中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

19 records (took 0.014 seconds)

    EDGE UNIFORMITY IMPROVEMENT IN PVD ARRAY COATERS
    2.
    发明申请
    EDGE UNIFORMITY IMPROVEMENT IN PVD ARRAY COATERS 审中-公开
    PVD阵列涂层的边缘均匀性改进

    公开(公告)号：WO2015158391A1

    公开(公告)日：2015-10-22

    申请号：PCT/EP2014/057920

    申请日：2014-04-17

    Applicant: APPLIED MATERIALS, INC. ,  SCHEER, Evelyn ,  BENDER, Marcus ,  PIERALISI, Fabio ,  SEVERIN, Daniel ,  LINDENBERG, Ralph ,  GÄRTNER, Harald

    Inventor： SCHEER, Evelyn ,  BENDER, Marcus ,  PIERALISI, Fabio ,  SEVERIN, Daniel ,  LINDENBERG, Ralph ,  GÄRTNER, Harald

    IPC: H01J37/34 ,  H01J37/32 ,  C23C14/00

    CPC classification number: H01J37/347 ,  C23C14/352 ,  C23C14/542 ,  C23C14/568 ,  H01J37/32385 ,  H01J37/32449 ,  H01J37/3405 ,  H01J37/3417 ,  H01J37/3464

    Abstract: An apparatus for deposition of material on a substrate is described. The apparatus includes a deposition array (222) having three or more cathodes (122), wherein the deposition array comprises a first outer deposition assembly (301) comprising at least a first cathode of the three or more cathodes; a second outer deposition assembly (302) opposing the first outer deposition assembly comprising at least a second cathode of the three or more cathodes, and an inner deposition assembly (303) comprising at least one inner cathode located between the first outer deposition assembly and the second outer deposition assembly. At least one of the first outer deposition assembly (301) and the second outer deposition assembly (302) is configured for depositing the material at a higher rate than the inner deposition assembly (303) on the same substrate during the same time.

    Abstract translation: 描述了用于在衬底上沉积材料的装置。 该装置包括具有三个或更多个阴极（122）的沉积阵列（222），其中沉积阵列包括包含三个或更多个阴极的至少第一阴极的第一外部沉积组件（301） 与第一外部沉积组件相对的第二外部沉积组件（302），其包括三个或更多个阴极的至少第二阴极，以及内部沉积组件（303），其包括位于第一外部沉积组件和第二外部沉积组件之间的至少一个内部阴极 第二外部沉积组件。 第一外部沉积组件（301）和第二外部沉积组件（302）中的至少一个被配置用于在相同的时间内以比内部沉积组件（303）更高的速率沉积材料。

    OPTICAL INSPECTION SYSTEM, PROCESSING SYSTEM FOR PROCESSING OF A MATERIAL ON A FLEXIBLE SUBSTRATE, AND METHODS OF INSPECTING A FLEXIBLE SUBSTRATE
    5.
    发明申请
    OPTICAL INSPECTION SYSTEM, PROCESSING SYSTEM FOR PROCESSING OF A MATERIAL ON A FLEXIBLE SUBSTRATE, AND METHODS OF INSPECTING A FLEXIBLE SUBSTRATE 审中-公开
    光学检测系统，柔性基板材料加工处理系统以及检测柔性基板的方法

    公开(公告)号：WO2017121490A1

    公开(公告)日：2017-07-20

    申请号：PCT/EP2016/050823

    申请日：2016-01-15

    Applicant: APPLIED MATERIALS, INC ,  PIERALISI, Fabio ,  RIES, Florian

    Inventor： PIERALISI, Fabio ,  RIES, Florian

    IPC: G01N21/89 ,  C23C14/54 ,  G01N21/86

    CPC classification number: G01N21/8901 ,  C23C14/547 ,  G01N21/8422 ,  G01N21/86 ,  G01N21/8914 ,  G01N21/896

    Abstract: According to one aspect of the present disclosure, an optical inspection system (100) for inspecting a flexible substrate (10) is provided. The system includes a substrate support (20) with an at least partially convex substrate support surface (22) configured to guide the substrate along a substrate transportation path (T), the substrate support being arranged on a first side (1) of the substrate transportation path; a light source (30) arranged on a second side (2) of the substrate transportation path and configured to direct a light beam through a portion of the substrate which is supported on and in contact with the convex substrate support surface; and a light detector (40) for conducting a transmission measurement of the substrate. According to a further aspect of the present disclosure, methods of inspecting a flexible substrate are provided.

