容器管芯降低了集成电路的阻抗，允许在较高频率下工作。

公开(公告)号：WO2010059724A3

公开(公告)日：2010-09-10

申请号：PCT/US2009064987

申请日：2009-11-18

Applicant: QUALCOMM INC ,  PAN YUANCHENG CHRISTOPHER ,  SWEENEY FIFIN ,  PAYNTER CHARLIE ,  BOWLES KEVIN R ,  GONZALEZ JASON R

Inventor： PAN YUANCHENG CHRISTOPHER ,  SWEENEY FIFIN ,  PAYNTER CHARLIE ,  BOWLES KEVIN R ,  GONZALEZ JASON R

IPC: H01L23/498 ,  H01L23/50 ,  H01L23/522 ,  H01L23/528

CPC classification number: H01L23/49816 ,  H01L23/50 ,  H01L23/5222 ,  H01L23/5286 ,  H01L23/642 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2924/00011 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package has a capacitor die and a packaging substrate. The capacitor die is coupled to circuitry on a front or back side of a die coupled to the packaging substrate for providing decoupling capacitance. In one example, the capacitor die is coupled to a land side of the packaging substrate in an area depopulated of a packaging array and adjacent to the packaging array. In another example, the capacitor die may be stacked on the die and coupled through wire bonds to circuitry on the die. The capacitor die reduces impedance of the integrated circuit allowing operation at higher frequencies.

Abstract translation: 半导体封装具有电容器芯片和封装衬底。 电容器裸片耦合到耦合到封装衬底的裸片的正面或背面上的电路以提供去耦电容。 在一个示例中，电容器管芯在封装阵列的不填充区域中并且与封装阵列相邻地耦合到封装衬底的焊盘侧。 在另一个示例中，电容器管芯可以堆叠在管芯上并且通过引线键合耦合到管芯上的电路。 电容器管芯降低了集成电路的阻抗，允许在更高的频率下工作。