公开(公告)号：WO2009035419A3

公开(公告)日：2010-10-14

申请号：PCT/SG2008000346

申请日：2008-09-12

Applicant: ROKKO VENTURES PTE LTD ,  YANG HAE CHOON ,  SHIN YUN SUK

Inventor： YANG HAE CHOON ,  SHIN YUN SUK

IPC: B28D5/00 ,  H01L21/00 ,  H01L21/677

CPC classification number: B28D5/0082

Abstract: An apparatus (5) for dicing an integrated circuit substrate having a loader (30) for loading the substrate to the apparatus, said substrate loaded in a first direction corresponding to a loading axis, an inlet rail (35) said inlet rail including a first block (75) movable along said inlet rail (35) to which is loaded the substrate from said loader, wherein said inlet rail is arranged to deliver the first block (75) and substrate towards a chuck table (60) in a second direction orthogonal to the loading axis.

Abstract translation: 一种用于对集成电路基板进行切割的设备（5），所述集成电路基板具有用于将所述基板装载到所述装置的装载器（30），所述基板沿对应于加载轴线的第一方向装载，所述入口轨道（35）包括第一 沿着所述入口轨道（35）移动的块（75），从所述入口轨道（35）向所述入口轨道（35）移动，所述入口轨道布置成沿第二方向正交地将第一块（75）和衬底朝着卡盘台 到加载轴。

公开(公告)号：WO2010071609A2

公开(公告)日：2010-06-24

申请号：PCT/SG2009000484

申请日：2009-12-17

Applicant: ROKKO VENTURES PTE LTD ,  YANG HAE CHOON

Inventor： YANG HAE CHOON

IPC: H01L21/66

CPC classification number: H01L21/67271 ,  H01L22/12 ,  H01L22/20

Abstract: A system for processing a substrate comprising a loading station for receiving the substrate; a bottom surface inspection station for inspecting the bottom surface of the substrate; a top surface inspection station for inspecting the top surface of the substrate and; a sorting station for sorting the substrate into a predetermined category based upon the bottom surface inspection and top surface inspection.

Abstract translation: 一种用于处理衬底的系统，包括用于接收衬底的装载站; 用于检查基板的底面的底面检查台; 用于检查衬底的顶表面的顶表面检查站; 分选站，用于基于底面检查和顶面检查将基板分类为预定类别。

公开(公告)号：WO2011068478A1

公开(公告)日：2011-06-09

申请号：PCT/SG2010000447

申请日：2010-11-30

Applicant: ROKKO SYSTEMS PTE LTD ,  JUNG JONG JAE ,  SHIN YUN SUK ,  YANG HAE CHOON ,  JANG DEOK CHUN

Inventor： JUNG JONG JAE ,  SHIN YUN SUK ,  YANG HAE CHOON ,  JANG DEOK CHUN

IPC: H01L21/66 ,  B07C5/02 ,  B07C5/34 ,  H01L21/67

CPC classification number: H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for inspecting and sorting a plurality of IC units comprising the steps of: delivering a frame containing said IC units to a unit picking station; conducting a first inspection of said units during the delivering step and recording the subsequent result; removing said units from the frame, and moving said units from the unit picking station to a flipping station; conducting a second inspection of said units during the moving step and recording the subsequent result; flipping said units to expose an opposed face said units; conducting a third inspection of said opposed face and recording the subsequent result, then; sorting said units into categories based on the recorded results from the first, second and third inspecting steps.

Abstract translation: 一种用于检查和分类多个IC单元的方法，包括以下步骤：将包含所述IC单元的框架传送到单元拾取工位; 在递送步骤期间对所述单元进行第一次检查并记录后续结果; 从框架中取出所述单元，并将所述单元从单元拾取工位移动到翻转工位; 在移动步骤期间对所述单元进行第二次检查并记录后续结果; 翻转所述单元以暴露所述单元的相对面; 然后对所述相对面进行第三次检查并记录后续结果; 根据第一，第二和第三检查步骤的记录结果将所述单元分类成类别。

公开(公告)号：WO2010053451A3

公开(公告)日：2013-02-28

申请号：PCT/SG2009000406

申请日：2009-11-04

Applicant: ROKKO SYSTEMS PTE LTD ,  BAEK SEUNG HO ,  JUNG JONG JAE ,  YANG HAE CHOON

Inventor： BAEK SEUNG HO ,  JUNG JONG JAE ,  YANG HAE CHOON

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H05K13/0408 ,  H01L21/6838 ,  H01L24/74 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14

Abstract: A unit picker assembly for engaging singulated IC units, the assembly comprising; a plurality of unit pickers, each unit picker having an engagement end for engagement of an IC unit; each of said unit pickers movably mounted to permit movement from a retracted position to a unit engagement position; an actuator assembly arranged to move to a plurality of actuating positions, each of said positions corresponding to one of said unit pickers from the retracted position to the unit engagement position; wherein whilst in any of said actuating positions the actuator assembly is arranged to move the corresponding unit picker from the retracted position to the engagement position.

Abstract translation: 一种用于接合单个IC单元的单元选择器组件，该组件包括： 多个单元选择器，每个单元选择器具有用于IC单元接合的接合端; 每个所述单元选择器可移动地安装以允许从缩回位置移动到单元接合位置; 致动器组件布置成移动到多个致动位置，每个所述位置对应于所述单元拾取器中的一个从缩回位置到单元接合位置; 其中在所述致动位置中的任何一个中，所述致动器组件布置成使所述对应的单元拾取器从所述缩回位置移动到所述接合位置。

公开(公告)号：WO2009096904A3

公开(公告)日：2011-05-26

申请号：PCT/SG2009000036

申请日：2009-01-30

Applicant: ROKKO MECHATRONICS PTE LTD ,  YANG HAE CHOON

Inventor： YANG HAE CHOON

IPC: H01L21/301 ,  H01L21/66

CPC classification number: H01L22/20

Abstract: A method for processing a plurality of IC units (87) comprising the steps of: inspecting said units (87) at a first inspection station (90); moving said IC units (87) along a linearly defined path to a second inspection station (115); inspecting the units (87) at said second inspection station (115); flipping said units; inspecting the units (87) at said third inspection station (125), and; sorting said units into pre-defined categories.

Abstract translation: 一种用于处理多个IC单元（87）的方法，包括以下步骤：在第一检验站（90）检查所述单元（87）; 沿着线性限定的路径将所述IC单元（87）移动到第二检查站（115）; 在所述第二检查站（115）检查所述单元（87）; 翻转单位; 检查所述第三检查站（125）的单元（87）; 将所述单元分类为预定义的类别。

公开(公告)号：WO2006022597A3

公开(公告)日：2006-08-31

申请号：PCT/SG2005000288

申请日：2005-08-23

Applicant: ROKKO SYSTEMS PTE LTD ,  YANG HAE CHOON

Inventor： YANG HAE CHOON

IPC: H01L21/304 ,  B28D5/02 ,  H01L21/673 ,  H01L21/677

CPC classification number: H01L21/67144 ,  B28D5/0082 ,  B28D5/0094 ,  H01L21/67092 ,  H01L21/78

Abstract: A system for dicing substrates to singulate integrated circuit units includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax, Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4). Also disclosed is a support device fixing the diced chips by vacuum to an insert of a soft material.

Abstract translation: 用于切割基板以划分集成电路单元的系统包括用卡盘台（4）操作的切割机（Z）。 提升组件（Ax，Ay）基本上同时从基板（4）移除先前分离的单元的同时将衬底分离到卡盘台（4）上。 还公开了一种支撑装置，其通过真空将切割的芯片固定到软材料的插入件上。