    Abstract translation: 根据本公开的一个方面，提供了一种用于检查柔性基板（10）的光学检查系统（100）。 该系统包括具有至少部分凸起的衬底支撑表面（22）的衬底支撑件（20），该衬底支撑表面被配置为沿着衬底传送路径（T）引导衬底，该衬底支撑件被布置在衬底的第一侧面（1） 运输路径; 光源（30），布置在所述基板传送路径的第二侧（2）上，并被配置为引导光束通过支撑在所述凸起基板支撑表面上并与所述凸起基板支撑表面接触的所述基板的一部分; 和用于进行衬底的透射测量的光检测器（40）。 根据本公开的另一方面，提供了检查柔性基板的方法。

    APPARATUS AND METHOD FOR COATING A SUBSTRATE BY ROTARY TARGET ASSEMBLIES IN TWO COATING REGIONS
    6.
    发明申请
    APPARATUS AND METHOD FOR COATING A SUBSTRATE BY ROTARY TARGET ASSEMBLIES IN TWO COATING REGIONS 审中-公开
    用于通过两个涂层区域中的旋转靶组件涂覆基板的装置和方法

    公开(公告)号：WO2015172835A1

    公开(公告)日：2015-11-19

    申请号：PCT/EP2014/059975

    申请日：2014-05-15

    Applicant: APPLIED MATERIALS, INC. ,  BENDER, Marcus ,  PIERALISI, Fabio ,  SCHEER, Evelyn ,  SEVERIN, Daniel ,  GÄRTNER, Harald ,  LINDENBERG, Ralph

    Inventor： BENDER, Marcus ,  PIERALISI, Fabio ,  SCHEER, Evelyn ,  SEVERIN, Daniel ,  GÄRTNER, Harald ,  LINDENBERG, Ralph

    IPC: C23C14/22 ,  C23C14/35 ,  C23C14/56 ,  H01J37/34

    CPC classification number: C23C14/225 ,  C23C14/352 ,  C23C14/568 ,  H01J37/32733 ,  H01J37/3405 ,  H01J37/3417 ,  H01J37/3429 ,  H01J37/345 ,  H01J37/3452

    Abstract: According to an embodiment, a sputter deposition apparatus for coating a substrate is provided. The sputter deposition apparatus has two or more coating regions for coating the substrate. The sputter deposition apparatus includes a first substrate guiding system for guiding the substrate in a first coating region, wherein the first substrate guiding system defines a first substrate transport direction. The sputter deposition apparatus further includes a second substrate guiding system for guiding the substrate in a second coating region, the second substrate guiding system defining a second substrate transport direction. The second substrate transport direction is the same direction as the first substrate transport direction or is different from the first substrate transport direction. The sputter deposition apparatus further includes a first cathode assembly adapted for generating one or more plasma regions in the first coating region, a second cathode assembly adapted for generating one or more plasma regions in the first coating region, a third cathode assembly adapted for generating one or more plasma regions in the second coating region, and a fourth cathode assembly adapted for generating one or more plasma regions in the second coating region. The first cathode assembly includes: a first rotary target assembly adapted for rotating a target material around a first rotation axis; and a first magnet assembly fixedly positioned in the first rotary target assembly, the first magnet assembly having a first principal plane forming a first angle with a first reference plane which contains the first rotation axis and is perpendicular to the first substrate transport direction. The second cathode assembly includes: a second rotary target assembly adapted for rotating a target material around a second rotation axis; and a second magnet assembly fixedly positioned in the second rotary target assembly, the second magnet assembly having a second principal plane, the second principal plane being parallel to the first principal plane. The third cathode assembly includes: a third rotary target assembly adapted for rotating a target material around a third rotation axis; and a third magnet assembly fixedly positioned in the third rotary target assembly, the third magnet assembly having a third principal plane forming a second angle with a second reference plane which contains the third rotation axis and is perpendicular to the second substrate transport direction, wherein the second angle is different from the first angle. The fourth cathode assembly includes: a fourth rotary target assembly adapted for rotating a target material around a fourth rotation axis; and a fourth magnet assembly fixedly positioned in the fourth rotary target assembly, the fourth magnet assembly having a fourth principal plane, the fourth principal plane being parallel to the third principal plane.

