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    AN APPARATUS AND METHOD FOR DICING AN IC SUBSTRATE
    1.
    发明申请
    AN APPARATUS AND METHOD FOR DICING AN IC SUBSTRATE 审中-公开
    一种用于定位IC基板的装置和方法

    公开(公告)号：WO2009035419A2

    公开(公告)日：2009-03-19

    申请号：PCT/SG2008/000346

    申请日：2008-09-12

    Applicant: ROKKO VENTURES PTE LTD ,  YANG, Hae Choon ,  SHIN, Yun Suk

    Inventor： YANG, Hae Choon ,  SHIN, Yun Suk

    IPC: B28D5/02 ,  H01L21/00 ,  H01L21/304

    CPC classification number: B28D5/0082

    Abstract: An apparatus (5) for dicing an integrated circuit substrate having a loader (30) for loading the substrate to the apparatus, said substrate loaded in a first direction corresponding to a loading axis, an inlet rail (35) said inlet rail including a first block (75) movable along said inlet rail (35) to which is loaded the substrate from said loader, wherein said inlet rail is arranged to deliver the first block (75) and substrate towards a chuck table (60) in a second direction orthogonal to the loading axis.

    Abstract translation: 一种用于对集成电路基板进行切割的设备（5），所述集成电路基板具有用于将所述基板装载到所述装置的装载器（30），所述基板沿对应于加载轴线的第一方向装载，所述入口轨道（35）包括第一 沿着所述入口轨道（35）移动的块（75），从所述入口轨道（35）向所述入口轨道（35）移动，所述入口轨道布置成沿第二方向正交地将第一块（75）和衬底朝着卡盘台 到加载轴。

    SYSTEM AND METHOD FOR OFFLOADING IC UNITS
    2.
    发明申请
    SYSTEM AND METHOD FOR OFFLOADING IC UNITS 审中-公开
    用于卸载IC单元的系统和方法

    公开(公告)号：WO2012050524A1

    公开(公告)日：2012-04-19

    申请号：PCT/SG2011/000267

    申请日：2011-07-26

    Applicant: ROKKO VENTURES PTE LTD ,  YANG, Hae Choon ,  JANG, Deok Chun

    Inventor： YANG, Hae Choon ,  JANG, Deok Chun

    IPC: H01L21/67

    CPC classification number: H01L21/67766 ,  H01L21/67333 ,  H01L21/67721 ,  H01L21/67778

    Abstract: A shuttle table assembly comprising a shuttle table for receiving a plurality of IC units at a first position and for offloading said units at a second position, said shuttle table movable from said first to second position; a cover assembly mounted to said shuttle table, the cover assembly having at least one cover movable from an open position to a closed position, said closed position covering said units on the shuttle table; wherein the cover assembly is coupled to a guide for closing the cover as the shuttle table moves from the first to the second position.

    Abstract translation: 一种梭床组件，包括用于在第一位置处接纳多个IC单元并在第二位置卸载所述单元的梭床，所述梭台可从所述第一位置移动到第二位置; 安装到所述梭台的盖组件，所述盖组件具有至少一个可从打开位置移动到关闭位置的盖，所述关闭位置覆盖所述穿梭台上的所述单元; 其中当所述梭台从所述第一位置移动到所述第二位置时，所述盖组件联接到导向件以关闭所述盖。

    PUNCH SINGULATION SYSTEM AND METHOD
    4.
    发明申请
    PUNCH SINGULATION SYSTEM AND METHOD 审中-公开
    PUNCH SINGULATION系统和方法

    公开(公告)号：WO2011037543A1

    公开(公告)日：2011-03-31

    申请号：PCT/SG2010/000360

    申请日：2010-09-24

    Applicant: ROKKO TECHNOLOGY PTE LTD. ,  YANG, Hae Choon ,  SHEN, Xue Fang ,  JANG, Deok Chun ,  LIM, Chong Chen, Gary ,  LIM, Siok Chun ,  SHIN, Yun Suk

    Inventor： YANG, Hae Choon ,  SHEN, Xue Fang ,  JANG, Deok Chun ,  LIM, Chong Chen, Gary ,  LIM, Siok Chun ,  SHIN, Yun Suk

    IPC: H01L21/78 ,  H01L21/677 ,  B21D28/00 ,  H01L21/68

    CPC classification number: H01L21/67092 ,  H01L21/67132 ,  Y10T83/647 ,  Y10T83/6572

    Abstract: A punching system for singulating IC units comprising: a punching assembly arranged to receive a substrate and singulate said substrate into the IC units; a rotary carrier rotatable from a first position to a second position said rotary carrier arranged to receive said units at the first position and carry said units to the second position through rotation; wherein said rotary carrier includes recesses for receiving at least a portion of the units. A punching assembly comprising a die block having recesses for receiving selectively replaceable inserts wherein said inserts correspond to a punch pattern specific to a predetermined IC package arrangement.