    Abstract translation: 根据实施例，提供了一种用于涂覆基板的溅射沉积设备。 溅射沉积装置具有用于涂覆基板的两个或更多个涂覆区域。 溅射沉积设备包括用于在第一涂覆区域中引导衬底的第一衬底引导系统，其中第一衬底引导系统限定第一衬底输送方向。 溅射沉积设备还包括用于在第二涂覆区域中引导衬底的第二衬底引导系统，第二衬底引导系统限定第二衬底输送方向。 第二基板输送方向与第一基板输送方向相同，也可以不同于第一基板输送方向。 溅射沉积设备还包括适于在第一涂覆区域中产生一个或多个等离子体区域的第一阴极组件，适于在第一涂覆区域中产生一个或多个等离子体区域的第二阴极组件，适于产生一个 或更多的等离子体区域，以及适于在第二涂覆区域中产生一个或多个等离子体区域的第四阴极组件。 第一阴极组件包括：适于围绕第一旋转轴线旋转目标材料的第一旋转靶组件; 以及固定地定位在所述第一旋转靶组件中的第一磁体组件，所述第一磁体组件具有与包含所述第一旋转轴线且垂直于所述第一衬底输送方向的第一参考平面形成第一角度的第一主平面。 第二阴极组件包括：适于围绕第二旋转轴线转动目标材料的第二旋转靶组件; 以及固定地定位在所述第二旋转靶组件中的第二磁体组件，所述第二磁体组件具有第二主平面，所述第二主平面平行于所述第一主平面。 第三阴极组件包括：适于围绕第三旋转轴线转动目标材料的第三旋转靶组件; 以及固定地定位在所述第三旋转靶组件中的第三磁体组件，所述第三磁体组件具有第三主平面，所述第三主平面与包含所述第三旋转轴线且垂直于所述第二基板输送方向的第二参考平面形成第二角度，其中， 第二角度与第一角度不同。 第四阴极组件包括：适于围绕第四旋转轴线旋转目标材料的第四旋转靶组件; 以及固定地定位在所述第四旋转靶组件中的第四磁体组件，所述第四磁体组件具有第四主平面，所述第四主平面平行于所述第三主平面。

    ADJUSTABLE MASK
    7.
    发明申请
    ADJUSTABLE MASK 审中-公开
    可调面膜

    公开(公告)号：WO2013020589A1

    公开(公告)日：2013-02-14

    申请号：PCT/EP2011/063714

    申请日：2011-08-09

    Applicant: APPLIED MATERIALS, INC. ,  SCHEER, Evelyn ,  HANIKA, Markus ,  LINDENBERG, Ralph ,  BENDER, Marcus ,  LOPP, Andreas ,  SCHWANITZ, Konrad ,  PIERALISI, Fabio ,  LIU, Jian

    Inventor： SCHEER, Evelyn ,  HANIKA, Markus ,  LINDENBERG, Ralph ,  BENDER, Marcus ,  LOPP, Andreas ,  SCHWANITZ, Konrad ,  PIERALISI, Fabio ,  LIU, Jian

    IPC: C23C14/04 ,  C23C16/04

    CPC classification number: C23C14/042 ,  C23C16/042

    Abstract: An deposition apparatus for forming a deposition material layer on a substrate is described. The deposition apparatus includes a substrate support adapted for holding a substrate; and an edge (660) exclusion mask (640) for covering a periphery of the substrate (610) during layer deposition. The mask has at least one frame portion defining an aperture. The at least one frame portion of the mask is adapted for being moved (670,680) with respect to the substrate depending on the amount of deposition material deposited on the at least one frame portion of the mask. Further, a method for depositing a deposition material layer on a substrate using an edge exclusion mask is described.

    Abstract translation: 描述了用于在基板上形成沉积材料层的沉积装置。 沉积设备包括适于保持衬底的衬底支撑件; 以及用于在层沉积期间覆盖衬底（610）的周边的边缘（660）排除掩模（640）。 掩模具有限定孔的至少一个框架部分。 掩模的至少一个框架部分适于相对于基板移动（670,680），这取决于沉积在掩模的至少一个框架部分上的沉积材料的量。 此外，描述了使用边缘排除掩模在基板上沉积沉积材料层的方法。

    METHOD FOR DEPOSITING A THIN FILM ELECTRODE AND THIN FILM STACK
    8.
    发明申请
    METHOD FOR DEPOSITING A THIN FILM ELECTRODE AND THIN FILM STACK 审中-公开
    沉积薄膜电极和薄膜堆叠的方法