    Abstract translation: 一种用于分离IC单元的冲压系统，包括：冲压组件，布置成接收衬底并将所述衬底分离成IC单元; 旋转载体，可从第一位置旋转到第二位置，所述旋转载体布置成在第一位置处接收所述单元，并通过旋转将所述单元运送到第二位置; 其中所述旋转载体包括用于容纳所述单元的至少一部分的凹部。 一种冲压组件，其包括具有用于接收可选择性地替换的插入件的凹部的模具块，其中所述插入件对应于特定于预定IC封装布置的冲压模式。

    SUPPLY MECHANISM FOR THE CHUCK OF AN INTEGRATED CIRCUIT DICING DEVICE
    5.
    发明申请
    SUPPLY MECHANISM FOR THE CHUCK OF AN INTEGRATED CIRCUIT DICING DEVICE 审中-公开
    集成电路设备的提供机制

    公开(公告)号：WO2006022597A2

    公开(公告)日：2006-03-02

    申请号：PCT/SG2005/000288

    申请日：2005-08-23

    Applicant: ROKKO SYSTEMS PTE LTD ,  YANG, Hae Choon

    Inventor： YANG, Hae Choon

    IPC: H01L21/304 ,  H01L21/677 ,  B28D5/02

    CPC classification number: H01L21/67144 ,  B28D5/0082 ,  B28D5/0094 ,  H01L21/67092 ,  H01L21/78

    Abstract: A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).

    Abstract translation: 用于切割基板以对其内的集成电路单元进行切割的系统包括与卡盘台（4）一起操作的切割机（Z）。 提升组件（Ax，Ay）基本上同时从基板（4）移除先前分离的单元的同时将衬底分离到卡盘台（4）上。

    SYSTEM AND METHOD FOR ENGAGING SINGULATED SUBTRATES
    7.
    发明申请
    SYSTEM AND METHOD FOR ENGAGING SINGULATED SUBTRATES 审中-公开
    用于接合复合物的系统和方法

    公开(公告)号：WO2010053451A2

    公开(公告)日：2010-05-14

    申请号：PCT/SG2009/000406

    申请日：2009-11-04

    Applicant: ROKKO SYSTEMS PTE LTD ,  BAEK, Seung Ho ,  JUNG, Jong Jae ,  YANG, Hae Choon

    Inventor： BAEK, Seung Ho ,  JUNG, Jong Jae ,  YANG, Hae Choon

    IPC: H01L21/00 ,  H01L21/67 ,  H01L21/677 ,  H01L21/683

    CPC classification number: H05K13/0408 ,  H01L21/6838 ,  H01L24/74 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14

    Abstract: A unit picker assembly for engaging singulated IC units, the assembly comprising; a plurality of unit pickers, each unit picker having an engagement end for engagement of an IC unit; each of said unit pickers movably mounted to permit movement from a retracted position to a unit engagement position; an actuator assembly arranged to move to a plurality of actuating positions, each of said positions corresponding to one of said unit pickers from the retracted position to the unit engagement position; wherein whilst in any of said actuating positions the actuator assembly is arranged to move the corresponding unit picker from the retracted position to the engagement position.

    Abstract translation: 一种用于接合单个IC单元的单元选择器组件，该组件包括： 多个单元选择器，每个单元选择器具有用于IC单元接合的接合端; 每个所述单元选择器可移动地安装以允许从缩回位置移动到单元接合位置; 致动器组件布置成移动到多个致动位置，每个所述位置对应于所述单元拾取器中的一个从缩回位置到单元接合位置; 其中在所述致动位置中的任何一个中，所述致动器组件布置成使所述对应的单元拾取器从所述缩回位置移动到所述接合位置。

    VACUUM HOLDER FOR INTEGRATED CIRCUIT UNITS
    8.
    发明申请
    VACUUM HOLDER FOR INTEGRATED CIRCUIT UNITS 审中-公开
    集成电路单元的真空支架

    公开(公告)号：WO2006036126A1

    公开(公告)日：2006-04-06

    申请号：PCT/SG2005/000240

    申请日：2005-07-19

    Applicant: ROKKO SYSTEMS PTE LTD ,  YANG, Hae Choon

    Inventor： YANG, Hae Choon

    IPC: H01L21/00

    CPC classification number: H01L21/67333 ,  B25B11/005 ,  H01L21/67336 ,  Y10T279/11

    Abstract: A support device for supporting a set of integrated circuit units (65), the device comprising: a support member having a metal surface, said surface having an array of recesses (27); a soft material layer, overlaying the recesses of the metal surface so as to protect the units (65) from damage caused by contact with the metal surface, and; a vacuum means (35) in communication with said recesses (27), such that the vacuum means supports each unit within a respective recess, wherein the soft material layer is formed of a plurality of independent inserts (40), each insert engageable with at least one recess using engagement means (50, 55) for engaging each insert (40) with the at least one recess (27).

    Abstract translation: 一种用于支撑一组集成电路单元（65）的支撑装置，所述装置包括：具有金属表面的支撑构件，所述表面具有凹槽阵列（27）; 软材料层，覆盖金属表面的凹部，以保护单元（65）免受与金属表面接触所造成的损害; 与所述凹部（27）连通的真空装置（35），使得所述真空装置支撑相应凹部内的每个单元，其中所述软材料层由多个独立的插入件（40）形成，每个插入件可接合于 至少一个凹部，其使用用于使每个插入件（40）与所述至少一个凹部（27）接合的接合装置（50,55）。

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