    公开(公告)号：WO2012055728A1

    公开(公告)日：2012-05-03

    申请号：PCT/EP2011/068191

    申请日：2011-10-18

    Applicant: APPLIED MATERIALS, INC. ,  PIERALISI, Fabio

    Inventor： PIERALISI, Fabio

    IPC: H01L29/45 ,  H01L29/786

    CPC classification number: H01L29/45 ,  H01L29/78618 ,  H01L29/7869

    Abstract: A method for depositing at least one thin-film electrode (402, 403) onto a transparent conductive oxide film (405) is provided. At first, the transparent conductive oxide film (405) is deposited onto a substrate (101) to be processed. Then, the substrate (101) and the transparent conductive oxide film (405) are subjected to a processing environment containing a processing gas (207) acting as a donor material or an acceptor material with respect to the transparent conductive oxide film (405). The at least one thin-film electrode (402, 403) is deposited onto at least portions of the transparent conductive oxide film (405). A partial pressure of the processing gas (207) acting as the donor material or the acceptor material with respect to the transparent conductive oxide film (405) is varied while depositing the at least one thin-film electrode (402, 403) onto at least portions of the transparent conductive oxide film (405). Thus, a modified transparent conductive oxide film (410) having reduced interface resistance (408) and bulk resistance (409') can be obtained.

    Abstract translation: 提供了一种用于将至少一个薄膜电极（402,403）沉积到透明导电氧化膜（405）上的方法。 首先，将透明导电氧化物膜（405）沉积在待加工的基板（101）上。 然后，将基板（101）和透明导电氧化膜（405）进行处理环境，该处理环境含有相对于透明导电氧化物膜（405）作为施主材料或受主材料的处理气体（207）。 所述至少一个薄膜电极（402,403）沉积在所述透明导电氧化物膜（405）的至少一部分上。 在将至少一个薄膜电极（402,403）沉积到至少一个薄膜电极（402,403）上之后，改变用作施主材料或受体材料的处理气体（207）相对于透明导电氧化物膜（405）的分压 部分透明导电氧化物膜（405）。 因此，可以获得具有降低的界面电阻（408）和体电阻（409'）的改性的透明导电氧化物膜（410）。

    METHOD FOR COATING A SUBSTRATE AND COATER
    9.
    发明申请
    METHOD FOR COATING A SUBSTRATE AND COATER 审中-公开
    涂层和涂层的方法

    公开(公告)号：WO2011039316A1

    公开(公告)日：2011-04-07

    申请号：PCT/EP2010/064574

    申请日：2010-09-30

    Applicant: APPLIED MATERIALS, INC. ,  BENDER, Marcus ,  HANIKA, Markus ,  SCHEER, Evelyn ,  PIERALISI, Fabio ,  MAHNKE, Guido

    Inventor： BENDER, Marcus ,  HANIKA, Markus ,  SCHEER, Evelyn ,  PIERALISI, Fabio ,  MAHNKE, Guido

    IPC: H01J37/34

    CPC classification number: H01J37/3405 ,  H01J37/3452 ,  H01J37/3455

    Abstract: A method is provided for coating a substrate (100) with a cathode assembly (10) having a rotatable target (20). The rotatable target has at least one magnet assembly (25) positioned there within. The method includes positioning the magnet assembly at a first position so that it is asymmetrically aligned with respect to a plane (22) perpendicularly extending from the substrate (100) to the axis (21) of the rotatable target for a predetermined first time interval; positioning the magnet assembly at a second position that is asymmetrically aligned with respect to said plane (22) for a predetermined second time interval; and providing a voltage to the rotatable target that is varied over time during coating. Further, a coater is provided that includes a cathode assembly with a rotatable curved target; and two magnet assemblies positioned within the rotatable curved target wherein the distance between the two magnet assemblies can be varied.

    Abstract translation: 提供了一种用具有可旋转靶（20）的阴极组件（10）涂覆基底（100）的方法。 可旋转靶具有定位在其内的至少一个磁体组件（25）。 该方法包括将磁体组件定位在第一位置，使得其相对于从基板（100）垂直延伸到可旋转靶的轴线（21）的平面（22）以预定的第一时间间隔对准地对准; 将磁体组件定位在相对于所述平面（22）不对称对准预定的第二时间间隔的第二位置处; 以及向涂覆期间随时间变化的可旋转靶提供电压。 此外，提供一种包括具有可旋转弯曲目标的阴极组件的涂布机; 以及位于可旋转弯曲目标内的两个磁体组件，其中两个磁体组件之间的距离可以改变。

Patent Agency Ranking